View Financial HealthMicron Technology 배당 및 자사주 매입배당 기준 점검 0/6Micron Technology 은(는) 현재 수익률이 0.082% 인 배당금 지급 회사입니다.핵심 정보0.08%배당 수익률0.1%자사주 매입 수익률총 주주 수익률0.2%미래 배당 수익률0.08%배당 성장률17.3%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향2%최근 배당 및 자사주 매입 업데이트업데이트 없음모든 업데이트 보기Recent updates공시 • May 14Micron Technology, Inc. Samples 256GB DDR5 Server ModuleMicron Technology, Inc. announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company’s 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production. Micron’s module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron’s 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256GB module can reduce operating power by more than 40% versus two 128GB modules, enabling greater efficiency for modern AI data centers. Micron is collaborating with key ecosystem enablers to validate the 256GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale. The rapid proliferation of large language models (LLMs), agentic AI, real-time inference and high-core-count CPU workloads is driving an urgent need for greater enterprise server memory capacity, higher bandwidth and improved power efficiency. Micron’s 256GB DDR5 RDIMM addresses these growing requirements head-on, enabling server architects, hyperscale operators and platform partners to maximize memory capacity per socket while operating within the thermal and power boundaries of modern data center infrastructure. Micron’s 1 gamma-based 256GB DDR5 RDIMM is currently sampling to key server ecosystem enablers for platform validation.공시 • Mar 19+ 1 more updateMicron Technology, Inc. Provides Earning Guidance for the Third Quarter of 2026Micron Technology, Inc. provided earning guidance for the third quarter of 2026. For the quarter, the company expects revenue of $33.5 billion ± $750 million and diluted earnings per share of $18.90 ± $0.40.공시 • Mar 03Micron Technology, Inc. Sets New Benchmark with the World's First High-Capacity 256Gb LPDRAM SOCAMM2 for Data Center InfrastructureMicron Technology, Inc. extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry's first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint. Across these workloads, memory capacity, bandwidth efficiency, latency and power efficiency have become primary system level constraints, directly influencing performance, scalability and total cost of ownership. LPDRAM’s unique combination of these attributes position it as a cornerstone solution for both AI and core compute servers in increasingly power and thermally constrained data center environments. Micron is collaborating with NVIDIA to co-design sophisticated memory for the needs of advanced AI infrastructure. Micron’s 256GB SOCAMM2 delivers higher memory capacity, substantially lower power consumption and faster performance for a variety of AI and general-purpose computing workloads. With one-third more capacity than the prior highest capacity 192GB SOCAMM2, 256GB SOCAMM2 provides 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads. SOCAMM2 consumes one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint, improving rack density and reducing the total cost of ownership. In unified memory architectures, 256GB SOCAMM2 improves time to first token by more than 2.3 times for long context, real-time LLM inference when used for KV cache offload compared to currently available solutions. In standalone CPU applications, LPDRAM delivers more than 3 times better performance per watt than mainstream memory modules for high-performance computing workloads. The modular SOCAMM2 design improves serviceability, supports liquid-cooled server architectures and enables future capacity expansion as AI and core compute memory requirements continue to grow. Micron continues to play a leading role in the JEDEC SOCAMM2 specification definition and maintains deep technical collaborations with system designers to drive industry-wide improvements in power efficiency and performance for next-generation data center platforms. Micron is now shipping customer samples of its 256GB SOCAMM2 and offers the industry’s broadest data center LPDRAM portfolio, spanning 8GB to 64GB components and 48GB to 256GB SOCAMM2 modules. One-third of the power consumption calculated based on watts of power used by one 128GB, 128-bit bus width SOCAMM2 module compared to two 64GB, 64-bit bus width DDR5 RDIMMs. One-third footprint calculation compares SOCAMM2 area (14x90mm) versus a standard server RDIMM. Results are based on Micron internal testing of real-time inference with Llama3 70B model (with FP16 quantization) using 500K context length and 16 concurrent users. The projected TTFT latency improvement is based on a latency of 0.12s for 2TB LPDRAM per CPU vs. 0.28s for 1.5TB LPDRAM per CPU. Micron internal testing measuring Pot3D solar physics HPC code performance on identical capacities of LPDDR5X and DDR5.공시 • Feb 25Micron Technology, Inc. to Report Q2, 2026 Results on Mar 18, 2026Micron Technology, Inc. announced that they will report Q2, 2026 results on Mar 18, 2026지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: MICRON19 TH 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: MICRON19 TH 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장Micron Technology 배당 수익률 vs 시장MICRON19의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (MICRON19)0.08%시장 하위 25% (TH)3.4%시장 상위 25% (TH)7.6%업계 평균 (Semiconductor)0.7%분석가 예측 (MICRON19) (최대 3년)0.08%주목할만한 배당금: MICRON19 의 배당금( 0.082% )은 TH 시장에서 배당금 지급자의 하위 25%( 3.41% )와 비교해 주목할 만하지 않습니다.고배당: MICRON19 의 배당금( 0.082% )은 TH 시장에서 배당금 지급자의 상위 25%( 7.62% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: MICRON19 TH 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: MICRON19 TH 시장에서 주목할만한 배당금을 지급하지 않습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YTH 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/21 20:35종가2026/05/21 00:00수익2026/02/26연간 수익2025/08/28데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Micron Technology, Inc.는 72명의 분석가가 다루고 있습니다. 이 중 39명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Warren LauAletheia Analyst Network LimitedBrett SimpsonArete Research Services LLPJames FontanelliArete Research Services LLP69명의 분석가 더 보기
