Recent Insider Transactions Derivative • 16h
CEO, President & Chairman notifies of intention to sell stock Sanjay Mehrotra intends to sell 40k shares in the next 90 days after lodging an Intent To Sell Form on the 29th of May. If the sale is conducted around the recent share price of US$961, it would amount to US$38m. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since June 2025, Sanjay's direct individual holding has decreased from 1.05m shares to 1.03m. Company insiders have collectively sold US$146m more than they bought, via options and on-market transactions in the last 12 months. Price Target Changed • May 28
Price target increased by 9.8% to US$674 Up from US$614, the current price target is an average from 40 analysts. New target price is 27% below last closing price of US$924. Stock is up 854% over the past year. The company is forecast to post earnings per share of US$58.93 for next year compared to US$7.65 last year. 공시 • May 28
Micron Technology, Inc. to Report Q3, 2026 Results on Jun 24, 2026 Micron Technology, Inc. announced that they will report Q3, 2026 results on Jun 24, 2026 Price Target Changed • May 26
Price target increased by 12% to US$640 Up from US$574, the current price target is an average from 40 analysts. New target price is 29% below last closing price of US$896. Stock is up 830% over the past year. The company is forecast to post earnings per share of US$58.76 for next year compared to US$7.65 last year. Valuation Update With 7 Day Price Move • May 26
Investor sentiment improves as stock rises 28% After last week's 28% share price gain to US$896, the stock trades at a forward P/E ratio of 11x. Average forward P/E is 31x in the Semiconductor industry in the US. Total returns to shareholders of 1,166% over the past three years. 속보 • May 25
Micron Technology Sees Supply Sold Out Through 2027 as AI Chip Demand Stays Elevated Micron continues to benefit from intense AI-driven demand, with its high-bandwidth memory (HBM) capacity reportedly pre-sold through at least 2026 and, in some reports, sold out through 2027 under long-term contracts with major cloud providers.
The company has begun producing advanced 1α DRAM in Virginia as part of a planned US$100b to US$200b U.S. expansion, targeting 40% of DRAM output domestically and supporting critical sectors such as automotive, defense and industrial.
Analysts have sharply raised price targets, with some citing very large projected EPS growth and high gross margin expectations, while also flagging the cyclical risk of a future memory downcycle and valuation concerns after very large stock gains.
The key theme running through the news is tight supply meeting heavy AI-related demand. This is giving Micron strong pricing power, long-term contract visibility and support from policymakers focused on domestic chip capacity.
At the same time, you need to weigh that optimism against classic memory-cycle risks, including potential future supply normalization, high capital spending commitments and the possibility that sentiment could reverse quickly if DRAM and HBM pricing or data center orders start to soften. New Risk • May 25
New minor risk - Share price stability The company's share price has been volatile over the past 3 months. It is more volatile than 75% of American stocks, typically moving 11% a week. This is considered a minor risk. Share price volatility indicates the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. It also increases the risk of potential losses in the short term as the stock tends to have larger drops in price more frequently than other stocks. Currently, the following risks have been identified for the company: Major Risk High level of non-cash earnings (24% accrual ratio). Minor Risks Share price has been volatile over the past 3 months (11% average weekly change). Significant insider selling over the past 3 months (US$19m sold). Price Target Changed • May 19
Price target increased by 10% to US$613 Up from US$556, the current price target is an average from 41 analysts. New target price is 10% below last closing price of US$682. Stock is up 591% over the past year. The company is forecast to post earnings per share of US$58.76 for next year compared to US$7.65 last year. Recent Insider Transactions • May 17
Independent Director recently sold US$1.6m worth of stock On the 11th of May, Steven Gomo sold around 2k shares on-market at roughly US$787 per share. This transaction amounted to 10% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth US$10m. Insiders have been net sellers, collectively disposing of US$59m more than they bought in the last 12 months. 공시 • May 14
Micron Technology, Inc. Samples 256GB DDR5 Server Module Micron Technology, Inc. announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company’s 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production. Micron’s module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron’s 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256GB module can reduce operating power by more than 40% versus two 128GB modules, enabling greater efficiency for modern AI data centers. Micron is collaborating with key ecosystem enablers to validate the 256GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale. The rapid proliferation of large language models (LLMs), agentic AI, real-time inference and high-core-count CPU workloads is driving an urgent need for greater enterprise server memory capacity, higher bandwidth and improved power efficiency. Micron’s 256GB DDR5 RDIMM addresses these growing requirements head-on, enabling server architects, hyperscale operators and platform partners to maximize memory capacity per socket while operating within the thermal and power boundaries of modern data center infrastructure. Micron’s 1 gamma-based 256GB DDR5 RDIMM is currently sampling to key server ecosystem enablers for platform validation. Valuation Update With 7 Day Price Move • May 11
