View ValuationASE Technology Holding 향후 성장Future 기준 점검 5/6ASE Technology Holding (는) 각각 연간 36.6% 및 18.6% 수익과 수익이 증가할 것으로 예상됩니다. EPS는 연간 36.9% 만큼 성장할 것으로 예상됩니다. 자기자본이익률은 3년 후 25.9% 로 예상됩니다.핵심 정보36.6%이익 성장률36.89%EPS 성장률Semiconductor 이익 성장0%매출 성장률18.6%향후 자기자본이익률25.92%애널리스트 커버리지Good마지막 업데이트19 Jul 2026최근 향후 성장 업데이트업데이트 없음모든 업데이트 보기Recent updates공고 • Jul 13ASE Technology Holding Co., Ltd. to Report Q2, 2026 Results on Jul 30, 2026ASE Technology Holding Co., Ltd. announced that they will report Q2, 2026 results on Jul 30, 2026공고 • May 26Advanced Semiconductor Engineering, Inc. Launches Automated 310Mm Panel-Level Packaging Production LineAdvanced Semiconductor Engineering Inc. announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027. The automated panel-level packaging line supports 310mm × 310mm format and is compatible with advanced packaging platforms including FOCoS and FOCoS-Bridge, delivering line/space capabilities of 2/2µm and 8/8µm, respectively. By transitioning from traditional round wafers to rectangular panels, Advanced Semiconductor Engineering Inc. enables significantly greater usable area—up to 96,100 mm2 per panel—allowing for more dies per unit and improved material efficiency. This shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency. The larger panel format supports higher throughput and reduced cycle time, while enabling integration of increasingly complex multi-die architectures. These benefits are especially impactful for AI data center and HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate. The panel-level platform delivers higher throughput through large-area processing and reduced tool change steps, while offering a flexible foundation for heterogeneous integration and system-in-package (SiP) solutions. It supports a wide range of applications including AI, HPC, networking, high-end gaming, and edge AI, helping customers meet performance targets with greater manufacturing efficiency and faster time-to-market. The new solution also reinforces its competitive differentiation through faster cycle times, scalable manufacturing, and alignment with long-term industry roadmaps for chiplet-based architectures and large-form-factor integration. As the industry moves beyond the limitations of traditional wafer-based processes, Advanced Semiconductor Engineering Inc. continues to lead in delivering advanced packaging solutions that enable new levels of system performance and efficiency. Advanced Semiconductor Engineering Inc. will participate in the 76th IEEE Electronic Components and Technology Conference (ECTC) in Orlando, Florida, from May 26 to May 29, 2026.공고 • Mar 30ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 24, 2026ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 24, 2026, at 10:00 Taipei Standard Time. Location: chia ch`ang rd., nanzih district, kaohsiung city, Taiwan공고 • Oct 21ASE Technology Holding Co., Ltd. (TWSE:3711) signed a binding Memorandum of Understanding to acquire Linear Semiconductor Sdn Bhd from Analog Devices, Inc. (NasdaqGS:ADI).ASE Technology Holding Co., Ltd. (TWSE:3711) signed a binding Memorandum of Understanding to acquire Linear Semiconductor Sdn Bhd from Analog Devices, Inc. (NasdaqGS:ADI) on October 21, 2025. The transaction is subject to approval by regulatory board / committee and definitive agreement. The expected completion of the transaction is in the first calendar half of 2026.