View Past PerformanceTDK バランスシートの健全性財務の健全性 基準チェック /66TDKの総株主資本は¥2,203.5B 、総負債は¥543.6Bで、負債比率は24.7%となります。総資産と総負債はそれぞれ¥4,415.2Bと¥2,211.6Bです。 TDKの EBIT は¥272.4Bで、利息カバレッジ比率-72です。現金および短期投資は¥842.8Bです。主要情報24.67%負債資本比率JP¥543.63b負債インタレスト・カバレッジ・レシオ-72x現金JP¥842.78bエクイティJP¥2.20t負債合計JP¥2.21t総資産JP¥4.42t財務の健全性に関する最新情報更新なしすべての更新を表示Recent updatesお知らせ • Apr 29TDK Corporation, Annual General Meeting, Jun 19, 2026TDK Corporation, Annual General Meeting, Jun 19, 2026.お知らせ • Mar 26TDK Corporation to Report Fiscal Year 2026 Results on Apr 28, 2026TDK Corporation announced that they will report fiscal year 2026 results at 3:30 PM, Tokyo Standard Time on Apr 28, 2026お知らせ • Feb 03+ 1 more updateTDK Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending March 31, 2026TDK Corporation revised consolidated earnings guidance for the fiscal year ending March 31, 2026. For the year, the company now expects net sales of JPY 2,470,000 million; operating income of JPY 265,000 million; net income attributable to owners of parent of JPY 190,000 million; basic earnings per share of JPY 100.11 compared to previous guidance of net sales of JPY 2,370,000 million; operating income of JPY 245,000 million; net income attributable to owners of parent of JPY 180,000 million; basic earnings per share of JPY 94.84. Reasons for Revision: Looking at the first nine months of Fiscal Year March 2026, sales of rechargeable batteries and sensors expanded due to the launch of new models of smartphones. In addition, sales of HDD Suspension Assemblies remained brisk as demand for HDDs for data centers continued to show strength. Under such circumstances, the Company's performance for the first nine months of Fiscal Year March 2026 exceeded the projections announced on October 31, 2025, reflecting the impact of yen weakness.お知らせ • Jan 27TDK Corporation Appoints Nicolas Sauvage as Chair of the Global Corporate Venturing Leadership SocietyTDK Corporation announced that its subsidiary, TDK Ventures Inc., President Nicolas Sauvage, has been appointed Chair of the Global Corporate Venturing (GCV) Leadership Society for a two-year term. Sauvage has been honored on the GCV Powerlist for five consecutive years and serves as Co-Chair of the Global Corporate Venturing & Innovation (GCVI) Summit, the industry’s flagship annual gathering. In addition to his responsibilities leading TDK Ventures, Sauvage has played a leading role in the development of CVC education and training programs worldwide. Sauvage is the host of the Corporate Venturing Insider podcast, a series of in-depth conversations with global CVC leaders, founders, and operators exploring how corporate venture capital is evolving and what it takes to build durable, entrepreneur-first partnerships. Sauvage is a published author on corporate venturing, with his work featured by leading institutions including Harvard Business Review, London Business School, and INSEAD, where he explores the evolution of modern CVC, effective corporate–startup collaboration, and long-term value creation. In collaboration with IESE Business School, the TDK Ventures journey has also been featured as a case study, “TDK Ventures: Aligning Corporate Strategy with Venture Innovation,” distributed through Harvard Business Review and taught in leading MBA programs. Over the past year, he has taught a structured CVC curriculum through the Kauffman Fellows venture capital network, delivered sessions at business schools including IESE and IMD, as well as other executive programs, and frequently presents CVC best practices at leading industry events such as TechCrunch Disrupt, Web Summit, and South Summit. His work focuses on improving clarity around CVC models, strengthening investor-founder alignment, and promoting more transparent collaboration across the broader venture ecosystem.お知らせ • Nov 29TDK Corporation to Report Q3, 2026 Results on Feb 02, 2026TDK Corporation announced that they will report Q3, 2026 results on Feb 02, 2026お知らせ • Oct 31+ 2 more updatesTDK Corporation Provides Year End Dividend Guidance for the Fiscal Year Ending March 31, 2026TDK Corporation provided year end dividend guidance for the fiscal year ending March 31, 2026. For the period, the company expected year end dividend of JPY 16 per share compared to JPY 16 per share a year ago.