View Financial HealthSUSS MicroTec 배당 및 자사주 매입배당 기준 점검 0/6SUSS MicroTec 은(는) 현재 수익률이 0.34% 인 배당금 지급 회사입니다.핵심 정보0.3%배당 수익률n/a자사주 매입 수익률총 주주 수익률n/a미래 배당 수익률0.7%배당 성장률11.1%다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향16%최근 배당 및 자사주 매입 업데이트Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.공시 • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.공시 • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.공시 • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.모든 업데이트 보기Recent updatesDeclared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.공시 • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.공시 • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026공시 • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.공시 • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026공시 • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.공시 • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.공시 • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.공시 • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.공시 • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025공시 • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025Valuation Update With 7 Day Price Move • Feb 27Investor sentiment improves as stock rises 30%After last week's 30% share price gain to €40.90, the stock trades at a forward P/E ratio of 20x. Average trailing P/E is 23x in the Semiconductor industry in Europe. Total returns to shareholders of 85% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €36.58 per share.공시 • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: SMHND UK 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: SMHND UK 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장SUSS MicroTec 배당 수익률 vs 시장SMHND의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (SMHND)0.3%시장 하위 25% (GB)2.2%시장 상위 25% (GB)5.7%업계 평균 (Semiconductor)0.5%분석가 예측 (SMHND) (최대 3년)0.7%주목할만한 배당금: SMHND 의 배당금( 0.34% )은 UK 시장에서 배당금 지급자의 하위 25%( 2.19% )와 비교해 주목할 만하지 않습니다.고배당: SMHND 의 배당금( 0.34% )은 UK 시장에서 배당금 지급자의 상위 25%( 5.71% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: SMHND UK 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: SMHND 배당금을 지급하고 있지만 회사에는 잉여현금흐름이 없습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YGB 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/06/11 10:33종가2026/05/20 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스SUSS MicroTec SE는 17명의 분석가가 다루고 있습니다. 이 중 8명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관Guenther HollfelderBaader Helvea Equity ResearchNicole WinklerBerenbergTammy QiuBerenberg14명의 분석가 더 보기
Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.
공시 • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.
공시 • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.
공시 • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.
Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.
공시 • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.
공시 • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026
공시 • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.
공시 • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026
공시 • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.
공시 • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.
공시 • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.
공시 • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.
공시 • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025
공시 • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025
Valuation Update With 7 Day Price Move • Feb 27Investor sentiment improves as stock rises 30%After last week's 30% share price gain to €40.90, the stock trades at a forward P/E ratio of 20x. Average trailing P/E is 23x in the Semiconductor industry in Europe. Total returns to shareholders of 85% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €36.58 per share.
공시 • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.