View Financial HealthApplied Materials 배당 및 자사주 매입배당 기준 점검 0/6Applied Materials 은(는) 현재 수익률이 0.38% 인 배당금 지급 회사입니다.핵심 정보0.4%배당 수익률0.6%자사주 매입 수익률총 주주 수익률1.0%미래 배당 수익률0.4%배당 성장률14.5%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향18%최근 배당 및 자사주 매입 업데이트업데이트 없음모든 업데이트 보기Recent updates공고 • Jun 29+ 4 more updatesApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value BenchmarkApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value Benchmark공고 • Jun 26Applied Materials, Inc. Introduces New Chipmaking Systems for 3D Architectures in AI ChipsApplied Materials, Inc. introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI. A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints. New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic. New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present. Epitaxy has been used for years in leading-edge logic, where precision growth of a crystalline material in the transistor channel has boosted performance well beyond what geometric scaling alone can deliver. Those same techniques are now becoming critical in DRAM peripheral transistors. Applied pioneered silicon germanium epitaxy in transistor channels more than a decade ago with its Centura Prime Epi system. Applied is now introducing an enhanced Centura Prime Epi system that selectively grows doped silicon germanium and silicon phosphorous in source/drain regions, combining advanced strain engineering with precise doping control. The result is higher drive current and transistor efficiency, enabling faster, more power-efficient DRAM operation—essential for the bandwidth demands of HBM and next-generation DDR. The new system also features a 20% smaller footprint, enabling higher tool density and faster capacity scaling in DRAM fabs. In recent years, advanced packaging has become as strategically important to the computing industry as on-chip transistor scaling. Modern AI server chips pack trillions of transistors by integrating multiple dies into a single package. HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs). Applied is the leader in process equipment for advanced packaging, including systems covering the majority of materials engineering steps required to create the TSVs, copper pillars and microbumps that connect stacked dies. Applied is introducing three new systems targeting the most critical advanced packaging process steps. Leveraging Applied’s leadership position in chemical mechanical planarization (CMP), the Opta Quad platform is engineered specifically for advanced packaging, where thicker films, longer polish times and tighter tolerances raise the risk of non-uniformity and yield loss. Opta Quad continuously monitors wafer conditions during polish and dynamically adjusts in real time, improving within-wafer uniformity and total thickness variation control. This is particularly critical for hybrid bonding—an emerging 3D stacking technology in which copper wiring and surrounding dielectrics from two chips are fused together in a single step, requiring near-perfect surface planarity for high-yield results. Nokota VMax 2 is an electrochemical deposition (ECD) system engineered for high-precision copper plating across a broad range of applications for next-generation packaging, from TSV fill for 3D stacking to fine-pitch interconnects such as microbump formation. Nokota VMax 2 introduces Adaptive Pattern Tuning (APT), which dynamically shapes the electric field to correct for layout-driven variation and improve plating uniformity across the wafer. Producer Avila 2 is a plasma-enhanced chemical vapor deposition (PECVD) system that improves the mechanical stability of ultra-thin DRAM dies by depositing stress-balanced dielectric films around TSVs, enabling reliable stacking of 12, 16, and future high-layer-count HBM designs. In addition to HBM, the system supports a range of advanced memory and logic integration schemes. Advanced packaging fabs are encountering defect and metrology challenges once exclusively found in wafer fabs. Feature dimensions have shrunk below the resolution limit of optical inspection tools, and particles that were tolerable with larger bumps now impact yield. A single defect can require scrapping an entire HBM stack, elevating process control to a strategic priority. Applied is extending its eBeam leadership with two new systems specifically designed for advanced packaging—both engineered to handle a wide range of substrate geometries and materials. The latest in Applied’s VeritySEM portfolio for critical dimension (CD) metrology, VeritySEM 7AP enables precise measurement of features on thick, heterogeneous, and highly warped substrates common in HBM and chiplet architectures. VeritySEM AP systems automatically reconfigure to support a range of sizes and materials, while delivering sub-10nm sensitivity—orders of magnitude better than optical tools. SEMVision is the industry’s leading eBeam defect analysis platform. SEMVision G7AP extends Applied’s leadership into advanced packaging, enabling high-resolution defect review and automated classification across silicon, organic, and glass substrates. The system can accelerate yield learning by helping customers quickly distinguish critical defects from nuisance signals. SEMVision G7AP is already in production at memory and logic manufacturers supporting high-volume advanced packaging. A media kit with additional information on the new systems is available.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: AMAT01 TH 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: AMAT01 TH 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장Applied Materials 배당 수익률 vs 시장AMAT01의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (AMAT01)0.4%시장 하위 25% (TH)3.1%시장 상위 25% (TH)7.2%업계 평균 (Semiconductor)0.7%분석가 예측 (AMAT01) (최대 3년)0.4%주목할만한 배당금: AMAT01 의 배당금( 0.38% )은 TH 시장에서 배당금 지급자의 하위 25%( 3.11% )와 비교해 주목할 만하지 않습니다.고배당: AMAT01 의 배당금( 0.38% )은 TH 시장에서 배당금 지급자의 상위 25%( 7.19% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: AMAT01 TH 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: AMAT01 TH 시장에서 주목할만한 배당금을 지급하지 않습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YTH 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/07/23 21:39종가2026/07/23 00:00수익2026/04/26연간 수익2025/10/26데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델의 세부 정보는 당사의 GitHub 페이지에서 확인하실 수 있습니다. 또한 보고서 사용 방법에 대한 가이드와 YouTube 튜토리얼도 제공하고 있습니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Applied Materials, Inc.는 53명의 분석가가 다루고 있습니다. 이 중 34명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관James FontanelliArete Research Services LLPBrett SimpsonArete Research Services LLPJames KelleherArgus Research Company50명의 분석가 더 보기
