View ValuationTexas Instruments 향후 성장Future 기준 점검 4/6Texas Instruments (는) 각각 연간 15.8% 및 10.4% 수익과 수익이 증가할 것으로 예상됩니다. EPS는 연간 16.4% 만큼 성장할 것으로 예상됩니다. 자기자본이익률은 3년 후 44.1% 로 예상됩니다.핵심 정보15.8%이익 성장률16.38%EPS 성장률Semiconductor 이익 성장20.4%매출 성장률10.4%향후 자기자본이익률44.14%애널리스트 커버리지Good마지막 업데이트05 May 2026최근 향후 성장 업데이트공지 • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.모든 업데이트 보기Recent updates공지 • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.공지 • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).공지 • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.공지 • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.공지 • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United StatesRecent Insider Transactions • Feb 13Insider recently sold CHF1.7m worth of stockOn the 10th of February, Mark Gary sold around 10k shares on-market at roughly CHF169 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of CHF4.2m more than they bought in the last 12 months.Reported Earnings • Feb 10Full year 2025 earnings released: EPS: US$5.47 (vs US$5.24 in FY 2024)Full year 2025 results: EPS: US$5.47 (up from US$5.24 in FY 2024). Revenue: US$17.7b (up 13% from FY 2024). Net income: US$4.97b (up 4.1% from FY 2024). Profit margin: 28% (down from 31% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 9.6% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe.공지 • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.공지 • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.공지 • Jan 16Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026.공지 • Jan 05Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous VehiclesTexas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models.이익 및 매출 성장 예측SWX:TXN - 애널리스트 향후 추정치 및 과거 재무 데이터 (USD Millions)날짜매출이익자유현금흐름영업현금흐름평균 애널리스트 수12/31/202825,3639,0189,46212,2102012/31/202723,1548,0718,51610,9363512/31/202620,9997,0377,3599,466333/31/202618,4385,3363,7217,824N/A12/31/202517,6824,9732,6037,153N/A9/30/202517,2665,0162,0806,897N/A6/30/202516,6755,0151,5036,439N/A3/31/202516,0494,8481,4556,150N/A12/31/202415,6414,7751,4986,318N/A9/30/202415,7114,9401,4686,244N/A6/30/202416,0925,2841,4946,449N/A3/31/202416,8015,8779406,277N/A12/31/202317,5196,4761,3496,420N/A9/30/202318,1127,0641,6486,538N/A6/30/202318,8217,6493,1827,367N/A3/31/202319,5028,2164,4007,736N/A12/31/202220,0288,7095,9238,720N/A9/30/202220,1908,8855,9239,035N/A6/30/202219,5928,5405,8898,697N/A3/31/202218,9608,1836,4539,050N/A12/31/202118,3447,7366,2948,756N/A9/30/202117,5887,2887,1328,524N/A6/30/202116,7626,6966,4877,539N/A3/31/202115,4216,1456,3427,138N/A12/31/202014,4615,5685,4906,139N/A9/30/202013,7354,9515,1685,768N/A6/30/202013,6895,0215,7146,317N/A3/31/202014,1184,9445,6366,393N/A12/31/201914,3834,985N/A6,649N/A9/30/201914,7505,152N/A7,040N/A6/30/201915,2405,294N/A7,154N/A3/31/201915,5895,391N/A7,184N/A12/31/201815,7845,537N/A7,189N/A9/30/201815,8174,649N/A6,973N/A6/30/201815,6724,363N/A6,589N/A3/31/201815,3484,016N/A5,680N/A12/31/201714,9613,648N/A5,363N/A9/30/201714,6254,339N/A4,821N/A6/30/201714,1844,072N/A4,564N/A3/31/201713,7643,835N/A4,756N/A12/31/201613,3703,550N/A4,614N/A9/30/201613,1453,341N/A4,786N/A6/30/201612,8993,121N/A4,730N/A3/31/201612,8582,998N/A4,441N/A12/31/201513,0002,943N/A4,397N/A9/30/201513,0802,931N/A4,110N/A6/30/201513,1522,958N/A4,084N/A더 보기애널리스트 향후 성장 전망수입 대 저축률: TXN 의 연간 예상 수익 증가율(15.8%)이 saving rate(0.6%)보다 높습니다.수익 vs 시장: TXN 의 연간 수익(15.8%)이 Swiss 시장(10.7%)보다 빠르게 성장할 것으로 예상됩니다.고성장 수익: TXN 의 수입은 증가할 것으로 예상되지만 상당히 증가하지는 않을 것입니다.수익 대 시장: TXN 의 수익(연간 10.4%)이 Swiss 시장(연간 4.9%)보다 빠르게 성장할 것으로 예상됩니다.고성장 매출: TXN 의 수익(연간 10.4%)은 연간 20%보다 느리게 증가할 것으로 예상됩니다.주당순이익 성장 예측향후 자기자본이익률미래 ROE: TXN의 자본 수익률은 3년 후 44.1%로 매우 높을 것으로 예상됩니다.성장 기업 찾아보기7D1Y7D1Y7D1YSemiconductors 산업의 고성장 기업.View Past Performance기업 분석 및 재무 데이터 상태데이터최종 업데이트 (UTC 시간)기업 분석2026/05/07 15:07종가2026/05/07 00:00수익2026/03/31연간 수익2025/12/31데이터 소스당사의 기업 분석에 사용되는 데이터는 S&P Global Market Intelligence LLC에서 제공됩니다. 아래 데이터는 이 보고서를 생성하기 위해 분석 모델에서 사용됩니다. 데이터는 정규화되므로 소스가 제공된 후 지연이 발생할 수 있습니다.패키지데이터기간미국 소스 예시 *기업 재무제표10년손익계산서현금흐름표대차대조표SEC 양식 10-KSEC 양식 10-Q분석가 컨센서스 추정치+3년재무 예측분석가 목표주가분석가 리서치 보고서Blue Matrix시장 가격30년주가배당, 분할 및 기타 조치ICE 시장 데이터SEC 양식 S-1지분 구조10년주요 주주내부자 거래SEC 양식 4SEC 양식 13D경영진10년리더십 팀이사회SEC 양식 10-KSEC 양식 DEF 14A주요 개발10년회사 공시SEC 양식 8-K* 미국 증권에 대한 예시이며, 비(非)미국 증권에는 해당 국가의 규제 서식 및 자료원을 사용합니다.별도로 명시되지 않는 한 모든 재무 데이터는 연간 기간을 기준으로 하지만 분기별로 업데이트됩니다. 이를 TTM(최근 12개월) 또는 LTM(지난 12개월) 데이터라고 합니다. 자세히 알아보기.분석 모델 및 스노우플레이크이 보고서를 생성하는 데 사용된 분석 모델에 대한 자세한 내용은 당사의 Github 페이지에서 확인하실 수 있습니다. 또한 보고서 활용 방법에 대한 가이드와 YouTube 튜토리얼도 제공합니다.Simply Wall St 분석 모델을 설계하고 구축한 세계적 수준의 팀에 대해 알아보세요.산업 및 섹터 지표산업 및 섹터 지표는 Simply Wall St가 6시간마다 계산하며, 프로세스에 대한 자세한 내용은 Github에서 확인할 수 있습니다.분석가 소스Texas Instruments Incorporated는 65명의 분석가가 다루고 있습니다. 이 중 35명의 분석가가 우리 보고서에 입력 데이터로 사용되는 매출 또는 수익 추정치를 제출했습니다. 분석가의 제출 자료는 하루 종일 업데이트됩니다.분석가기관George ChangAletheia Analyst Network LimitedAlexi UngerArete Research Services LLPBrett SimpsonArete Research Services LLP62명의 분석가 더 보기
