View ValuationUnited Microelectronics 향후 성장Future 기준 점검 3/6United Microelectronics (는) 각각 연간 13% 및 9.4% 수익과 수익이 증가할 것으로 예상됩니다. EPS는 연간 12.9% 만큼 성장할 것으로 예상됩니다. 자기자본이익률은 3년 후 16.9% 로 예상됩니다.핵심 정보13.0%이익 성장률12.92%EPS 성장률Semiconductor 이익 성장0%매출 성장률9.4%향후 자기자본이익률16.92%애널리스트 커버리지Good마지막 업데이트08 May 2026최근 향후 성장 업데이트업데이트 없음모든 업데이트 보기Recent updates공지 • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan공지 • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.공지 • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026공지 • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.공지 • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026공지 • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.공지 • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.공지 • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.공지 • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026공지 • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.공지 • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan공지 • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025공지 • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025공지 • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.공지 • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025공지 • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.공지 • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.공지 • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.공지 • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.공지 • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.공지 • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024이익 및 매출 성장 예측BMV:UMC N - 애널리스트 향후 추정치 및 과거 재무 데이터 (TWD Millions)날짜매출이익자유현금흐름영업현금흐름평균 애널리스트 수12/31/2028327,25575,76181,414128,7501312/31/2027305,08063,25872,456131,2252112/31/2026271,57953,87457,458109,026193/31/2026240,73250,11148,56098,020N/A12/31/2025237,55341,71649,13199,864N/A9/30/2025236,13040,15845,44699,838N/A6/30/2025237,48839,64831,79996,248N/A3/31/2025235,52944,53220,39696,878N/A12/31/2024232,30347,2112,52993,872N/A9/30/2024226,87551,909-6,18787,112N/A6/30/2024223,45953,408-5388,823N/A3/31/2024222,95655,263-13,22479,855N/A12/31/2023222,53360,990-8,02086,000N/A9/30/2023235,41069,143-8,565100,739N/A6/30/2023253,73380,1686,330121,376N/A3/31/2023269,49283,57440,762142,707N/A12/31/2022278,70589,47962,977145,861N/A9/30/2022269,96979,54670,428131,727N/A6/30/2022250,48470,01058,577114,157N/A3/31/2022229,33765,16048,978102,189N/A12/31/2021213,01151,24640,39290,352N/A9/30/2021199,20851,02732,41879,602N/A6/30/2021188,17242,67339,13676,015N/A3/31/2021181,65037,41037,05369,294N/A12/31/2020176,82122,86137,39165,745N/A9/30/2020173,37420,27866,44687,205N/A6/30/2020166,24214,10148,06865,588N/A3/31/2020157,88710,71344,50061,453N/A12/31/2019148,2028,155N/A54,904N/A9/30/2019141,8704,164N/A29,494N/A6/30/2019143,5182,956N/A48,345N/A3/31/2019146,3384,874N/A50,342N/A12/31/2018151,2537,678N/A50,935N/A9/30/2018152,36610,599N/A51,711N/A6/30/2018150,67812,351N/A47,387N/A3/31/2018149,36410,791N/A47,940N/A12/31/2017149,2859,677N/A52,474N/A9/30/2017150,96010,711N/A55,122N/A6/30/2017151,42510,213N/A57,563N/A3/31/2017150,88410,698N/A48,363N/A12/31/2016147,8708,621N/A46,450N/A9/30/2016143,4148,733N/A46,332N/A6/30/2016140,5707,467N/A48,722N/A3/31/2016141,5859,484N/A54,317N/A12/31/2015144,83013,254N/A59,788N/A9/30/2015148,21614,852N/A63,197N/A6/30/2015148,11016,060N/A58,958N/A더 보기애널리스트 향후 성장 전망수입 대 저축률: UMC N 의 연간 예상 수익 증가율(13%)이 saving rate(9%)보다 높습니다.수익 vs 시장: UMC N 의 연간 수익(13%)이 MX 시장(8.4%)보다 빠르게 성장할 것으로 예상됩니다.고성장 수익: UMC N 의 수입은 증가할 것으로 예상되지만 상당히 증가하지는 않을 것입니다.수익 대 시장: UMC N 의 수익(연간 9.4%)이 MX 시장(연간 5.9%)보다 빠르게 성장할 것으로 예상됩니다.고성장 매출: UMC N 의 수익(연간 9.4%)은 연간 20%보다 느리게 증가할 것으로 예상됩니다.주당순이익 성장 예측향후 자기자본이익률미래 ROE: UMC N의 자본 수익률은 3년 후 16.9%로 낮을 것으로 예상됩니다.성장 기업 찾아보기7D1Y7D1Y7D1YSemiconductors 산업의 고성장 기업.View Past Performance기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/09 11:48종가2026/02/27 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스United Microelectronics Corporation는 40명의 분석가가 다루고 있습니다. 이 중 21명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Brett SimpsonArete Research Services LLPAndrew LuBarclaysMark LiBernstein37명의 분석가 더 보기
