お知らせ • 4h
Rigaku Holdings Corporation has filed a Follow-on Equity Offering. Rigaku Holdings Corporation has filed a Follow-on Equity Offering.
Security Name: Common Stock
Security Type: Common Stock
Securities Offered: 7,469,100
Security Name: Common Stock
Security Type: Common Stock
Securities Offered: 22,111,200 お知らせ • May 10
Rigaku Holdings Corporation to Report Q1, 2026 Results on May 13, 2026 Rigaku Holdings Corporation announced that they will report Q1, 2026 results at 9:00 AM, Tokyo Standard Time on May 13, 2026 お知らせ • Dec 10
Rigaku Holdings Corporation to Report Fiscal Year 2025 Results on Feb 13, 2026 Rigaku Holdings Corporation announced that they will report fiscal year 2025 results on Feb 13, 2026 お知らせ • Sep 27
Rigaku Holdings Corporation to Report Q3, 2025 Results on Nov 11, 2025 Rigaku Holdings Corporation announced that they will report Q3, 2025 results on Nov 11, 2025 お知らせ • Aug 27
Rigaku Corporation Launches Sales of the XHEMIS TX-3000, a TXRF Analytical System for Semiconductor Processes Rigaku Corporation has launched sales of the XHEMIS (pronounced "ZEM-mis") TX-3000, a total reflection X-ray fluorescence (TXRF) system that supports analysis of trace contamination on wafer surfaces in semiconductor manufacturing. Measurement result of surface contaminant distribution: Rigaku protects the quality with TXRF technology, a field where it holds overwhelming market share; Analysis of trace contaminants on wafer surfaces is vital to semiconductor manufacturing. Moreover, manufacturing lines that incorporate hundreds of steps require precise analysis of trace contaminants on wafer surface to maintain stable operation and the reliability of product quality. With TXRF, a representative approach for this purpose, Rigaku has established its technology as the effective global standard. The Company has long been a driver of rising quality standards in the industry. Rigaku's latest model, the XHEMIS TX-3000, improves on existing features to deliver a quantum leap in measurement precision, operability and productivity. Up to 6x increase in speed enables former one-hour measurement tasks to be completed in 10 minutes. The XHEMIS TX-3 achieves processing speeds up to 6x that of Rigaku's previous systems. First, measurement speed is tripled by combining a newly developed optical array with a novel multi-element detector. Next, this combined system is coupled with an AI-driven spectrum forecasting technology to double measurement speed without sacrificing precision. The technical innovation of this two-stage arrangement contributes to improved productivity and process stability at semiconductor manufacturing sites. With previous model, measurements that took typically one hour, now finish in just 10 minutes. New detector design supports analysis of lighter elements: The XHEMIS TX -3000 adopts an X-ray source that can be switched among three wavelengths, enabling analysis of lighter elements such as sodium, magnesium and aluminum that are difficult to detect using fluorescent X-ray analytical systems. In this way the surface distribution of contaminants can be measured for virtually all elements without sample destruction. In addition, the XHEMIS Texas-3000 combines a newly developed monochromator capable of X-ray irradiation with a multi-element detector that can measure three locations on the wafer surface simultaneously. By combining these features, the XHEMISTX-3000 boosts measurement speed by a factor of 3 in comparison with previous systems. To address this issue, the XHEMIS Houston adopts spectrum-forecasting software trained on vast quantities of analysis data. In this way precision is maintained even while cutting measurement time in half. Additionally, a new feature reduces unnecessary background signal, expanding the range of applications to a wide variety of materials previously unamenable to trace-contamination measurement, such as barrier metals (protective coating for wiring), high-dielectric films, and compound semiconductors. Kiyoshi Ogata, Senior Executive Vice President, commented as follows: Rigaku forecasts sales of approximately JP JP 5 billion for conventional TXRF products in 2025. With the introduction to market of this high-end system, Rigaku expects adoption by major semiconductor manufacturers to advance. The Company expects this product segment to enjoy double-digit growth for successive years as a stable platform supporting sustainable growth in the semiconductor market. お知らせ • Aug 08
Rigaku Holdings Corporation (TSE:268A) announces an Equity Buyback for 6,000,000 shares, representing 2.62% for ¥4,000 million. Rigaku Holdings Corporation (TSE:268A) announces a share repurchase program. Under the program, the company will repurchase up to 6,000,000 shares, representing 2.62% of its issued share capital (excluding treasury stock), for a total purchase price of ¥4,000 million. The purpose of the program is improving capital efficiency and fully reflect the intrinsic value of the company. The program will continue through December 23, 2025. As of June 30, 2025, the company had 229,336,799 issued shares (excluding treasury stock) and 19,601 treasury shares. お知らせ • Jun 03
Rigaku Holdings Corporation to Report Q2, 2025 Results on Aug 07, 2025 Rigaku Holdings Corporation announced that they will report Q2, 2025 results on Aug 07, 2025