공지 • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.
공지 • Apr 17Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026.
공지 • Mar 23Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield TechnologyTexas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V).
공지 • Mar 17Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIATexas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.
공지 • Mar 10Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence CapabilitiesTexas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available.
공지 • Mar 05Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States
Recent Insider Transactions • Feb 13Insider recently sold CHF1.7m worth of stockOn the 10th of February, Mark Gary sold around 10k shares on-market at roughly CHF169 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of CHF4.2m more than they bought in the last 12 months.
Reported Earnings • Feb 10Full year 2025 earnings released: EPS: US$5.47 (vs US$5.24 in FY 2024)Full year 2025 results: EPS: US$5.47 (up from US$5.24 in FY 2024). Revenue: US$17.7b (up 13% from FY 2024). Net income: US$4.97b (up 4.1% from FY 2024). Profit margin: 28% (down from 31% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 9.6% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe.
공지 • Feb 04+ 1 more updateTexas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion.Texas Instruments Incorporated (NasdaqGS:TXN) signed a definitive agreement to acquire Silicon Laboratories Inc. (NasdaqGS:SLAB) for approximately $7.8 billion on February 4, 2026. A cash consideration valued at $231 per share will be paid by Texas Instruments Incorporated. The acquisition will create a global leader in embedded wireless connectivity solutions by combining Silicon Labs’ strong portfolio and expertise in mixed signal solutions with Texas Instruments’ leading analog and embedded processing portfolio and internally owned technology and manufacturing capabilities. The combined company will accelerate growth by better serving existing and new customers through enhanced innovation and market access. Texas Instruments expects to fund the transaction with a combination of cash on hand and debt financing to be arranged prior to closing. Upon termination of the Merger Agreement, the Company, under specified circumstances, including termination by the Company to accept a Superior Proposal or termination by Parent if the Board effects a Change of Recommendation, will be required to pay to Parent a termination fee of $259 million. Additionally, Parent, under specified circumstances, including termination due to any Legal Restraint (solely to the extent such Legal Restraint relates to any Regulatory Law) permanently enjoining consummation of the Merger or failure to receive certain required regulatory approvals by the Termination Date (in each case, if all other conditions to closing have been satisfied or waived, other than conditions that by their nature are to be satisfied at the Closing), will be required to pay the Company a termination fee of $499 million. Under the terms of the agreement, which has been unanimously approved by the Board of Directors of both companies. The transaction is not subject to any financing contingency, the expiration or termination of the required waiting periods under the Hart-Scott-Rodino Antitrust Improvements Act of 1976. The transaction is expected to be accretive to Texas Instruments’ earnings per share, excluding transaction-related costs, in the first full year post-close. Goldman Sachs & Co. LLC is serving as exclusive financial advisor to Texas Instruments, Joele Frank, Wilkinson Brimmer Katcher is serving as strategic communications advisor. Qatalyst Partners is serving as exclusive financial advisor to Silicon Labs, and FGS Global is serving as strategic communications advisor. Robert J. Cardone, Alain A. Dermarkar, Michael Walraven of Allen Overy Shearman Sterling US LLP acted as legal advisor to Texas Instruments. Amanda Maki, Andy Eklund, Jennifer M. Kashatus, Nicholas Klein, Brian Hamano, Jamie Knox, Ronald N. Brown, III, Brian J. Boyle, Jeffrey D. Aronson, Michelle Lara, Jeffrey Scharfstein, John J. Gilluly III and Viktor Sapezhnikov of DLA Piper LLP (US) acted as legal advisor to Silicon Laboratories.
공지 • Jan 29Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48.
공지 • Jan 16Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026.
공지 • Jan 05Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous VehiclesTexas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models.