お知らせ • Sep 26Astemo, Ltd. agreed to acquire New Product Development of Automotive Power Supplies Business of TDK Corporation from TDK Corporation (TSE:6762) for ¥4.3 billion.Astemo, Ltd. agreed to acquire New Product Development of Automotive Power Supplies Business of TDK Corporation from TDK Corporation (TSE:6762) for ¥4.3 billion on September 25, 2025. A cash consideration of ¥4.3 billion will be paid by Astemo, Ltd. As part of consideration, ¥4.3 billion is paid towards assets of New Product Development of Automotive Power Supplies Business of TDK Corporation. The expected completion of the transaction is April 1, 2026.お知らせ • Sep 18TDK Corporation to Report Q2, 2026 Results on Oct 31, 2025TDK Corporation announced that they will report Q2, 2026 results on Oct 31, 2025お知らせ • Jun 19TDK Corporation (TSE:6762) acquired Softeye, Inc.TDK Corporation (TSE:6762) acquired Softeye, Inc. on June 19, 2025. As a result of the acquisition, SoftEye is an indirectly wholly owned subsidiary of TDK Corporation. TDK Corporation (TSE:6762) completed the acquisition of Softeye, Inc. on June 19, 2025.お知らせ • May 31TDK Corporation to Report Q1, 2026 Results on Aug 01, 2025TDK Corporation announced that they will report Q1, 2026 results at 9:00 AM, Tokyo Standard Time on Aug 01, 2025お知らせ • Apr 28TDK Corporation, Annual General Meeting, Jun 20, 2025TDK Corporation, Annual General Meeting, Jun 20, 2025.お知らせ • Apr 15TDK Corporation Demonstrates the World's First "Spin Photo Detector" Capable of 10X Data Transmission Speeds for the Next Generation of AITDK Corporation announced that it has developed the world's first "Spin Photo Detector," a photo-spintronic conversion element combining optical, electronic, and magnetic elements that can respond at an ultra-high speed of 20 picoseconds (20 x 10-12 s) using light with a wavelength of 800 nm - more than 10X faster than conventional semiconductor-based photo detectors. This new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption. Transferring mass amounts of data at higher speeds and with lower power consumption is an inevitable need as AI evolution. To process data and make calculations, data is currently transferred between CPU/GPU chips as well as from and to memory by electrical signals. Therefore, there is an increasing need for optical communication and optical interconnects, which offer high speeds that do not decrease with interconnect distance. Photoelectronic conversion technology is also gaining global interest as a very compact fusion of both optical and electronic elements. To address these challenges, TDK adapted its magnetic tunnel junction (MTJ) technology, which is currently used in billions of HDD heads, for photonics. One of the major advantages of this technology is that it does not require crystal growth using a single crystal substrate, and the device can be formed regardless of the substrate material. Comparatively, conventional semiconductor-based photo detection have physical limitations at shorter wavelengths. Because the Spin Photo Detector has a completely different operating principle and uses an electron heating phenomenon, it can operate at ultra-high speeds even when the wavelength is shortened. In addition, the operating wavelength range is wide, and it has been confirmed that it can operate from visible light to near-infrared light. TDK has successfully demonstrated the Spin Photo Detector with Nihon University in Japan, a research pioneer for the measurement of ultrafast phenomena of magnetic material. Additionally, with the ability to detect visible light at high speeds, the spin photo detector will be useful in applications projected for future growth, such as devices for AR/VR smart glasses ([2), and high-speed image sensors. While conventional semiconductor photo-sensing devices have weak cosmic-ray resistance, MTJ elements are also known for their strong cosmic-ray resistance and are expected to be used as light-detecting elements in aerospace applications. In the future, based on these results, TDK will improve the perfection of the high-speed light detection element to further pursue its usefulness.