Investor sentiment improves as stock rises 38% After last week's 38% share price gain to US$795, the stock trades at a forward P/E ratio of 10x. Average forward P/E is 34x in the Semiconductor industry in the US. Total returns to shareholders of 1,146% over the past three years. Recent Insider Transactions • May 07
Senior VP recently sold US$4.1m worth of stock On the 1st of May, Michael Ray sold around 8k shares on-market at roughly US$534 per share. This transaction amounted to 10% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth US$10m. Insiders have been net sellers, collectively disposing of US$57m more than they bought in the last 12 months. Recent Insider Transactions Derivative • May 03
CEO, President & Chairman notifies of intention to sell stock Sanjay Mehrotra intends to sell 40k shares in the next 90 days after lodging an Intent To Sell Form on the 1st of May. If the sale is conducted around the recent share price of US$536, it would amount to US$21m. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since June 2025, Sanjay's direct individual holding has increased from 1.05m shares to 1.07m. Company insiders have collectively sold US$140m more than they bought, via options and on-market transactions in the last 12 months. Valuation Update With 7 Day Price Move • Apr 27
Investor sentiment improves as stock rises 17% After last week's 17% share price gain to US$525, the stock trades at a forward P/E ratio of 7x. Average forward P/E is 35x in the Semiconductor industry in the US. Total returns to shareholders of 752% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$276 per share. Recent Insider Transactions • Apr 15
Executive VP of Worldwide Sales recently sold US$1.4m worth of stock On the 9th of April, Michael Cordano sold around 3k shares on-market at roughly US$421 per share. This transaction amounted to 6.7% of their direct individual holding at the time of the trade. In the last 3 months, there was an even bigger sale from another insider worth US$11m. Insiders have been net sellers, collectively disposing of US$42m more than they bought in the last 12 months. Recent Insider Transactions Derivative • Apr 13
Executive VP & Chief Business Officer notifies of intention to sell stock Sumit Sadana intends to sell 24k shares in the next 90 days after lodging an Intent To Sell Form on the 10th of April. If the sale is conducted around the recent share price of US$421, it would amount to US$10m. Since June 2025, Sumit's direct individual holding has increased from 201.33k shares to 248.02k. Company insiders have collectively sold US$127m more than they bought, via options and on-market transactions in the last 12 months. Valuation Update With 7 Day Price Move • Apr 09
Investor sentiment improves as stock rises 15% After last week's 15% share price gain to US$422, the stock trades at a forward P/E ratio of 6x. Average forward P/E is 24x in the Semiconductor industry in the US. Total returns to shareholders of 578% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$273 per share. Buy Or Sell Opportunity • Mar 31
Now 24% overvalued after recent price rise Over the last 90 days, the stock has risen 18% to US$338. The fair value is estimated to be US$273, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has grown by 39% over the last 3 years. Earnings per share has grown by 113%. For the next 3 years, revenue is forecast to grow by 23% per annum. Earnings are also forecast to grow by 25% per annum over the same time period. Major Estimate Revision • Mar 26
Consensus revenue estimates increase by 36% The consensus outlook for revenues in fiscal year 2026 has improved. 2026 revenue forecast increased from US$79.8b to US$108.7b. EPS estimate increased from US$34.26 to US$58.05 per share. Net income forecast to grow 251% next year vs 38% growth forecast for Semiconductor industry in the US. Consensus price target up from US$425 to US$525. Share price fell 17% to US$382 over the past week. Declared Dividend • Mar 22
Second quarter dividend increased to US$0.15 Dividend of US$0.15 is 30% higher than last year. Ex-date: 30th March 2026 Payment date: 15th April 2026 Dividend yield will be 0.1%, which is lower than the industry average of 0.8%. Payout Ratios Payout ratio: 2%. Cash payout ratio: 7%. Reported Earnings • Mar 19
Second quarter 2026 earnings: EPS and revenues exceed analyst expectations Second quarter 2026 results: EPS: US$12.24 (up from US$1.42 in 2Q 2025). Revenue: US$23.9b (up 196% from 2Q 2025). Net income: US$13.8b (up US$12.2b from 2Q 2025). Profit margin: 58% (up from 20% in 2Q 2025). The increase in margin was driven by higher revenue. Revenue exceeded analyst estimates by 22%. Earnings per share (EPS) also surpassed analyst estimates by 36%. Revenue is forecast to grow 22% p.a. on average during the next 3 years, compared to a 21% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has increased by 113% per year but the company’s share price has only increased by 93% per year, which means it is significantly lagging earnings growth. Valuation Update With 7 Day Price Move • Mar 13
