View Financial HealthSynopsys 配当と自社株買い配当金 基準チェック /06Synopsys配当金を支払った記録がありません。主要情報n/a配当利回り-2.2%バイバック利回り総株主利回り-2.2%将来の配当利回り0%配当成長n/a次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向n/a最近の配当と自社株買いの更新更新なしすべての更新を表示Recent updatesお知らせ • Jul 28Synopsys Introduces Autonomous Agentic AI EDA Workflows For Chip Design in Collaboration with Microsoft And AMDSynopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Synopsys is introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design. This includes Synopsys fully-autonomous debug closure workflow: a fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation—helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure workflow: an autonomous workflow leveraging Synopsys implementation agents and Fusion Compiler on Azure brings together domain-specific and task-level agents to automate implementation quality-of-results (QoR) tuning and closure. Initial results demonstrate improved QoR. Synopsys, AMD, and Microsoft are enabling AI-powered design workflows that combine large-scale reasoning, domain expertise, and cloud-scale compute to accelerate the development of the next generation of AI infrastructure silicon. This milestone builds on the existing collaboration and previously announced agentic specification to RTL workflow, marking the first EDA applications available for evaluation on Microsoft Discovery. AMD is actively evaluating the application of autonomous workflows to accelerate the development of their next-generation products.お知らせ • Jul 23Synopsys, Inc. to Report Q3, 2026 Results on Aug 26, 2026Synopsys, Inc. announced that they will report Q3, 2026 results on Aug 26, 2026お知らせ • Jun 29+ 6 more updatesSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth BenchmarkSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth Benchmarkお知らせ • Jun 19Synopsys Announces Availability of the First Wave of Multiphysics Fusion SolutionsSynopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available.決済の安定と成長配当データの取得安定した配当: SYNP23の 1 株当たり配当が過去に安定していたかどうかを判断するにはデータが不十分です。増加する配当: SYNP23の配当金が増加しているかどうかを判断するにはデータが不十分です。配当利回り対市場Synopsys 配当利回り対市場SYNP23 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (SYNP23)n/a市場下位25% (TH)3.1%市場トップ25% (TH)7.1%業界平均 (Software)1.2%アナリスト予想 (SYNP23) (最長3年)0%注目すべき配当: SYNP23は最近配当金を報告していないため、配当金支払者の下位 25% に対して同社の配当利回りを評価することはできません。高配当: SYNP23は最近配当金を報告していないため、配当金支払者の上位 25% に対して同社の配当利回りを評価することはできません。株主への利益配当収益カバレッジ: SYNP23の 配当性向 を計算して配当金の支払いが利益で賄われているかどうかを判断するにはデータが不十分です。株主配当金キャッシュフローカバレッジ: SYNP23が配当金を報告していないため、配当金の持続可能性を計算できません。高配当企業の発掘7D1Y7D1Y7D1YTH 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/08/02 22:50終値2026/07/31 00:00収益2026/04/30年間収益2025/10/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Synopsys, Inc. 24 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。33 アナリスト機関Joseph VruwinkBairdGary MobleyBenchmark CompanyNay Soe NaingBerenberg30 その他のアナリストを表示
お知らせ • Jul 28Synopsys Introduces Autonomous Agentic AI EDA Workflows For Chip Design in Collaboration with Microsoft And AMDSynopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Synopsys is introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design. This includes Synopsys fully-autonomous debug closure workflow: a fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation—helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure workflow: an autonomous workflow leveraging Synopsys implementation agents and Fusion Compiler on Azure brings together domain-specific and task-level agents to automate implementation quality-of-results (QoR) tuning and closure. Initial results demonstrate improved QoR. Synopsys, AMD, and Microsoft are enabling AI-powered design workflows that combine large-scale reasoning, domain expertise, and cloud-scale compute to accelerate the development of the next generation of AI infrastructure silicon. This milestone builds on the existing collaboration and previously announced agentic specification to RTL workflow, marking the first EDA applications available for evaluation on Microsoft Discovery. AMD is actively evaluating the application of autonomous workflows to accelerate the development of their next-generation products.
お知らせ • Jul 23Synopsys, Inc. to Report Q3, 2026 Results on Aug 26, 2026Synopsys, Inc. announced that they will report Q3, 2026 results on Aug 26, 2026
お知らせ • Jun 29+ 6 more updatesSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth BenchmarkSynopsys, Inc.(NasdaqGS:SNPS) dropped from Russell 1000 Growth Benchmark
お知らせ • Jun 19Synopsys Announces Availability of the First Wave of Multiphysics Fusion SolutionsSynopsys, Inc. announced availability of its first Multiphysics Fusion solutions for customer deployment. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. The first Multiphysics Fusion solutions include targeted GPU-accelerated flows powered by NVIDIA CUDA-X libraries such as cuDSS. Multiphysics Fusion for Timing Signoff enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis. Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with unified full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to incorporate IR, thermal, and stress effects, improving margins and reducing IR-induced timing escapes. Multiphysics Fusion for Design Closure delivers up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA). Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization, accelerating convergence with fewer iterations. Multiphysics Fusion for Multi-die Designs provides unified Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis, providing early system insights from exploration to golden signoff with correct-by-construction design. Multiphysics Fusion for Analog & Photonic Design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip, high accuracy electromagnetic analysis into the analog design flow, and Synopsys OptoCompiler with Lumerical enabling end-to-end photonic IC and co-packaged optics systems. Early engagements with semiconductor and systems companies validate the value of Multiphysics Fusion solutions. Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs. Synopsys' Multiphysics Fusion technology provides a unified, all-aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. The Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available.