お知らせ • Mar 27TDK Corporation to Report Fiscal Year 2025 Results on Apr 28, 2025TDK Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Apr 28, 2025お知らせ • Dec 05TDK Corporation to Report Q3, 2025 Results on Jan 31, 2025TDK Corporation announced that they will report Q3, 2025 results on Jan 31, 2025お知らせ • Sep 11TDK Corporation to Report Q2, 2025 Results on Nov 01, 2024TDK Corporation announced that they will report Q2, 2025 results on Nov 01, 2024お知らせ • Aug 06TDK Corporation Appoints Sandeep Pandya as Chief Executive Officer of TDK SensEI Pte. LtdTDK Corporation announced the formation of a new corporate legal entity, TDK SensEI Pte. Ltd. to address the growing market of the intersection of artificial intelligence (AI) and sensor fusion at the edge. Sandeep Pandya has been recruited from outside of TDK to lead TDK SensEI as Chief Executive Officer (CEO). Pandya is an entrepreneurial C-level leader with a successful record of developing teams, products, and new markets across technologies and industries. His focus in recent years has been on building early-stage ventures with artificial intelligence (AI)/deep tech foundations. Pandya serves on several early-stage venture and non-profit boards. Sandeep earned an MBA from Northwestern University's J.L. Kellogg Graduate School of Management, and BS and MS degrees in Computer Science from the University of Illinois at Urbana-Champaign.お知らせ • Jun 28TDK Corporation to Report Q1, 2025 Results on Jul 30, 2024TDK Corporation announced that they will report Q1, 2025 results at 3:00 PM, Tokyo Standard Time on Jul 30, 2024お知らせ • Apr 28+ 2 more updatesTDK Corporation, Annual General Meeting, Jun 21, 2024TDK Corporation, Annual General Meeting, Jun 21, 2024. Agenda: To consider year-end dividend of JPY 58 per common share.お知らせ • Mar 26TDK Corporation to Report Fiscal Year 2024 Results on Apr 26, 2024TDK Corporation announced that they will report fiscal year 2024 results at 3:00 PM, Tokyo Standard Time on Apr 26, 2024お知らせ • Jan 09TDK Announces New 3-Axis Accelerometer, Finalizing Transition of Smartautomotive™ Non-Safety Product Family to 105°CTDK Corporation announced the InvenSense SmartAutomotive™ IAM-20381HT high-temperature monolithic 3-axis MotionTracking accelerometer for non-safety automotive applications, such as navigation, infotainment systems, telematics, and more. The launch represents a full transition of the InvenSense SmartAutomotive non-safety product line to 105°C. The IAM-20381HT is part of a fully-compatible, multi-axis, multi-grade portfolio of SmartAutomotive products. With this release, TDK confirms its leadership in driving the inertial sensors market for both safety and non-safety automotive applications. The IAM-20381HT will be available at distributors worldwide by February 1, 2024. The new stand-alone 3-axis MEMS accelerometer is offered in a thin 3 x 3 x 0.75 mm (16-pin LGA) package and is automotive-qualified based on AEC-Q100 Grade 2. The IAM-20381HT also features two programmable independent interrupt lines, wake-on-motion functionality, and a FIFO up to 4096-bytes, which can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst-read sensor data and then go into a low-power mode. Such features enable a variety of motion-activated functions such as anti-theft, vehicle security, and driving style data recording. TDK will demonstrate this and other technologies at the Consumer Electronics Show (CES) from January 9-12, 2024, in Las Vegas. Find TDK in the CES Central Hall (LVCC) at booth #20521. Glossary: IMU: Inertial Measurement Unit 6-axis: 3-axis Gyroscope + 3-axis Accelerometer 3-axis: 3-axis Gyroscope or 3-axis Accelerometer MEMS: Micro-Electro-Mechanical Systems DK: Developer kit EV: Evaluation board LGA: Land Grid Array FIFO: First in First out Main applications: Lift Gate Motion Detection Tilt Measurement Infotainment and Navigation Systems Car Alarm Telematics Insurance Vehicle Tracking Drive Style Recording Main features and benefits Automotive-qualified based on AEC Q100 Grade 2 qualification test methods Thin 3 x 3 x 0.75 mm (16-pin LGA) package 16-bit digital-output accelerometer Accelerometer: X-, Y-, and Z-axes acceleration sensors with a user-programmable full-scale range up to ±16 g User-programmable digital filters for accelerometer and temperature sensor Embedded self-test Two embedded configurable interrupt lines Wake-on-motion functional Final test over temperature Pin-to-pin and register-compatible across with IAM-20680HT, IAM-20680HP, IAM-20380HT, IAM-20381 EV_IAM-20381HT evaluation board compatible with DK-Universal-I.