공고 • Jun 26ASE Technology Holding Co., Ltd. Announces Directorate ChangesASE Technology Holding Co., Ltd. held its annual shareholders' meeting on June 25, 2025, where a by-election was conducted for one member of the Board of Directors. The newly elected director is Chang Dan Yao Danielle. Title and name of the previous position holder: Director/Rutherford Chang. Resume of the previous position holder: Director of the Company and Director(representative) of Advanced Semiconductor Engineering Inc. Resume of the new position holder: Director(representative), Advanced Semiconductor Engineering Inc. Director, Universal Scientific Industrial (Shanghai) Co., Ltd. Director (representative), ASE Test Inc. and Director (representative), USI Inc. Reason for the change: By-election of a new director at the Annual Shareholders' Meeting Effective date of the new appointment: June 25, 2025.공고 • Jun 21+ 1 more updateASE Technology Holding Co., Ltd. has filed a Follow-on Equity Offering in the amount of TWD 10 billion.ASE Technology Holding Co., Ltd. has filed a Follow-on Equity Offering in the amount of TWD 10 billion. Security Name: Common Shares Security Type: Common Stock Securities Offered: 500,000,000 Price\Range: TWD 20 Transaction Features: Reserved Share Offering; Rights Offering공고 • May 03ASE Technology Holding Co., Ltd. to Report Q1, 2025 Results on May 12, 2025ASE Technology Holding Co., Ltd. announced that they will report Q1, 2025 results on May 12, 2025공고 • Apr 01ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 25, 2025ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 25, 2025, at 10:00 Taipei Standard Time. Location: no,600-4, chia ch`ang rd., nanzih district, kaohsiung city Taiwan공고 • Feb 15ASE Technology Holding Co., Ltd. to Report Fiscal Year 2024 Results on Feb 24, 2025ASE Technology Holding Co., Ltd. announced that they will report fiscal year 2024 results on Feb 24, 2025공고 • Feb 08ASE Technology Holding Co., Ltd. Announces Demise of Rutherford Chang, DirectorASE Technology Holding Co., Ltd. announced demise of Rutherford Chang, Director on Feb. 7, 2025. Title and name of the previous position holder: Rutherford Chang, Corporate Director of ASE Technology Holding Co., Ltd. Resume of the previous position holder: Corporate Director of ASE Technology Holding Co., Ltd. and the Director (Representative) of ASE Inc.공고 • Oct 30ASE Technology Holding Co., Ltd. to Report Q3, 2024 Results on Nov 06, 2024ASE Technology Holding Co., Ltd. announced that they will report Q3, 2024 results on Nov 06, 2024공고 • Jul 25ASE Technology Holding Co., Ltd. to Report Q2, 2024 Results on Jul 25, 2024ASE Technology Holding Co., Ltd. announced that they will report Q2, 2024 results on Jul 25, 2024공고 • Jun 27ASE Technology Holding Co., Ltd. Approves Change of Directors Chi-Wen Tsai, Joseph Tung, Ramond Lo, TS Chen, Yen-Chun ChangASE Technology Holding Co., Ltd. elected Andrew Tang/Group Procurement Officer of the Company, Vice Chairman and Vice CEO of Advanced Semiconductor Engineering Inc. as Director in place of Chi-Wen Tsai, Joseph Tung, Ramond Lo, TS Chen and Yen-Chun Chang. Effective date of the new appointment June 27, 2024.공고 • Mar 30ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 26, 2024ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 26, 2024. Location: Zhuang Jing Auditorium, 600-4 Jiachang Road, Nantze District, Kaohsiung City, Taiwan Kaohiusng Taiwan Agenda: To report the Company's 2023 Business Report; To report by Audit Committee on review of the 2023 Annual Accounting Final Reports and Statements; To consider The Company's report on the 2023 distribution of employee compensation and director remuneration.공고 • Oct 25ASE Technology Holding Co., Ltd. on Behalf of Subsidiary Financiere AFG Announces the Resignation of Nicolas Denis as CEO, Effective December 1, 2023ASE Technology Holding Co., Ltd. on behalf of subsidiary Financiere AFG announced the resignation of Nicolas Denis, the legal representative of ASTEELFLASH FRANCE as CEO. Effective December 1, 2023.