공고 • Jun 29+ 4 more updatesApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value BenchmarkApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value Benchmark
공고 • Jun 26Applied Materials, Inc. Introduces New Chipmaking Systems for 3D Architectures in AI ChipsApplied Materials, Inc. introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI. A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints. New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic. New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present. Epitaxy has been used for years in leading-edge logic, where precision growth of a crystalline material in the transistor channel has boosted performance well beyond what geometric scaling alone can deliver. Those same techniques are now becoming critical in DRAM peripheral transistors. Applied pioneered silicon germanium epitaxy in transistor channels more than a decade ago with its Centura Prime Epi system. Applied is now introducing an enhanced Centura Prime Epi system that selectively grows doped silicon germanium and silicon phosphorous in source/drain regions, combining advanced strain engineering with precise doping control. The result is higher drive current and transistor efficiency, enabling faster, more power-efficient DRAM operation—essential for the bandwidth demands of HBM and next-generation DDR. The new system also features a 20% smaller footprint, enabling higher tool density and faster capacity scaling in DRAM fabs. In recent years, advanced packaging has become as strategically important to the computing industry as on-chip transistor scaling. Modern AI server chips pack trillions of transistors by integrating multiple dies into a single package. HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs). Applied is the leader in process equipment for advanced packaging, including systems covering the majority of materials engineering steps required to create the TSVs, copper pillars and microbumps that connect stacked dies. Applied is introducing three new systems targeting the most critical advanced packaging process steps. Leveraging Applied’s leadership position in chemical mechanical planarization (CMP), the Opta Quad platform is engineered specifically for advanced packaging, where thicker films, longer polish times and tighter tolerances raise the risk of non-uniformity and yield loss. Opta Quad continuously monitors wafer conditions during polish and dynamically adjusts in real time, improving within-wafer uniformity and total thickness variation control. This is particularly critical for hybrid bonding—an emerging 3D stacking technology in which copper wiring and surrounding dielectrics from two chips are fused together in a single step, requiring near-perfect surface planarity for high-yield results. Nokota VMax 2 is an electrochemical deposition (ECD) system engineered for high-precision copper plating across a broad range of applications for next-generation packaging, from TSV fill for 3D stacking to fine-pitch interconnects such as microbump formation. Nokota VMax 2 introduces Adaptive Pattern Tuning (APT), which dynamically shapes the electric field to correct for layout-driven variation and improve plating uniformity across the wafer. Producer Avila 2 is a plasma-enhanced chemical vapor deposition (PECVD) system that improves the mechanical stability of ultra-thin DRAM dies by depositing stress-balanced dielectric films around TSVs, enabling reliable stacking of 12, 16, and future high-layer-count HBM designs. In addition to HBM, the system supports a range of advanced memory and logic integration schemes. Advanced packaging fabs are encountering defect and metrology challenges once exclusively found in wafer fabs. Feature dimensions have shrunk below the resolution limit of optical inspection tools, and particles that were tolerable with larger bumps now impact yield. A single defect can require scrapping an entire HBM stack, elevating process control to a strategic priority. Applied is extending its eBeam leadership with two new systems specifically designed for advanced packaging—both engineered to handle a wide range of substrate geometries and materials. The latest in Applied’s VeritySEM portfolio for critical dimension (CD) metrology, VeritySEM 7AP enables precise measurement of features on thick, heterogeneous, and highly warped substrates common in HBM and chiplet architectures. VeritySEM AP systems automatically reconfigure to support a range of sizes and materials, while delivering sub-10nm sensitivity—orders of magnitude better than optical tools. SEMVision is the industry’s leading eBeam defect analysis platform. SEMVision G7AP extends Applied’s leadership into advanced packaging, enabling high-resolution defect review and automated classification across silicon, organic, and glass substrates. The system can accelerate yield learning by helping customers quickly distinguish critical defects from nuisance signals. SEMVision G7AP is already in production at memory and logic manufacturers supporting high-volume advanced packaging. A media kit with additional information on the new systems is available.