お知らせ • Dec 23TDK Corporation to Report Q3, 2024 Results on Jan 31, 2024TDK Corporation announced that they will report Q3, 2024 results at 3:00 PM, China Standard Time on Jan 31, 2024お知らせ • Aug 30TDK Corporation to Report Q2, 2024 Results on Nov 01, 2023TDK Corporation announced that they will report Q2, 2024 results on Nov 01, 2023お知らせ • May 28TDK Corporation to Report Q1, 2024 Results on Aug 02, 2023TDK Corporation announced that they will report Q1, 2024 results on Aug 02, 2023お知らせ • Jan 05+ 1 more updateTdk Smartsound T5838/T5837 Mems Microphones and Smartsound One Development Platform Now AvailableTDK Corporation announced the full-scale production of InvenSense IAM-20685, the smallest ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262 for ADAS and autonomous car systems. The IAM-20685 supports a wide range of ADAS applications, including but not limited to automated parking, ADAS domain controller, and vision systems. IAM-20685 addresses a wide range of automotive applications, including but not limited to: ADAS, Autonomous driving systems, Automated parking, Vehicle redundant IMU, Vision systems (camera, radar, LIDAR), Navigation system aids for dead reckoning, Telematics, Accurate positioning for vehicle-to-vehicle and infrastructure. Main Features and Benefits, ASIL-B rated per ISO 26262, Robust architecture for functional safety:, 6 independent MEMS proof masses, 6 independent analog front-end, Operating Temperature range from -40°C to 105°C 2, Gyroscope full-scale: user selectable from ±41dps to ±1966dps, Accelerometer full-scale: user selectable from ±2g to ±65g, Two embedded temperature sensors, 16-bit on-chip ADCs for accelerometer, gyroscope, and temperature sensor, 24-pin QFN package 4.5×4.5×1.1 mm³ with a wettable flanks option.財務状況分析短期負債: TTDK.Yの 短期資産 ( ¥2,455.2B ) が 短期負債 ( ¥1,574.5B ) を超えています。長期負債: TTDK.Yの短期資産 ( ¥2,455.2B ) が 長期負債 ( ¥637.1B ) を上回っています。デット・ツー・エクイティの歴史と分析負債レベル: TTDK.Y総負債よりも多くの現金を保有しています。負債の削減: TTDK.Yの負債対資本比率は、過去 5 年間で48%から24.7%に減少しました。債務返済能力: TTDK.Yの負債は 営業キャッシュフロー によって 十分にカバー されています ( 93.4% )。インタレストカバレッジ: TTDK.Y支払う利息よりも稼ぐ利息の方が多いので、利息支払い の補償は問題になりません。貸借対照表健全な企業の発掘7D1Y7D1Y7D1YTech 業界の健全な企業。View Dividend企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/25 03:02終値2026/05/22 00:00収益2026/03/31年間収益2026/03/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋TDK Corporation 17 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。28 アナリスト機関George ChangAletheia Analyst Network LimitedMasaru KoshitaBarclaysMasashi KubotaBofA Global Research25 その他のアナリストを表示
お知らせ • Apr 29TDK Corporation, Annual General Meeting, Jun 19, 2026TDK Corporation, Annual General Meeting, Jun 19, 2026.
お知らせ • Mar 26TDK Corporation to Report Fiscal Year 2026 Results on Apr 28, 2026TDK Corporation announced that they will report fiscal year 2026 results at 3:30 PM, Tokyo Standard Time on Apr 28, 2026
お知らせ • Feb 03+ 1 more updateTDK Corporation Revises Consolidated Earnings Guidance for the Fiscal Year Ending March 31, 2026TDK Corporation revised consolidated earnings guidance for the fiscal year ending March 31, 2026. For the year, the company now expects net sales of JPY 2,470,000 million; operating income of JPY 265,000 million; net income attributable to owners of parent of JPY 190,000 million; basic earnings per share of JPY 100.11 compared to previous guidance of net sales of JPY 2,370,000 million; operating income of JPY 245,000 million; net income attributable to owners of parent of JPY 180,000 million; basic earnings per share of JPY 94.84. Reasons for Revision: Looking at the first nine months of Fiscal Year March 2026, sales of rechargeable batteries and sensors expanded due to the launch of new models of smartphones. In addition, sales of HDD Suspension Assemblies remained brisk as demand for HDDs for data centers continued to show strength. Under such circumstances, the Company's performance for the first nine months of Fiscal Year March 2026 exceeded the projections announced on October 31, 2025, reflecting the impact of yen weakness.
