View Past PerformanceNanoveu バランスシートの健全性財務の健全性 基準チェック /56Nanoveuの総株主資本はA$12.1M 、総負債はA$134.0Kで、負債比率は1.1%となります。総資産と総負債はそれぞれA$13.6MとA$1.5Mです。主要情報1.11%負債資本比率AU$134.01k負債インタレスト・カバレッジ・レシオn/a現金AU$1.81mエクイティAU$12.09m負債合計AU$1.46m総資産AU$13.55m財務の健全性に関する最新情報更新なしすべての更新を表示Recent updatesお知らせ • Apr 10Nanoveu Limited, Annual General Meeting, May 29, 2026Nanoveu Limited, Annual General Meeting, May 29, 2026.お知らせ • Jan 20Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million.Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million. Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 85,227,274 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 1,363,636 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Transaction Features: Subsequent Direct Listingお知らせ • Dec 18Emass, A Nanoveu Subsidiary Pushes the Edge Further with 16Nm Ecs-DotEMASS, a Nanoveu subsidiary with next-generation semiconductor technology, announced that its next-generation ECS-DoT SoC built on a 16nm process node has entered the final phases of development, headed toward graphic data system (GDS) sign-off, tape-out and fabrication at TSMC. This new device builds on EMASS's existing 22nm ECS-DoT offering and strengthens the company's leadership in ultra-low-power Edge AI by extending always-on intelligence into more demanding and highly integrated applications. The new 16nm ECS-DoT builds on the 22nm's performance, energy consumption, compute capability and on-chip resources, while preserving the architectural concepts, developer workflow and ultra-low-power mission that define the ECS-DoT family. It continues to advance edge technology by integrating an on-chip Bluetooth Low Energy (BLE) subsystem, expanding on-chip SRAM with a new power management system and AI and processing acceleration enhancements. Enabling the Next Stage of Edge Intelligence: The 16nm ECS- DoT advances EMASS's edge AI capabilities through higher integration, expanded on-chip resources and improved power efficiency, enabling more capable always-on intelligence without increasing system complexity or energy demand. Key enhancements include: Fully integrated BLE subsystem -- Eliminates the need for external wireless ICs, reducing board area, bill-of-materials cost and design complexity; Dedicated object-detection accelerator -- Offloads vision workloads to increase throughput and reduce interference latency for edge vision use cases; Integrated floating-point unit (FP16/FP32) -- Accelerates DSP and mixed-precision AI workflows while simplifying developer toolchains and code migration. The new SoC maintains complete software and workflow compatibility with the current ECS-DoT family; This allows developers to deploy applications on either the 22nm or 16nm version with minimal redesign, while supporting larger and more demanding workloads without compromising ultra-low-power operation. The 16nm ECS-Do T also advances EMASS's "Atoms-to-Apps" methodology, connecting application requirements, algorithm design, silicon architecture and real-world deployment into a unified development philosophy.お知らせ • Sep 17Emass A Subsidiary of Nanoveu Ltd Introduces the Ecs-Dot, Their Edge Ai System-On-ChipEMASS a subsidiary of Nanoveu Ltd. introduced the ECS-DoT, their edge AI system-on-chip (SoC). The new design enables always-on, milliWatt-scale intelligence for edge devices, eliminating the need for cloud-based computation. With this chip, EMASS is targeting the extreme edge of the network, an area occupied by compact and lightweight connected devices powered by small batteries. Application examples include medical wearables and sensor modules operating adjacent to the sensors they support. The ECS-DoT is designed with four megabytes of on-board SRAM, enabling AI computations to run efficiently on edge and IoT devices. By processing data locally, the chip dramatically reduces latency and power consumption, opening the door for always-on intelligence in wearables, drones and predictive maintenance-dependent systems. Compared with leading competitors, ECS-DoT operates up to 93% faster while consuming 90% less energy, all while supporting true multimodal sensor fusion on-device, eliminating the need for cloud processing.財務状況分析短期負債: NNVU.Fの 短期資産 ( A$2.7M ) が 短期負債 ( A$1.4M ) を超えています。長期負債: NNVU.Fの短期資産 ( A$2.7M ) が 長期負債 ( A$71.9K ) を上回っています。デット・ツー・エクイティの歴史と分析負債レベル: NNVU.F総負債よりも多くの現金を保有しています。負債の削減: NNVU.Fの負債対資本比率は、過去 5 年間で0%から1.1%に増加しました。貸借対照表キャッシュ・ランウェイ分析過去に平均して赤字であった企業については、少なくとも1年間のキャッシュ・ランウェイがあるかどうかを評価する。安定したキャッシュランウェイ: NNVU.Fは、前回報告された フリーキャッシュフロー に基づいて4か月分の十分な キャッシュランウェイ を有していますが、その後追加の資本を調達しました。キャッシュランウェイの予測: NNVU.Fフリーキャッシュフロー 推定値 に基づいて3か月間十分なキャッシュランウェイがあると予測されていますが、その後、追加の資本を調達しました。健全な企業の発掘7D1Y7D1Y7D1YTech 業界の健全な企業。View Dividend企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/10 10:52終値2026/05/06 00:00収益2025/12/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Nanoveu Limited 0 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。0
お知らせ • Apr 10Nanoveu Limited, Annual General Meeting, May 29, 2026Nanoveu Limited, Annual General Meeting, May 29, 2026.