Investor sentiment improves as stock rises 15% After last week's 15% share price gain to US$426, the stock trades at a forward P/E ratio of 11x. Average forward P/E is 24x in the Semiconductor industry in the US. Total returns to shareholders of 663% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$208 per share. 공시 • Mar 03
Micron Technology, Inc. Sets New Benchmark with the World's First High-Capacity 256Gb LPDRAM SOCAMM2 for Data Center Infrastructure Micron Technology, Inc. extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry's first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint. Across these workloads, memory capacity, bandwidth efficiency, latency and power efficiency have become primary system level constraints, directly influencing performance, scalability and total cost of ownership. LPDRAM’s unique combination of these attributes position it as a cornerstone solution for both AI and core compute servers in increasingly power and thermally constrained data center environments. Micron is collaborating with NVIDIA to co-design sophisticated memory for the needs of advanced AI infrastructure. Micron’s 256GB SOCAMM2 delivers higher memory capacity, substantially lower power consumption and faster performance for a variety of AI and general-purpose computing workloads. With one-third more capacity than the prior highest capacity 192GB SOCAMM2, 256GB SOCAMM2 provides 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads. SOCAMM2 consumes one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint, improving rack density and reducing the total cost of ownership. In unified memory architectures, 256GB SOCAMM2 improves time to first token by more than 2.3 times for long context, real-time LLM inference when used for KV cache offload compared to currently available solutions. In standalone CPU applications, LPDRAM delivers more than 3 times better performance per watt than mainstream memory modules for high-performance computing workloads. The modular SOCAMM2 design improves serviceability, supports liquid-cooled server architectures and enables future capacity expansion as AI and core compute memory requirements continue to grow. Micron continues to play a leading role in the JEDEC SOCAMM2 specification definition and maintains deep technical collaborations with system designers to drive industry-wide improvements in power efficiency and performance for next-generation data center platforms. Micron is now shipping customer samples of its 256GB SOCAMM2 and offers the industry’s broadest data center LPDRAM portfolio, spanning 8GB to 64GB components and 48GB to 256GB SOCAMM2 modules. One-third of the power consumption calculated based on watts of power used by one 128GB, 128-bit bus width SOCAMM2 module compared to two 64GB, 64-bit bus width DDR5 RDIMMs. One-third footprint calculation compares SOCAMM2 area (14x90mm) versus a standard server RDIMM. Results are based on Micron internal testing of real-time inference with Llama3 70B model (with FP16 quantization) using 500K context length and 16 concurrent users. The projected TTFT latency improvement is based on a latency of 0.12s for 2TB LPDRAM per CPU vs. 0.28s for 1.5TB LPDRAM per CPU. Micron internal testing measuring Pot3D solar physics HPC code performance on identical capacities of LPDDR5X and DDR5. 공시 • Feb 25
Micron Technology, Inc. to Report Q2, 2026 Results on Mar 18, 2026 Micron Technology, Inc. announced that they will report Q2, 2026 results on Mar 18, 2026 공시 • Dec 19
Micron Technology, Inc. announces Quarterly dividend, payable on January 14, 2026 Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on January 14, 2026, ex-date on December 29, 2025 and record date on December 29, 2025. 공시 • Dec 18
Micron Technology, Inc. Provides Earnings Guidance for the Second Quarter of 2026 Micron Technology, Inc. provided earnings guidance for the second quarter of 2026. For the quarter, the company expects revenue of $18.70 billion ± $400 million and Diluted earnings per share of $8.19 ± $0.20. 공시 • Dec 03
Micron Technology, Inc. Announces Exit from Crucial Consumer Business Micron Technology, Inc. announced its decision to exit the Crucial consumer business, including the sale of Crucial consumer-branded products at key retailers, e-tailers and distributors worldwide. Micron will continue Crucial consumer product shipments through the consumer channel until the end of fiscal Second Quarter (February 2026). The company will work closely with partners and customers through this transition and will provide continued warranty service and support for Crucial products. Micron will continue to support the sale of Micron-branded enterprise products to commercial channel customers globally. This decision reflects Micron’s commitment to its ongoing portfolio transformation and the resulting alignment of its business to secular, profitable growth vectors in memory and storage. By concentrating on core enterprise and commercial segments, Micron aims to improve long-term business performance and create value for strategic customers as well as stakeholders. Micron intends to reduce impact on team members due to this business decision through redeployment opportunities into existing open positions within the company. Valuation Update With 7 Day Price Move • Nov 20
Investor sentiment deteriorates as stock falls 15% After last week's 15% share price decline to US$201, the stock trades at a forward P/E ratio of 13x. Average forward P/E is 21x in the Semiconductor industry in the US. Total returns to shareholders of 247% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$102 per share. 공시 • Nov 20
