View Financial HealthQnity Electronics 배당 및 자사주 매입배당 기준 점검 0/6Qnity Electronics 은(는) 현재 수익률이 0.24% 인 배당금 지급 회사입니다.핵심 정보0.2%배당 수익률0.1%자사주 매입 수익률총 주주 수익률0.4%미래 배당 수익률0.3%배당 성장률n/a다음 배당 지급일n/a배당락일n/a주당 배당금n/a배당 성향5%최근 배당 및 자사주 매입 업데이트공고 • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.모든 업데이트 보기Recent updates공고 • Jul 28Qnity Electronics Launches Laird Tflex Cr910 Liquid Gap Filler and Laird Tgrease 3000 Thermal GreaseQnity Electronics, Inc. announced the launch of two new thermal interface materials (TIM): Laird Tflex CR910, a two-part dispensable liquid gap filler, and Tgrease 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Laird Tflex CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance. Laird Tgrease 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.공고 • Jul 24Qnity Electronics, Inc. Announces Executive Changes, Effective August 3, 2026Qnity Electronics, Inc. announced that it has appointed Katherine (Kate) Dei Cas as President of its Semiconductor Technologies business segment, effective August 3. Sam Ponzo, who has been serving as the segment’s Interim President, will return to his role as Qnity’s Chief Commercial & Strategy Officer at that time. Kate has more than 25 years of semiconductor industry experience. She joins Qnity from EMD Electronics, a division of Merck KGaA Darmstadt, Germany, where she most recently served as Executive Vice President and as a member of the Executive Team.공고 • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026공고 • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.공고 • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.Valuation Update With 7 Day Price Move • Jun 22Investor sentiment improves as stock rises 28%After last week's 28% share price gain to €154, the stock trades at a forward P/E ratio of 45x. Average forward P/E is 47x in the Semiconductor industry in Germany.공고 • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.공고 • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.지급의 안정성과 성장배당 데이터 가져오는 중안정적인 배당: Z5O German 시장에서 주목할만한 배당금을 지급하지 않으므로 지급이 안정적인지 확인할 필요가 없습니다.배당금 증가: Z5O German 시장에서 주목할만한 배당금을 지급하지 않으므로 지급액이 증가하는지 확인할 필요가 없습니다.배당 수익률 vs 시장Qnity Electronics 배당 수익률 vs 시장Z5O의 배당 수익률은 시장과 어떻게 비교되나요?구분배당 수익률회사 (Z5O)0.2%시장 하위 25% (DE)1.5%시장 상위 25% (DE)4.7%업계 평균 (Semiconductor)0.6%분석가 예측 (Z5O) (최대 3년)0.3%주목할만한 배당금: Z5O 의 배당금( 0.24% )은 German 시장에서 배당금 지급자의 하위 25%( 1.54% )와 비교해 주목할 만하지 않습니다.고배당: Z5O 의 배당금( 0.24% )은 German 시장에서 배당금 지급자의 상위 25%( 4.69% )와 비교해 낮습니다.주주 대상 이익 배당수익 보장: Z5O German 시장에서 주목할만한 배당금을 지급하지 않습니다.주주 현금 배당현금 흐름 범위: Z5O German 시장에서 주목할만한 배당금을 지급하지 않습니다.높은 배당을 제공하는 우량 기업 찾기7D1Y7D1Y7D1YDE 시장에서 배당이 강한 기업.View Management기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/07/31 07:53종가2026/07/31 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델의 세부 정보는 당사의 GitHub 페이지에서 확인하실 수 있습니다. 또한 보고서 사용 방법에 대한 가이드와 YouTube 튜토리얼도 제공하고 있습니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Qnity Electronics, Inc.는 9명의 분석가가 다루고 있습니다. 이 중 7명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관John McNultyBMO Capital Markets Equity ResearchBhavesh LodayaBMO Capital Markets Equity ResearchMelissa WeathersDeutsche Bank6명의 분석가 더 보기
공고 • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.
공고 • Jul 28Qnity Electronics Launches Laird Tflex Cr910 Liquid Gap Filler and Laird Tgrease 3000 Thermal GreaseQnity Electronics, Inc. announced the launch of two new thermal interface materials (TIM): Laird Tflex CR910, a two-part dispensable liquid gap filler, and Tgrease 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Laird Tflex CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance. Laird Tgrease 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.
공고 • Jul 24Qnity Electronics, Inc. Announces Executive Changes, Effective August 3, 2026Qnity Electronics, Inc. announced that it has appointed Katherine (Kate) Dei Cas as President of its Semiconductor Technologies business segment, effective August 3. Sam Ponzo, who has been serving as the segment’s Interim President, will return to his role as Qnity’s Chief Commercial & Strategy Officer at that time. Kate has more than 25 years of semiconductor industry experience. She joins Qnity from EMD Electronics, a division of Merck KGaA Darmstadt, Germany, where she most recently served as Executive Vice President and as a member of the Executive Team.
공고 • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026
공고 • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.
공고 • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.
Valuation Update With 7 Day Price Move • Jun 22Investor sentiment improves as stock rises 28%After last week's 28% share price gain to €154, the stock trades at a forward P/E ratio of 45x. Average forward P/E is 47x in the Semiconductor industry in Germany.
공고 • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.
공고 • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.