お知らせ • Jan 20Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million.Nanoveu Limited has completed a Follow-on Equity Offering in the amount of AUD 7.62 million. Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 85,227,274 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Security Name: Ordinary Shares Security Type: Common Stock Securities Offered: 1,363,636 Price\Range: AUD 0.088 Discount Per Security: AUD 0.00528 Transaction Features: Subsequent Direct Listing
お知らせ • Dec 18Emass, A Nanoveu Subsidiary Pushes the Edge Further with 16Nm Ecs-DotEMASS, a Nanoveu subsidiary with next-generation semiconductor technology, announced that its next-generation ECS-DoT SoC built on a 16nm process node has entered the final phases of development, headed toward graphic data system (GDS) sign-off, tape-out and fabrication at TSMC. This new device builds on EMASS's existing 22nm ECS-DoT offering and strengthens the company's leadership in ultra-low-power Edge AI by extending always-on intelligence into more demanding and highly integrated applications. The new 16nm ECS-DoT builds on the 22nm's performance, energy consumption, compute capability and on-chip resources, while preserving the architectural concepts, developer workflow and ultra-low-power mission that define the ECS-DoT family. It continues to advance edge technology by integrating an on-chip Bluetooth Low Energy (BLE) subsystem, expanding on-chip SRAM with a new power management system and AI and processing acceleration enhancements. Enabling the Next Stage of Edge Intelligence: The 16nm ECS- DoT advances EMASS's edge AI capabilities through higher integration, expanded on-chip resources and improved power efficiency, enabling more capable always-on intelligence without increasing system complexity or energy demand. Key enhancements include: Fully integrated BLE subsystem -- Eliminates the need for external wireless ICs, reducing board area, bill-of-materials cost and design complexity; Dedicated object-detection accelerator -- Offloads vision workloads to increase throughput and reduce interference latency for edge vision use cases; Integrated floating-point unit (FP16/FP32) -- Accelerates DSP and mixed-precision AI workflows while simplifying developer toolchains and code migration. The new SoC maintains complete software and workflow compatibility with the current ECS-DoT family; This allows developers to deploy applications on either the 22nm or 16nm version with minimal redesign, while supporting larger and more demanding workloads without compromising ultra-low-power operation. The 16nm ECS-Do T also advances EMASS's "Atoms-to-Apps" methodology, connecting application requirements, algorithm design, silicon architecture and real-world deployment into a unified development philosophy.
お知らせ • Sep 17Emass A Subsidiary of Nanoveu Ltd Introduces the Ecs-Dot, Their Edge Ai System-On-ChipEMASS a subsidiary of Nanoveu Ltd. introduced the ECS-DoT, their edge AI system-on-chip (SoC). The new design enables always-on, milliWatt-scale intelligence for edge devices, eliminating the need for cloud-based computation. With this chip, EMASS is targeting the extreme edge of the network, an area occupied by compact and lightweight connected devices powered by small batteries. Application examples include medical wearables and sensor modules operating adjacent to the sensors they support. The ECS-DoT is designed with four megabytes of on-board SRAM, enabling AI computations to run efficiently on edge and IoT devices. By processing data locally, the chip dramatically reduces latency and power consumption, opening the door for always-on intelligence in wearables, drones and predictive maintenance-dependent systems. Compared with leading competitors, ECS-DoT operates up to 93% faster while consuming 90% less energy, all while supporting true multimodal sensor fusion on-device, eliminating the need for cloud processing.