Micron Technology, Inc. to Report Q1, 2026 Results on Dec 17, 2025 Micron Technology, Inc. announced that they will report Q1, 2026 results on Dec 17, 2025 공시 • Nov 14
Micron Technology, Inc., Annual General Meeting, Jan 15, 2026 Micron Technology, Inc., Annual General Meeting, Jan 15, 2026. Recent Insider Transactions • Oct 22
Corporate VP & Chief Accounting Officer recently sold US$1.8m worth of stock On the 20th of October, Scott Allen sold around 9k shares on-market at roughly US$210 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of US$26m more than they bought in the last 12 months. 공시 • Oct 21
Crucial Debuts Crucial Ddr5 Pro Overclocking (Oc) 6400 Cl32 Crucial®?, a brand of Micron Technology, Inc., is deepening its commitment to gamers with the debut of Crucial DDR5 Pro Overclocking (OC) 6400 CL32 Gaming DRAM. Engineered for tech enthusiasts and offered in 32GB kits or 16GB single modules1, this new memory delivers faster speeds, lower latency and a bold new design that looks as good as it performs. This launch cements Crucial's commitment to PC gamers with new 10-nanosecond/CL32-class latency and delivers on feedback related to aesthetics, now with a new elevated heatspreader design. Crucial DDR5 Pro OC 6400 CL32 is designed for those who want to win on both performance and style. It helps players load games faster, react instantly and stay ahead of the competition. It's fast, reliable and looks incredible inside your rig. Delivering meaningful performance gains in memory-sensitive games like Watch Dogs: Legion and Red Deademption, Crucial DDR5 Pro OC6400 CL32 offers average frame rate improvements of up to 25%, for smoother gameplay.2 While performance gains vary by title and hardware configuration, the most significant improvements are typically seen in games and applications that are memory-intensive. With speeds up to 6400MT/s3, this memory delivers up to 37.5% lower latency than JEDEC-standard DDR54, is optimized for next-gen multi-core CPUs and supports stable overclocking with Intel®? XMP 3.0 and AMD EXPO™?5 (requires manual BIOS enablement). It's compatible with Intel®? Core™? Ultra processors (Series 2) and AMD Ryzen™? 9000 Series processors, ensuring seamless integration into modern gaming and creative setups. Key features: Faster than ever: Up to 6400MT/s speed and CL32 latency means quicker reactions and smoother gameplay: More than 14% faster than standard 5600 DRAM. Micron-powered performance: Backed by Micron's trusted memory technology for long-term reliability and energy efficiency. Multitask like a pro: Perfect for gaming, livestreaming, 3D rendering and content creation, making it ideal for custom builds or for anyone who uses data-intensive applications like AI and machine learning. Engineered to win, styled to stand out With a camo-inspired pattern, available in stealth matte black or snowFox white, Crucial's refined heatspreader combines function with standout aesthetics. A diamond-cut Crucial logo and bold "Crucial Pro" spine branding introduce a refined, tactical look. Designed for durability, the new heatspreader delivers reliable cooling performance and a clean, modern finish that complements high-performance builds. Crucial DDR5 ProOC 6400 CL32 GamingDRAM will be available starting October 21, through e-tailers, retailers and channel partners. Recent Insider Transactions Derivative • Oct 16
CEO, President & Chairman exercised options and sold US$43m worth of stock On the 15th of October, Sanjay Mehrotra exercised options to acquire 234k shares at no cost and sold these for an average price of US$182 per share. This trade did not impact their existing holding. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since December 2024, Sanjay's direct individual holding has decreased from 1.28m shares to 947.65k. Company insiders have collectively sold US$112m more than they bought, via options and on-market transactions in the last 12 months. Price Target Changed • Oct 15
Price target increased by 7.2% to US$201 Up from US$187, the current price target is an average from 36 analysts. New target price is 7.2% above last closing price of US$187. Stock is up 79% over the past year. The company is forecast to post earnings per share of US$16.11 for next year compared to US$7.65 last year. Recent Insider Transactions • Oct 04
Independent Director recently sold US$864k worth of stock On the 25th of September, Richard Beyer sold around 6k shares on-market at roughly US$156 per share. This transaction amounted to 5.5% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of US$25m more than they bought in the last 12 months. Recent Insider Transactions Derivative • Oct 02
CEO, President & Chairman notifies of intention to sell stock Sanjay Mehrotra intends to sell 15k shares in the next 90 days after lodging an Intent To Sell Form on the 1st of October. If the sale is conducted around the recent share price of US$181, it would amount to US$2.7m. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since December 2024, Sanjay's direct individual holding has decreased from 1.28m shares to 1.00m. Company insiders have collectively sold US$77m more than they bought, via options and on-market transactions in the last 12 months. Valuation Update With 7 Day Price Move • Oct 02
Investor sentiment improves as stock rises 17% After last week's 17% share price gain to US$184, the stock trades at a forward P/E ratio of 12x. Average forward P/E is 22x in the Semiconductor industry in the US. Total returns to shareholders of 242% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$107 per share. Major Estimate Revision • Sep 30