お知らせ • Jan 27TDK Corporation Appoints Nicolas Sauvage as Chair of the Global Corporate Venturing Leadership SocietyTDK Corporation announced that its subsidiary, TDK Ventures Inc., President Nicolas Sauvage, has been appointed Chair of the Global Corporate Venturing (GCV) Leadership Society for a two-year term. Sauvage has been honored on the GCV Powerlist for five consecutive years and serves as Co-Chair of the Global Corporate Venturing & Innovation (GCVI) Summit, the industry’s flagship annual gathering. In addition to his responsibilities leading TDK Ventures, Sauvage has played a leading role in the development of CVC education and training programs worldwide. Sauvage is the host of the Corporate Venturing Insider podcast, a series of in-depth conversations with global CVC leaders, founders, and operators exploring how corporate venture capital is evolving and what it takes to build durable, entrepreneur-first partnerships. Sauvage is a published author on corporate venturing, with his work featured by leading institutions including Harvard Business Review, London Business School, and INSEAD, where he explores the evolution of modern CVC, effective corporate–startup collaboration, and long-term value creation. In collaboration with IESE Business School, the TDK Ventures journey has also been featured as a case study, “TDK Ventures: Aligning Corporate Strategy with Venture Innovation,” distributed through Harvard Business Review and taught in leading MBA programs. Over the past year, he has taught a structured CVC curriculum through the Kauffman Fellows venture capital network, delivered sessions at business schools including IESE and IMD, as well as other executive programs, and frequently presents CVC best practices at leading industry events such as TechCrunch Disrupt, Web Summit, and South Summit. His work focuses on improving clarity around CVC models, strengthening investor-founder alignment, and promoting more transparent collaboration across the broader venture ecosystem.
お知らせ • Nov 29TDK Corporation to Report Q3, 2026 Results on Feb 02, 2026TDK Corporation announced that they will report Q3, 2026 results on Feb 02, 2026
お知らせ • Oct 31+ 2 more updatesTDK Corporation Provides Year End Dividend Guidance for the Fiscal Year Ending March 31, 2026TDK Corporation provided year end dividend guidance for the fiscal year ending March 31, 2026. For the period, the company expected year end dividend of JPY 16 per share compared to JPY 16 per share a year ago.
お知らせ • Sep 26Astemo, Ltd. agreed to acquire New Product Development of Automotive Power Supplies Business of TDK Corporation from TDK Corporation (TSE:6762) for ¥4.3 billion.Astemo, Ltd. agreed to acquire New Product Development of Automotive Power Supplies Business of TDK Corporation from TDK Corporation (TSE:6762) for ¥4.3 billion on September 25, 2025. A cash consideration of ¥4.3 billion will be paid by Astemo, Ltd. As part of consideration, ¥4.3 billion is paid towards assets of New Product Development of Automotive Power Supplies Business of TDK Corporation. The expected completion of the transaction is April 1, 2026.
お知らせ • Sep 18TDK Corporation to Report Q2, 2026 Results on Oct 31, 2025TDK Corporation announced that they will report Q2, 2026 results on Oct 31, 2025
お知らせ • Jun 19TDK Corporation (TSE:6762) acquired Softeye, Inc.TDK Corporation (TSE:6762) acquired Softeye, Inc. on June 19, 2025. As a result of the acquisition, SoftEye is an indirectly wholly owned subsidiary of TDK Corporation. TDK Corporation (TSE:6762) completed the acquisition of Softeye, Inc. on June 19, 2025.
お知らせ • May 31TDK Corporation to Report Q1, 2026 Results on Aug 01, 2025TDK Corporation announced that they will report Q1, 2026 results at 9:00 AM, Tokyo Standard Time on Aug 01, 2025
お知らせ • Apr 28TDK Corporation, Annual General Meeting, Jun 20, 2025TDK Corporation, Annual General Meeting, Jun 20, 2025.