공시 • May 14Micron Technology, Inc. Samples 256GB DDR5 Server ModuleMicron Technology, Inc. announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company’s 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production. Micron’s module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron’s 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256GB module can reduce operating power by more than 40% versus two 128GB modules, enabling greater efficiency for modern AI data centers. Micron is collaborating with key ecosystem enablers to validate the 256GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale. The rapid proliferation of large language models (LLMs), agentic AI, real-time inference and high-core-count CPU workloads is driving an urgent need for greater enterprise server memory capacity, higher bandwidth and improved power efficiency. Micron’s 256GB DDR5 RDIMM addresses these growing requirements head-on, enabling server architects, hyperscale operators and platform partners to maximize memory capacity per socket while operating within the thermal and power boundaries of modern data center infrastructure. Micron’s 1 gamma-based 256GB DDR5 RDIMM is currently sampling to key server ecosystem enablers for platform validation.
공시 • Mar 19+ 1 more updateMicron Technology, Inc. Provides Earning Guidance for the Third Quarter of 2026Micron Technology, Inc. provided earning guidance for the third quarter of 2026. For the quarter, the company expects revenue of $33.5 billion ± $750 million and diluted earnings per share of $18.90 ± $0.40.
공시 • Mar 03Micron Technology, Inc. Sets New Benchmark with the World's First High-Capacity 256Gb LPDRAM SOCAMM2 for Data Center InfrastructureMicron Technology, Inc. extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry's first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint. Across these workloads, memory capacity, bandwidth efficiency, latency and power efficiency have become primary system level constraints, directly influencing performance, scalability and total cost of ownership. LPDRAM’s unique combination of these attributes position it as a cornerstone solution for both AI and core compute servers in increasingly power and thermally constrained data center environments. Micron is collaborating with NVIDIA to co-design sophisticated memory for the needs of advanced AI infrastructure. Micron’s 256GB SOCAMM2 delivers higher memory capacity, substantially lower power consumption and faster performance for a variety of AI and general-purpose computing workloads. With one-third more capacity than the prior highest capacity 192GB SOCAMM2, 256GB SOCAMM2 provides 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads. SOCAMM2 consumes one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint, improving rack density and reducing the total cost of ownership. In unified memory architectures, 256GB SOCAMM2 improves time to first token by more than 2.3 times for long context, real-time LLM inference when used for KV cache offload compared to currently available solutions. In standalone CPU applications, LPDRAM delivers more than 3 times better performance per watt than mainstream memory modules for high-performance computing workloads. The modular SOCAMM2 design improves serviceability, supports liquid-cooled server architectures and enables future capacity expansion as AI and core compute memory requirements continue to grow. Micron continues to play a leading role in the JEDEC SOCAMM2 specification definition and maintains deep technical collaborations with system designers to drive industry-wide improvements in power efficiency and performance for next-generation data center platforms. Micron is now shipping customer samples of its 256GB SOCAMM2 and offers the industry’s broadest data center LPDRAM portfolio, spanning 8GB to 64GB components and 48GB to 256GB SOCAMM2 modules. One-third of the power consumption calculated based on watts of power used by one 128GB, 128-bit bus width SOCAMM2 module compared to two 64GB, 64-bit bus width DDR5 RDIMMs. One-third footprint calculation compares SOCAMM2 area (14x90mm) versus a standard server RDIMM. Results are based on Micron internal testing of real-time inference with Llama3 70B model (with FP16 quantization) using 500K context length and 16 concurrent users. The projected TTFT latency improvement is based on a latency of 0.12s for 2TB LPDRAM per CPU vs. 0.28s for 1.5TB LPDRAM per CPU. Micron internal testing measuring Pot3D solar physics HPC code performance on identical capacities of LPDDR5X and DDR5.
공시 • Feb 25Micron Technology, Inc. to Report Q2, 2026 Results on Mar 18, 2026Micron Technology, Inc. announced that they will report Q2, 2026 results on Mar 18, 2026