Consensus EPS estimates increase by 29% The consensus outlook for earnings per share (EPS) in fiscal year 2026 has improved. 2026 revenue forecast increased from US$49.4b to US$53.0b. EPS estimate increased from US$12.23 to US$15.80 per share. Net income forecast to grow 109% next year vs 23% growth forecast for Semiconductor industry in the US. Consensus price target up from US$160 to US$185. Share price was steady at US$164 over the past week. Declared Dividend • Sep 28
Fourth quarter dividend of US$0.12 announced Dividend of US$0.12 is the same as last year. Ex-date: 3rd October 2025 Payment date: 21st October 2025 Dividend yield will be 0.3%, which is lower than the industry average of 0.8%. Payout Ratios Payout ratio: 6%. Cash payout ratio: 31%. Reported Earnings • Sep 24
Full year 2025 earnings: EPS exceeds analyst expectations Full year 2025 results: EPS: US$7.65 (up from US$0.70 in FY 2024). Revenue: US$37.4b (up 49% from FY 2024). Net income: US$8.54b (up US$7.76b from FY 2024). Profit margin: 23% (up from 3.1% in FY 2024). The increase in margin was driven by higher revenue. Revenue was in line with analyst estimates. Earnings per share (EPS) surpassed analyst estimates by 2.6%. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 18% growth forecast for the Semiconductor industry in the US. Over the last 3 years on average, earnings per share has increased by 23% per year but the company’s share price has increased by 47% per year, which means it is tracking significantly ahead of earnings growth. Price Target Changed • Sep 22
Price target increased by 7.3% to US$162 Up from US$151, the current price target is an average from 35 analysts. New target price is approximately in line with last closing price of US$163. Stock is up 79% over the past year. The company is forecast to post earnings per share of US$7.39 for next year compared to US$0.70 last year. Recent Insider Transactions Derivative • Sep 14
CEO, President & Chairman notifies of intention to sell stock Sanjay Mehrotra intends to sell 8k shares in the next 90 days after lodging an Intent To Sell Form on the 11th of September. If the sale is conducted around the recent share price of US$152, it would amount to US$1.1m. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since December 2024, Sanjay's direct individual holding has decreased from 1.28m shares to 1.04m. Company insiders have collectively sold US$76m more than they bought, via options and on-market transactions in the last 12 months. Recent Insider Transactions Derivative • Sep 11
CEO, President & Chairman notifies of intention to sell stock Sanjay Mehrotra intends to sell 8k shares in the next 90 days after lodging an Intent To Sell Form on the 10th of September. If the sale is conducted around the recent share price of US$141, it would amount to US$1.1m. For the year to August 2019, Sanjay's total compensation was 5% salary and 95% other compensation. This indicates that these sales could comprise a meaningful part of their income for the year. Since December 2024, Sanjay's direct individual holding has decreased from 1.28m shares to 1.04m. Company insiders have collectively sold US$76m more than they bought, via options and on-market transactions in the last 12 months. Valuation Update With 7 Day Price Move • Sep 10
Investor sentiment improves as stock rises 18% After last week's 18% share price gain to US$140, the stock trades at a forward P/E ratio of 13x. Average forward P/E is 22x in the Semiconductor industry in the US. Total returns to shareholders of 168% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$70.90 per share. 공시 • Aug 29
Micron Technology, Inc. to Report Q4, 2025 Results on Sep 23, 2025 Micron Technology, Inc. announced that they will report Q4, 2025 results on Sep 23, 2025 Valuation Update With 7 Day Price Move • Aug 12
Investor sentiment improves as stock rises 17% After last week's 17% share price gain to US$128, the stock trades at a forward P/E ratio of 12x. Average forward P/E is 21x in the Semiconductor industry in the US. Total returns to shareholders of 104% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at US$69.17 per share. 공시 • Aug 12
Micron Technology, Inc. Updates Earnings Guidance for the Fourth Quarter of 2025 Micron Technology, Inc. updated earnings guidance for the fourth quarter of fiscal 2025, which ends August 28, 2025. For the quarter, the company expects revenue of 11.2 billion ± $100 Million compared to previous guidance of $10.7 Billion ± $300 Million. Diluted earnings per share of $2.64 ± $0.07 compared to previous guidance of $2.29 ± $0.15 per share. 공시 • Jul 29
Micron Unveils Portfolio of Industry-First Ssds to Power the Ai Revolution Micron Technology, Inc. develops innovative memory and storage solutions to address the data needs of the AI-driven data center with superior performance, capacity and energy efficiency. Micron extends its industry leadership in storage with the launch of three new data center SSDs all built with Micron G9 NAND. This expansion of Micron's storage portfolio includes the world's first PCIe Gen6 NVMe SSD, industry-leading capacity for an E3.S SSD and the lowest latency mainstream Gen5 SSD for AI data centers. These new products are highly performant, energy and space efficient, and validated with leading ecosystem partners to streamline qualification and ensure seamless integration, making them the ideal portfolio for the widely divergent needs of AI workloads. The reduction in power consumption and carbon emissions allows data centers to meet