お知らせ • Apr 15TDK Corporation Demonstrates the World's First "Spin Photo Detector" Capable of 10X Data Transmission Speeds for the Next Generation of AITDK Corporation announced that it has developed the world's first "Spin Photo Detector," a photo-spintronic conversion element combining optical, electronic, and magnetic elements that can respond at an ultra-high speed of 20 picoseconds (20 x 10-12 s) using light with a wavelength of 800 nm - more than 10X faster than conventional semiconductor-based photo detectors. This new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption. Transferring mass amounts of data at higher speeds and with lower power consumption is an inevitable need as AI evolution. To process data and make calculations, data is currently transferred between CPU/GPU chips as well as from and to memory by electrical signals. Therefore, there is an increasing need for optical communication and optical interconnects, which offer high speeds that do not decrease with interconnect distance. Photoelectronic conversion technology is also gaining global interest as a very compact fusion of both optical and electronic elements. To address these challenges, TDK adapted its magnetic tunnel junction (MTJ) technology, which is currently used in billions of HDD heads, for photonics. One of the major advantages of this technology is that it does not require crystal growth using a single crystal substrate, and the device can be formed regardless of the substrate material. Comparatively, conventional semiconductor-based photo detection have physical limitations at shorter wavelengths. Because the Spin Photo Detector has a completely different operating principle and uses an electron heating phenomenon, it can operate at ultra-high speeds even when the wavelength is shortened. In addition, the operating wavelength range is wide, and it has been confirmed that it can operate from visible light to near-infrared light. TDK has successfully demonstrated the Spin Photo Detector with Nihon University in Japan, a research pioneer for the measurement of ultrafast phenomena of magnetic material. Additionally, with the ability to detect visible light at high speeds, the spin photo detector will be useful in applications projected for future growth, such as devices for AR/VR smart glasses ([2), and high-speed image sensors. While conventional semiconductor photo-sensing devices have weak cosmic-ray resistance, MTJ elements are also known for their strong cosmic-ray resistance and are expected to be used as light-detecting elements in aerospace applications. In the future, based on these results, TDK will improve the perfection of the high-speed light detection element to further pursue its usefulness.
お知らせ • Mar 27TDK Corporation to Report Fiscal Year 2025 Results on Apr 28, 2025TDK Corporation announced that they will report fiscal year 2025 results at 3:30 PM, Tokyo Standard Time on Apr 28, 2025
お知らせ • Dec 05TDK Corporation to Report Q3, 2025 Results on Jan 31, 2025TDK Corporation announced that they will report Q3, 2025 results on Jan 31, 2025
お知らせ • Sep 11TDK Corporation to Report Q2, 2025 Results on Nov 01, 2024TDK Corporation announced that they will report Q2, 2025 results on Nov 01, 2024
お知らせ • Aug 06TDK Corporation Appoints Sandeep Pandya as Chief Executive Officer of TDK SensEI Pte. LtdTDK Corporation announced the formation of a new corporate legal entity, TDK SensEI Pte. Ltd. to address the growing market of the intersection of artificial intelligence (AI) and sensor fusion at the edge. Sandeep Pandya has been recruited from outside of TDK to lead TDK SensEI as Chief Executive Officer (CEO). Pandya is an entrepreneurial C-level leader with a successful record of developing teams, products, and new markets across technologies and industries. His focus in recent years has been on building early-stage ventures with artificial intelligence (AI)/deep tech foundations. Pandya serves on several early-stage venture and non-profit boards. Sandeep earned an MBA from Northwestern University's J.L. Kellogg Graduate School of Management, and BS and MS degrees in Computer Science from the University of Illinois at Urbana-Champaign.
お知らせ • Jun 28TDK Corporation to Report Q1, 2025 Results on Jul 30, 2024TDK Corporation announced that they will report Q1, 2025 results at 3:00 PM, Tokyo Standard Time on Jul 30, 2024
お知らせ • Apr 28+ 2 more updatesTDK Corporation, Annual General Meeting, Jun 21, 2024TDK Corporation, Annual General Meeting, Jun 21, 2024. Agenda: To consider year-end dividend of JPY 58 per common share.
