공고 • Jul 16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
Cadence introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing. With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack, InnoStack and ViraStack AI Super Agents. The AuraStack AI Super Agent brings together automation and optimization for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability and multiphysics analysis across Cadence’s system design and analysis portfolio. It introduces a unified, AI-driven multiphysics foundation that concurrently models and optimizes electrical, thermal and mechanical behavior—including SI/PI, thermal, mechanical stress, drop, vibration and fatigue analysis—within a closed-loop environment, enabling earlier tradeoff evaluation and product-level optimization across the entire design flow. This continuous multiphysics feedback loop enables real-time design convergence, reducing late-stage surprises and improving overall system reliability. The AuraStack AI Super Agent’s key benefits include: Accelerating time to market by 2X, with 15X productivity and multiphysics-driven quality—automating complex tasks, expanding design exploration. Unifying separate engineering teams around a shared, multiphysics-aware design environment with a single source of truth across domains. Advancing early and continuous multiphysics co-optimization to reduce late-stage rework and costly design iterations. Unifies Cadence multiphysics signoff solutions, such as Celsius Thermal Solver, Clarity 3D Solver for 3D-EM, MSC Nastran and Marc Linear and Non-Linear Finite Element Analysis Solvers for mechanical analysis, and Sigrity X Platform for signal and power integrity. Limiting expensive respins by identifying system issues earlier in development. Enabling product-level optimization, including co-optimization with advanced packaging approaches. Cadence is collaborating with industry leaders to deploy AuraStack AI Super Agent workflows for real-world advanced IC packaging and PCB design challenges. NVIDIA is using Cadence to help automate and optimize increasingly complex system design workflows for its engineering teams. Cadence is partnering with TSMC to help customers accelerate advanced package implementation through AI-driven automation, enabling timely design convergence for increasingly complex multi-die systems. Socionext is leveraging Cadence to accelerate the automation and optimization of increasingly complex semiconductor package and PCB design workflows. FORVIA HELLA continues to advance intelligent, sustainable mobility solutions that will define the future of automotive technology. Schneider Electric is collaborating with Cadence to apply AI-driven design automation and engineering expertise to accelerate electronic design workflows and scale institutional knowledge across engineering teams. The Cadence AuraStack AI Super Agent will be available in 2026.