sustainability goals while enhancing performance. Record-setting Gen6 performance: Up to 28 GB/s sequential read and 14 GB/s sequential write speeds; Up to 5.5 MIOPS random read and 900 KIOPS random write speeds; FIPS 140-3 Level 2 and Trade Agreement Act (TAA) compliant options help ensure SSDs sold to the U.S. government are manufactured or substantially transformed in the United States or in designated countries; Pioneering ecosystem collaborations, including prior public demonstrations with Astera Labs and Broadcom accelerate adoption through proven interoperability; A liquid-cooled E1.S version is available for the most advanced AI servers. With up to 5.5 million IOPS for random reads, the Micron 9650 is purpose-built for AI pipelines' high-throughput, low-latency demands. This product helps ensure GPUs remain continuously fed with data, minimizing idle cycles and maximizing system efficiency. At the time of announcement, no other Gen6 competitive SSDs are available that can provide the same or better performance as the Micron 9650 Gen6 SSD. The 9650 has two times the sequential read performance of the previous-generation 9550. Additionally, the Micron 6600 ION currently provides the highest-capacity solution available in a rack comparison using Micron E3.S drives: 20 SSDs per 1U x 36 servers (36U) x 122TB equals 88.5PB versus similar competitive U.2 form factor SSDs with 24 SSDs per 2U x 18 servers (36U) x122TB equaling 53PB, leaving 6U for other equipment in each rack. The Micron 7600 SSD has the lowest latency based on competitive testing in Micron labs and has the lowest sub-1ms latency up to QD128 based on RocksDB testing in Micron labs with available drives, per chapter 5.2 The 9650 has improved energy efficiency with two times the sequential read performance the 9550 SSD, Micron's previous-generation drive, with the same 25W maximum power. 공시 • Jul 22
Micron Launches Space-Qualified Portfolio to Power Mission-Critical Data for Aerospace Innovation Micron Technology, Inc. announced that it is launching the industry's highest-density, radiation-tolerant single-layer cell (SLC) NAND product. With a die capacity of 256 gigabits (Gb), this product is the first in a portfolio that will include space-qualified NAND, NOR and DRAM solutions. The product is available now and represents the first in its class to be offered by any major memory manufacturer. The space economy is skyrocketing, fueled by rapid growth in commercial and government missions. As computing and AI evolve, demand is rising for high-performance technology capable of processing data directly in orbit. AI-enabled edge computing is transforming space operations: allowing spacecraft to analyze sensor data, detect anomalies and make decisions autonomously, reducing reliance on Earth-based systems and preserving bandwidth. Spaceborne technologies must withstand harsh environmental conditions to deliver successful mission results. These challenges include extreme temperatures, shock and vibration, vacuum pressure, and radiation exposure from solar energetic particles and galactic cosmic rays. With EMIT capturing 100,000 spectra per second, Micron's high-density, radiation-t tolerant memory provides reliable, long-term data storage and processing vital for mission success. Micron's strategy: Expanding aerospace industry support with end-to-end supply chain control paramount for aerospace and government sectors, providing quality, longevity, security, traceability and supply continuity. This advantage is bolstered by recently announced plans to strengthen Micron's U.S.-based manufacturing. These plans include modernizing the company's Manassas, Virginia, facility and expanding its portfolio of NOR, SLC NAND and DDR3, with longevity supply of DDR4 and LPDDR4 for critical applications such as aerospace. Leveraging Micron's decades of experience in customer engineering labs that enable collaboration, the company is extending its capabilities to support the rapidly growing aerospace industry by building specialized regional customer labs and technical support and architecture teams. Micron is also optimizing a manufacturing process for aerospace solutions, enabling quality -- from precision engineering to raw wafer selection to compliance -- and addressing critical challenges faced by space platform developers. Building on its newly launched aerospace portfolio, Micron plans to introduce additional space-qualified memory and storage solutions in the coming year and beyond to address the evolving demands of next-generation space missions. 공시 • Jun 27
Micron Technology, Inc. announces Quarterly dividend, payable on July 22, 2025 Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on July 22, 2025, ex-date on July 07, 2025 and record date on July 07, 2025. 공시 • Jun 13