공고 • Jun 01ASE Technology Holding Co., Ltd. Announces Cash Dividend, Payable on July 27, 2023ASE Technology Holding Co., Ltd. announced total amount of cash dividend is TWD 38,482,082,645. Ex-rights (ex-dividend) trading date is June 30, 2023. Ex-rights (ex-dividend) record date is July 08, 2023. Payment date of cash dividend distribution is July 27, 2023.공고 • May 17ASE Technology Holding Co., Ltd., Annual General Meeting, May 16, 2023ASE Technology Holding Co., Ltd., Annual General Meeting, May 16, 2023. Agenda: To ratify the proposal of 2022 earnings distribution of ASE Inc.; and to ratify 2022 Business Report and Financial Statements of ASE Inc.이익 및 매출 성장 예측BMV:ASEH N - 애널리스트 향후 추정치 및 과거 재무 데이터 (TWD Millions)날짜매출이익자유현금흐름영업현금흐름평균 애널리스트 수12/31/20281,125,867136,970-13,333237,2011012/31/2027960,132112,520-73,997209,3121612/31/2026792,58475,192-112,545163,546163/31/2026670,89747,252-15,836158,663N/A12/31/2025645,38840,658-23,401142,249N/A9/30/2025629,73635,257-53,154106,689N/A6/30/2025621,27234,120-20,347114,126N/A3/31/2025610,76034,376-11,43794,067N/A12/31/2024595,41032,4829,70990,788N/A9/30/2024593,72732,56242,044102,370N/A6/30/2024587,78931,60646,541101,188N/A3/31/2024583,82631,56948,472100,358N/A12/31/2023581,91431,72559,878114,422N/A9/30/2023598,75138,06454,913117,770N/A6/30/2023633,20946,75349,649115,508N/A3/31/2023657,37355,00043,464114,579N/A12/31/2022670,87362,09037,983111,001N/A9/30/2022666,39273,51824,24893,743N/A6/30/2022628,43170,23017,33489,958N/A3/31/2022594,91864,58018,55493,163N/A12/31/2021569,99760,1509,76081,734N/A9/30/2021545,93843,0365,33876,937N/A6/30/2021518,46935,5729,16875,590N/A3/31/2021499,09132,17113,53377,364N/A12/31/2020476,97926,97112,00975,061N/A9/30/2020444,12423,93214,51878,523N/A6/30/2020438,48622,95310,47478,116N/A3/31/2020421,67818,7057,08069,734N/A12/31/2019413,18216,850N/A72,303N/A9/30/2019411,18815,913N/A59,570N/A6/30/2019401,22816,436N/A63,764N/A3/31/2019394,98825,209N/A58,360N/A12/31/2018371,09225,262N/A51,075N/A9/30/2018341,05026,061N/A46,386N/A6/30/2018307,33126,141N/A38,624N/A3/31/2018288,85622,525N/A40,074N/A12/31/2017290,44122,988N/A47,431N/A9/30/2017283,58423,727N/A48,665N/A6/30/2017282,48923,547N/A52,055N/A3/31/2017279,06420,001N/A54,184N/A12/31/2016274,88421,324N/A52,108N/A9/30/2016273,30418,566N/A59,957N/A6/30/2016273,39019,796N/A57,792N/A3/31/2016281,01119,145N/A55,535N/A12/31/2015283,30319,732N/A57,548N/A9/30/2015284,39923,370N/A47,182N/A더 보기애널리스트 향후 성장 전망수입 대 저축률: ASEH N 의 연간 예상 수익 증가율(36.6%)이 saving rate(9%)보다 높습니다.수익 vs 시장: ASEH N 의 연간 수익(36.6%)이 MX 시장(8%)보다 빠르게 성장할 것으로 예상됩니다.고성장 수익: ASEH N 의 수입은 향후 3년 동안 상당히 증가할 것으로 예상됩니다.수익 대 시장: ASEH N 의 수익(연간 18.6%)이 MX 시장(연간 5.8%)보다 빠르게 성장할 것으로 예상됩니다.고성장 매출: ASEH N 의 수익(연간 18.6%)은 연간 20%보다 느리게 증가할 것으로 예상됩니다.주당순이익 성장 예측향후 자기자본이익률미래 ROE: ASEH N의 자본 수익률은 3년 후 25.9%로 높을 것으로 예상됩니다.성장 기업 찾아보기7D1Y7D1Y7D1YSemiconductors 산업의 고성장 기업.View Past Performance기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/07/24 20:37종가2026/06/03 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델의 세부 정보는 당사의 GitHub 페이지에서 확인하실 수 있습니다. 또한 보고서 사용 방법에 대한 가이드와 YouTube 튜토리얼도 제공하고 있습니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스ASE Technology Holding Co., Ltd.는 36명의 분석가가 다루고 있습니다. 이 중 16명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Stefan ChangAletheia Analyst Network LimitedAndrew LuBarclaysMark LiBernstein33명의 분석가 더 보기
공고 • Jul 13ASE Technology Holding Co., Ltd. to Report Q2, 2026 Results on Jul 30, 2026ASE Technology Holding Co., Ltd. announced that they will report Q2, 2026 results on Jul 30, 2026