お知らせ • Mar 26TDK Corporation to Report Fiscal Year 2024 Results on Apr 26, 2024TDK Corporation announced that they will report fiscal year 2024 results at 3:00 PM, Tokyo Standard Time on Apr 26, 2024
お知らせ • Jan 09TDK Announces New 3-Axis Accelerometer, Finalizing Transition of Smartautomotive™ Non-Safety Product Family to 105°CTDK Corporation announced the InvenSense SmartAutomotive™ IAM-20381HT high-temperature monolithic 3-axis MotionTracking accelerometer for non-safety automotive applications, such as navigation, infotainment systems, telematics, and more. The launch represents a full transition of the InvenSense SmartAutomotive non-safety product line to 105°C. The IAM-20381HT is part of a fully-compatible, multi-axis, multi-grade portfolio of SmartAutomotive products. With this release, TDK confirms its leadership in driving the inertial sensors market for both safety and non-safety automotive applications. The IAM-20381HT will be available at distributors worldwide by February 1, 2024. The new stand-alone 3-axis MEMS accelerometer is offered in a thin 3 x 3 x 0.75 mm (16-pin LGA) package and is automotive-qualified based on AEC-Q100 Grade 2. The IAM-20381HT also features two programmable independent interrupt lines, wake-on-motion functionality, and a FIFO up to 4096-bytes, which can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst-read sensor data and then go into a low-power mode. Such features enable a variety of motion-activated functions such as anti-theft, vehicle security, and driving style data recording. TDK will demonstrate this and other technologies at the Consumer Electronics Show (CES) from January 9-12, 2024, in Las Vegas. Find TDK in the CES Central Hall (LVCC) at booth #20521. Glossary: IMU: Inertial Measurement Unit 6-axis: 3-axis Gyroscope + 3-axis Accelerometer 3-axis: 3-axis Gyroscope or 3-axis Accelerometer MEMS: Micro-Electro-Mechanical Systems DK: Developer kit EV: Evaluation board LGA: Land Grid Array FIFO: First in First out Main applications: Lift Gate Motion Detection Tilt Measurement Infotainment and Navigation Systems Car Alarm Telematics Insurance Vehicle Tracking Drive Style Recording Main features and benefits Automotive-qualified based on AEC Q100 Grade 2 qualification test methods Thin 3 x 3 x 0.75 mm (16-pin LGA) package 16-bit digital-output accelerometer Accelerometer: X-, Y-, and Z-axes acceleration sensors with a user-programmable full-scale range up to ±16 g User-programmable digital filters for accelerometer and temperature sensor Embedded self-test Two embedded configurable interrupt lines Wake-on-motion functional Final test over temperature Pin-to-pin and register-compatible across with IAM-20680HT, IAM-20680HP, IAM-20380HT, IAM-20381 EV_IAM-20381HT evaluation board compatible with DK-Universal-I.
お知らせ • Dec 23TDK Corporation to Report Q3, 2024 Results on Jan 31, 2024TDK Corporation announced that they will report Q3, 2024 results at 3:00 PM, China Standard Time on Jan 31, 2024
お知らせ • Aug 30TDK Corporation to Report Q2, 2024 Results on Nov 01, 2023TDK Corporation announced that they will report Q2, 2024 results on Nov 01, 2023
お知らせ • May 28TDK Corporation to Report Q1, 2024 Results on Aug 02, 2023TDK Corporation announced that they will report Q1, 2024 results on Aug 02, 2023
お知らせ • Jan 05+ 1 more updateTdk Smartsound T5838/T5837 Mems Microphones and Smartsound One Development Platform Now AvailableTDK Corporation announced the full-scale production of InvenSense IAM-20685, the smallest ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262 for ADAS and autonomous car systems. The IAM-20685 supports a wide range of ADAS applications, including but not limited to automated parking, ADAS domain controller, and vision systems. IAM-20685 addresses a wide range of automotive applications, including but not limited to: ADAS, Autonomous driving systems, Automated parking, Vehicle redundant IMU, Vision systems (camera, radar, LIDAR), Navigation system aids for dead reckoning, Telematics, Accurate positioning for vehicle-to-vehicle and infrastructure. Main Features and Benefits, ASIL-B rated per ISO 26262, Robust architecture for functional safety:, 6 independent MEMS proof masses, 6 independent analog front-end, Operating Temperature range from -40°C to 105°C 2, Gyroscope full-scale: user selectable from ±41dps to ±1966dps, Accelerometer full-scale: user selectable from ±2g to ±65g, Two embedded temperature sensors, 16-bit on-chip ADCs for accelerometer, gyroscope, and temperature sensor, 24-pin QFN package 4.5×4.5×1.1 mm³ with a wettable flanks option.