Micron HBM Designed into Leading AMD AI Platform Micron Technology, Inc. announced the integration of its HBM3E 36GB 12-high offering into the upcoming AMD Instinct™ MI350 Series solutions. This collaboration highlights the critical role of power efficiency and performance in training large AI models, delivering high-throughput inference and handling complex HPC workloads such as data processing and computational modeling. Furthermore, it represents another significant milestone in HBM industry leadership for Micron, showcasing its robust execution and the value of its strong customer relationships. Micron HBM3E 36GB 12-high solution brings industry-leading memory technology to AMD Instinct™ MI350 Series GPU platforms, providing outstanding bandwidth and lower power consumption.1 The AMD Instinct MI350 Series GPU platforms, built on AMD advanced CDNA 4 architecture, integrate 288GB of high-bandwidth HBM3E memory capacity, delivering up to 8 TB/s bandwidth for exceptional throughput. This immense memory capacity allows Instinct MI350 series GPUs to efficiently support AI models with up to 520 billion parameters—on a single GPU. In a full platform configuration, Instinct MI350 Series GPUs offers up to 2.3TB of HBM3E memory and achieves peak theoretical performance of up to 161 PFLOPS at FP4 precision, with leadership energy efficiency and scalability for high-density AI workloads. This tightly integrated architecture, combined with Micron’s power-efficient HBM3E, enables exceptional throughput for large language model training, inference and scientific simulation tasks—empowering data centers to scale seamlessly while maximizing compute performance per watt. This joint effort between Micron and AMD has enabled faster time to market for AI solutions. 공시 • Jun 10
Micron Technology, Inc. Ships HBM4 to Key Customers to Power Next-Gen AI Platforms Micron Technology, Inc. announced the shipment of HBM4 36GB 12-high samples to multiple key customers. This milestone extends Micron's leadership in memory performance and power efficiency for AI applications. Built on its well-established 1ss (1-beta) DRAM process, proven 12-high advanced packaging technology and highly capable memory built-in self-test (MBIST) feature, Micron HBM4 provides seamless integration for customers and partners developing next-generation AI platforms. As use of generative AI continues to grow, the ability to effectively manage inference becomes more important. Micron HBM4 features a 2048-bit interface, achieving speeds greater than 2.0 TB/s per memory stack and more than 60% better performance over the previous generation. This expanded interface facilitates rapid communication and a high-throughput design that accelerates the inference performance of large language models and chain-of-thought reasoning systems. Simply put, HBM4 will help AI accelerators respond faster and reason more effectively. Additionally, Micron HBM4 features over 20% better power efficiency compared to Micron's previous-generation HBM3E products, which first established new, unrivaled benchmarks in HBM power efficiency in the industry. This improvement provides maximum throughput with the lowest power consumption to maximize data center efficiency. Generative AI use cases continue to multiply, and this transformative technology is poised to deliver significant benefits to society. HBM4 is a crucial enabler, driving quicker insights and discoveries that will foster innovation in diverse fields such as healthcare, finance and transportation. Intelligence Accelerated: Micron's role in the AI revolution: For nearly five decades, Micron has pushed the boundaries of memory and storage innovation. Today, Micron continues to accelerate AI by delivering a broad portfolio of solutions that turn data into intelligence, fueling breakthroughs from the data center to the edge. With HBM4, Micron reinforces its position as a critical catalyst for AI innovation and a reliable partner for customers' most demanding solutions. Micron plans to ramp HBM4 in calendar year 2026, aligned to the ramp of customers' next-generation AI platforms. 공시 • Jun 03
Micron Technology, Inc. Ships 1? (1-Gamma) -Based Lpddr5x, Enabling Rich Mobile Ai Experiences Micron Technology, Inc. announced that it is shipping qualification samples of the world's first 1g (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on smartphones. Delivering the industry's fastest LPDDR5X speed grade of 10.7 gigabits per second (Gbps), combined with up to a 20% power savings, Micron LPDDR5X transforms smartphones with faster, smoother mobile experiences and longer battery life -- even when executing data-intensive workloads such as AI-powered translation or image generation. To meet the industry's increasing demand for compact solutions for next-generation smartphone designs, Micron's engineers have shrink the LPDDR5X package size to offer the industry's thinnest package of 0.61 millimeters, making it 6% thinner compared to competitive offerings, and representing a 14% height reduction from the previous generation. The small form factor unlocks more possibilities for smartphone manufacturers to design ultraathin or foldable smartphones. The company's 1g-based LPDDR5X enables dramatic leap in performance for mobile users by enabling faster AI insights. For example, Micron evaluated mobile AI response times from large language model Llama 2, based on 1g LPDDR5X's 10.7 Gbps bandwidth compared to 1b (1-beta) LPDDR5X's 7.5 Gbps bandwidth, finding: Responses are 30% faster when asking for location-based restaurant recommendations. Results are more than 50% faster when translating a voice inquiry in English to text in Spanish to ask for directions. This milestone builds on Micron's February sampling of 1g-based DDR5 memory for next-generation CPUs in the data center and client segments. Micron's optimized 1g DRAM node leverages CMOS7 advancements like next-generation high-K metal gate technology for improved transistor performance and incorporates EUV lithography for enhanced bit density. As energy-intensive mobile AI workloads are increasingly processed on-device rather than only in the cloud, low-power chips are crucial for devices like smartphones, tablets and laptops, which need to conserve power while performing AI computations. Micron's 1g-based L PDDR5X's significant 20% power savings will allow mobile users to enjoy their favorite AI applications, games and video content longer on a single charge. In addition, as AI intensifies the need for powerful, energy-efficient compute, data center servers, intelligent vehicles and AI PCs may also increasingly adopt LPDDR5X for its unique blend of optimized power efficiency and high performance. Micron is currently sampling 1g-based LPD DR5X 16 gigabyte (GB) products to select partners and will offer a wide range of capacities from 8GB to 32GB for use in 2026 smartphones. Additional Resources. Mobile solutions page: Mobile Memory and Storage for Phones. Product page: LPDDR5X. 공시 • May 22