공지 • Feb 26United Microelectronics Corporation, Annual General Meeting, May 27, 2026United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
공지 • Feb 24United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026.
공지 • Feb 13United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026
공지 • Jan 15Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 PlatformSilicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications.
공지 • Jan 05+ 2 more updatesUnited Microelectronics Corporation to Report Q3, 2026 Results on Oct 28, 2026United Microelectronics Corporation announced that they will report Q3, 2026 results on Oct 28, 2026
공지 • Nov 13Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass ProductionMetalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world.
공지 • Oct 22UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive ApplicationsUnited Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness.
공지 • Jun 04United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025.
공지 • May 01United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026
공지 • Apr 02GlobalFoundries, United Microelectronics Reportedly Consider MergerTaiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment.
공지 • Feb 27United Microelectronics Corporation, Annual General Meeting, May 28, 2025United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan
공지 • Feb 19United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025
공지 • Jan 03+ 2 more updatesUnited Microelectronics Corporation to Report Q1, 2025 Results on Apr 23, 2025United Microelectronics Corporation announced that they will report Q1, 2025 results at 1:30 PM, Taipei Standard Time on Apr 23, 2025
공지 • Dec 20Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million.Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited.
공지 • Oct 08United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025
공지 • Jun 13United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024.
공지 • May 31+ 3 more updatesUnited Microelectronics Corporation Announces Audit Committee ChangesUnited Microelectronics Corporation announced newly appoint members of the 6th term of Audit Committee. Name of the previous position holder: Wenyi Chu, Professor, Department of Business Administration, National Taiwan University, Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation, Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd., Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Name of the new position holder: Lih J. Chen, Distinguished Chair Professor, National Tsing Hua University, Jyuo-Min Shyu, Emeritus Professor, National Tsing Hua University, Independent Director, Qisda Corporation Kuang Si Shiu, Independent Director, Yuanta Financial Holdings Co. Ltd., Independent Director, Yuanta Commercial Bank Co. Ltd. Wen-Hsin Hsu, Professor, Department of Accounting, National Taiwan University, Independent Director, Unitech Printed Circuit Board Corp. Ling-Ling Wu, Professor, Department of Information Management, College of Management, National Taiwan University, Independent director, Hycon Technology Corp., Su Lin Wang, Independent director, Jess-Link products Co., Ltd, Independent director, AVerMedia Technologies Inc. Effective date of the new member is May 30, 2024.
공지 • May 03UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G EraUnited Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications.
공지 • Feb 29United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925.
공지 • Feb 28United Microelectronics Corporation, Annual General Meeting, May 30, 2024United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters.
공지 • Jan 02+ 2 more updatesUnited Microelectronics Corporation to Report Q2, 2024 Results on Jul 31, 2024United Microelectronics Corporation announced that they will report Q2, 2024 results on Jul 31, 2024