공고 • Jul 28
Qnity Electronics Launches Laird Tflex Cr910 Liquid Gap Filler and Laird Tgrease 3000 Thermal Grease Qnity Electronics, Inc. announced the launch of two new thermal interface materials (TIM): Laird Tflex CR910, a two-part dispensable liquid gap filler, and Tgrease 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Laird Tflex CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance. Laird Tgrease 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life. 공고 • Jul 24
Qnity Electronics, Inc. Announces Executive Changes, Effective August 3, 2026 Qnity Electronics, Inc. announced that it has appointed Katherine (Kate) Dei Cas as President of its Semiconductor Technologies business segment, effective August 3. Sam Ponzo, who has been serving as the segment’s Interim President, will return to his role as Qnity’s Chief Commercial & Strategy Officer at that time. Kate has more than 25 years of semiconductor industry experience. She joins Qnity from EMD Electronics, a division of Merck KGaA Darmstadt, Germany, where she most recently served as Executive Vice President and as a member of the Executive Team. 공고 • Jul 07
Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026 Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026 공고 • Jun 25
Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026 Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026. 공고 • Jun 23
Qnity Electronics Launches Advanced Packaging Innovation Hub Qnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging. 공고 • Jun 12
Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor Manufacturing Qnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection. 공고 • Jun 09
Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer Applications Qnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications. Upcoming Dividend • May 22
Upcoming dividend of US$0.08 per share Eligible shareholders must have bought the stock before 29 May 2026. Payment date: 15 June 2026. Payout ratio is a comfortable 4.5% and this is well supported by cash flows. Trailing yield: 0.2%. Lower than top quartile of Mexican dividend payers (5.7%). Lower than average of industry peers (0.5%). Reported Earnings • May 14
First quarter 2026 earnings released: EPS: US$0.72 (vs US$0.92 in 1Q 2025) First quarter 2026 results: EPS: US$0.72 (down from US$0.92 in 1Q 2025). Revenue: US$1.32b (up 18% from 1Q 2025). Net income: US$151.0m (down 22% from 1Q 2025). Profit margin: 12% (down from 17% in 1Q 2025). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 8.0% p.a. on average during the next 3 years, compared to a 22% growth forecast for the Global Semiconductor industry. 공고 • May 12
Qnity Electronics, Inc. Raises Earnings Guidance for the Full Year 2026 Qnity Electronics, Inc. raised earnings guidance for the full year 2026. For the year, the company expects its Net Sales to be in range of $5.225 Billion - $5.375 Billion. 공고 • Apr 16
Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Second Quarter 2026, Payable on June 15, 2026 Qnity Electronics, Inc. announced that its Board of Directors has declared a second quarterly dividend for 2026 of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on June 15, 2026 to stockholders of record on May 29, 2026. 공고 • Apr 07
Qnity Electronics, Inc. to Report Q1, 2026 Results on May 12, 2026 Qnity Electronics, Inc. announced that they will report Q1, 2026 results at 9:30 AM, US Eastern Standard Time on May 12, 2026 공고 • Feb 27
Qnity Electronics, Inc. (NYSE:Q) announces an Equity Buyback for $500 million worth of its shares. Qnity Electronics, Inc. (NYSE:Q) announces a share repurchase program. Under the program, the company will repurchase up to $500 million of outstanding common stock. The share repurchase program has no expiration date. Reported Earnings • Feb 27
Full year 2025 earnings released Full year 2025 results: EPS: US$3.30. Revenue: US$4.75b (up 9.7% from FY 2024). Net income: US$692.0m (flat on FY 2024). Profit margin: 15% (down from 16% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 6.5% p.a. on average during the next 3 years, compared to a 20% growth forecast for the Global Semiconductor industry. 공고 • Feb 06
Qnity Electronics, Inc. to Report Q4, 2025 Results on Feb 26, 2026 Qnity Electronics, Inc. announced that they will report Q4, 2025 results Pre-Market on Feb 26, 2026