Micron Technology, Inc. to Report Q3, 2025 Results on Jun 25, 2025 Micron Technology, Inc. announced that they will report Q3, 2025 results on Jun 25, 2025 공시 • May 20
Micron Technology, Inc. Unveils Latest High-Performance SSDs - the Crucial T710PCIe Gen5 NVMe SSD and the Crucial X10 Portable SSD At Computex 2025, Micron Technology, Inc. expanded its leadership in consumer storage by unveiling its latest high-performance SSDs -- the Crucial T710 PCI Gen5 NVMe SSD and the Crucial X10 Portable SSD. Forged from years of dedicated research and development, these next-gen SSDs redefine performance standards across the board by pushing the limits of speed, capacity and durability -- powering world at full speed. The T710 delivers up to 67% more IOPs per watt than previous-generation Gen5 drives, running faster and cooler and making it ideal for PCs, laptops and workstations. The optional integrated heatsink ensures the T710 stays cool under pressure and capacity options up to 4TB2 means users have the storage space they need for their most demanding projects. The increasing demands of AI applications require robust hardware for optimal performance. With its dramatically increased energy efficiency and decreased latency, the Crucial T710 is perfect for enabling real-time local data processing on AI PCs, with the speed to load a large language model from SSD to memory in under one second. Crucial's latest portable drive, the X10, delivers read speeds of up to 2,100 MB/s,4 twice as fast as its predecessor.5 The X10 is designed for users who need a fast, reliable and durable solution to back up and store their most important photos, games, movies, documents and more. With 4TB, 6TB and 8TB versions available, the Crucial X10 allows users to store massive amounts of data, including up to 500,000 4K photos, 114 games or 2.6 million MP3 files. With its sleek, matte blue design, the X10 is perfect for content creators, gamers, photography hobbyists and mainstream consumers who require high-speed data transfer and ample storage capacity. Its durable design is IP65 dust- and water-resistant and drop-resistant up to 9.8 feet, making it a vault for data -- secure, portable and always ready. The T710 uses Silicon Motion's SM2508 controller, while the X10 uses the SM2322 controller. Availability: The Crucial X10 is now available for purchase through etailers, retailers and global channel partners, while T710 will be available starting in July 2025. Additional Resources: Crucial X10 is available starting in July 2025. 공시 • Apr 19
Micron Technology, Inc. Announces Business Unit Reorganization to Capitalize on Ai Growth Across All Market Segments Micron Technology, Inc. announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices. Micron has maintained multiple generations of industry leadership in DRAM and NAND technology and has the strongest competitive positioning in its history. Micron’s industry-leading product portfolio, combined with world-class manufacturing execution enables the development of differentiated solutions for its customers across end markets. As high-performance memory and storage become increasingly vital to drive the growth of AI, this Business Unit reorganization will allow Micron to stay at the forefront of innovation in each market segment through deeper customer engagement to address the dynamic needs of the industry. Micron will begin transitioning to this new business structure immediately. The transition will be complete early in the company’s fiscal fourth quarter, which begins on May 30, 2025. Micron will report financial results under the new business structure starting with the fourth quarter of fiscal year 2025. The four business units will be: Cloud Memory Business Unit (CMBU): Focused on memory solutions for large hyperscale cloud customers, and high-bandwidth memory (HBM) for all data center customers. Raj Narasimhan, Senior Vice President and General Manager, who has led the Compute and Networking Business Unit (CNBU), will lead CMBU. Core Data Center Business Unit (CDBU): Focused on memory solutions for OEM data center customers and storage solutions for all data center customers. Jeremy Werner, Senior Vice President and General Manager, who has led the Storage Business Unit (SBU), will lead CDBU. Mobile and Client Business Unit (MCBU): Focused on memory and storage solutions for mobile and client segments. Mark Montierth, Corporate Vice President and General Manager, who has led the Mobile Business Unit (MBU), will lead MCBU. Automotive and Embedded Business Unit (AEBU): Focused on memory and storage solutions for the automotive, industrial and consumer segments. Kris Baxter, Corporate Vice President and General Manager, who has led the Embedded Business Unit (EBU), will lead AEBU. All four business units will continue to report to Sumit Sadana, Executive Vice President and Chief Business Officer. 