공고 • May 26Advanced Semiconductor Engineering, Inc. Launches Automated 310Mm Panel-Level Packaging Production LineAdvanced Semiconductor Engineering Inc. announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027. The automated panel-level packaging line supports 310mm × 310mm format and is compatible with advanced packaging platforms including FOCoS and FOCoS-Bridge, delivering line/space capabilities of 2/2µm and 8/8µm, respectively. By transitioning from traditional round wafers to rectangular panels, Advanced Semiconductor Engineering Inc. enables significantly greater usable area—up to 96,100 mm2 per panel—allowing for more dies per unit and improved material efficiency. This shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency. The larger panel format supports higher throughput and reduced cycle time, while enabling integration of increasingly complex multi-die architectures. These benefits are especially impactful for AI data center and HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate. The panel-level platform delivers higher throughput through large-area processing and reduced tool change steps, while offering a flexible foundation for heterogeneous integration and system-in-package (SiP) solutions. It supports a wide range of applications including AI, HPC, networking, high-end gaming, and edge AI, helping customers meet performance targets with greater manufacturing efficiency and faster time-to-market. The new solution also reinforces its competitive differentiation through faster cycle times, scalable manufacturing, and alignment with long-term industry roadmaps for chiplet-based architectures and large-form-factor integration. As the industry moves beyond the limitations of traditional wafer-based processes, Advanced Semiconductor Engineering Inc. continues to lead in delivering advanced packaging solutions that enable new levels of system performance and efficiency. Advanced Semiconductor Engineering Inc. will participate in the 76th IEEE Electronic Components and Technology Conference (ECTC) in Orlando, Florida, from May 26 to May 29, 2026.
공고 • Mar 30ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 24, 2026ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 24, 2026, at 10:00 Taipei Standard Time. Location: chia ch`ang rd., nanzih district, kaohsiung city, Taiwan
공고 • Oct 21ASE Technology Holding Co., Ltd. (TWSE:3711) signed a binding Memorandum of Understanding to acquire Linear Semiconductor Sdn Bhd from Analog Devices, Inc. (NasdaqGS:ADI).ASE Technology Holding Co., Ltd. (TWSE:3711) signed a binding Memorandum of Understanding to acquire Linear Semiconductor Sdn Bhd from Analog Devices, Inc. (NasdaqGS:ADI) on October 21, 2025. The transaction is subject to approval by regulatory board / committee and definitive agreement. The expected completion of the transaction is in the first calendar half of 2026.
공고 • Jun 26ASE Technology Holding Co., Ltd. Announces Directorate ChangesASE Technology Holding Co., Ltd. held its annual shareholders' meeting on June 25, 2025, where a by-election was conducted for one member of the Board of Directors. The newly elected director is Chang Dan Yao Danielle. Title and name of the previous position holder: Director/Rutherford Chang. Resume of the previous position holder: Director of the Company and Director(representative) of Advanced Semiconductor Engineering Inc. Resume of the new position holder: Director(representative), Advanced Semiconductor Engineering Inc. Director, Universal Scientific Industrial (Shanghai) Co., Ltd. Director (representative), ASE Test Inc. and Director (representative), USI Inc. Reason for the change: By-election of a new director at the Annual Shareholders' Meeting Effective date of the new appointment: June 25, 2025.
공고 • Jun 21+ 1 more updateASE Technology Holding Co., Ltd. has filed a Follow-on Equity Offering in the amount of TWD 10 billion.ASE Technology Holding Co., Ltd. has filed a Follow-on Equity Offering in the amount of TWD 10 billion. Security Name: Common Shares Security Type: Common Stock Securities Offered: 500,000,000 Price\Range: TWD 20 Transaction Features: Reserved Share Offering; Rights Offering
공고 • May 03ASE Technology Holding Co., Ltd. to Report Q1, 2025 Results on May 12, 2025ASE Technology Holding Co., Ltd. announced that they will report Q1, 2025 results on May 12, 2025
공고 • Apr 01ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 25, 2025ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 25, 2025, at 10:00 Taipei Standard Time. Location: no,600-4, chia ch`ang rd., nanzih district, kaohsiung city Taiwan
공고 • Feb 15ASE Technology Holding Co., Ltd. to Report Fiscal Year 2024 Results on Feb 24, 2025ASE Technology Holding Co., Ltd. announced that they will report fiscal year 2024 results on Feb 24, 2025
공고 • Feb 08ASE Technology Holding Co., Ltd. Announces Demise of Rutherford Chang, DirectorASE Technology Holding Co., Ltd. announced demise of Rutherford Chang, Director on Feb. 7, 2025. Title and name of the previous position holder: Rutherford Chang, Corporate Director of ASE Technology Holding Co., Ltd. Resume of the previous position holder: Corporate Director of ASE Technology Holding Co., Ltd. and the Director (Representative) of ASE Inc.
공고 • Oct 30ASE Technology Holding Co., Ltd. to Report Q3, 2024 Results on Nov 06, 2024ASE Technology Holding Co., Ltd. announced that they will report Q3, 2024 results on Nov 06, 2024
공고 • Jul 25ASE Technology Holding Co., Ltd. to Report Q2, 2024 Results on Jul 25, 2024ASE Technology Holding Co., Ltd. announced that they will report Q2, 2024 results on Jul 25, 2024
공고 • Jun 27ASE Technology Holding Co., Ltd. Approves Change of Directors Chi-Wen Tsai, Joseph Tung, Ramond Lo, TS Chen, Yen-Chun ChangASE Technology Holding Co., Ltd. elected Andrew Tang/Group Procurement Officer of the Company, Vice Chairman and Vice CEO of Advanced Semiconductor Engineering Inc. as Director in place of Chi-Wen Tsai, Joseph Tung, Ramond Lo, TS Chen and Yen-Chun Chang. Effective date of the new appointment June 27, 2024.
공고 • Mar 30ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 26, 2024ASE Technology Holding Co., Ltd., Annual General Meeting, Jun 26, 2024. Location: Zhuang Jing Auditorium, 600-4 Jiachang Road, Nantze District, Kaohsiung City, Taiwan Kaohiusng Taiwan Agenda: To report the Company's 2023 Business Report; To report by Audit Committee on review of the 2023 Annual Accounting Final Reports and Statements; To consider The Company's report on the 2023 distribution of employee compensation and director remuneration.
공고 • Oct 25ASE Technology Holding Co., Ltd. on Behalf of Subsidiary Financiere AFG Announces the Resignation of Nicolas Denis as CEO, Effective December 1, 2023ASE Technology Holding Co., Ltd. on behalf of subsidiary Financiere AFG announced the resignation of Nicolas Denis, the legal representative of ASTEELFLASH FRANCE as CEO. Effective December 1, 2023.
공고 • Jun 01ASE Technology Holding Co., Ltd. Announces Cash Dividend, Payable on July 27, 2023ASE Technology Holding Co., Ltd. announced total amount of cash dividend is TWD 38,482,082,645. Ex-rights (ex-dividend) trading date is June 30, 2023. Ex-rights (ex-dividend) record date is July 08, 2023. Payment date of cash dividend distribution is July 27, 2023.
공고 • May 17ASE Technology Holding Co., Ltd., Annual General Meeting, May 16, 2023ASE Technology Holding Co., Ltd., Annual General Meeting, May 16, 2023. Agenda: To ratify the proposal of 2022 earnings distribution of ASE Inc.; and to ratify 2022 Business Report and Financial Statements of ASE Inc.