View Financial HealthApplied Materials 配当と自社株買い配当金 基準チェック /06Applied Materials配当を支払う会社であり、現在の利回りは0.38%です。主要情報0.4%配当利回り0.6%バイバック利回り総株主利回り1.0%将来の配当利回り0.4%配当成長14.5%次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向18%最近の配当と自社株買いの更新更新なしすべての更新を表示Recent updatesお知らせ • Jun 29+ 4 more updatesApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value BenchmarkApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value Benchmarkお知らせ • Jun 26Applied Materials, Inc. Introduces New Chipmaking Systems for 3D Architectures in AI ChipsApplied Materials, Inc. introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI. A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints. New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic. New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present. Epitaxy has been used for years in leading-edge logic, where precision growth of a crystalline material in the transistor channel has boosted performance well beyond what geometric scaling alone can deliver. Those same techniques are now becoming critical in DRAM peripheral transistors. Applied pioneered silicon germanium epitaxy in transistor channels more than a decade ago with its Centura Prime Epi system. Applied is now introducing an enhanced Centura Prime Epi system that selectively grows doped silicon germanium and silicon phosphorous in source/drain regions, combining advanced strain engineering with precise doping control. The result is higher drive current and transistor efficiency, enabling faster, more power-efficient DRAM operation—essential for the bandwidth demands of HBM and next-generation DDR. The new system also features a 20% smaller footprint, enabling higher tool density and faster capacity scaling in DRAM fabs. In recent years, advanced packaging has become as strategically important to the computing industry as on-chip transistor scaling. Modern AI server chips pack trillions of transistors by integrating multiple dies into a single package. HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs). Applied is the leader in process equipment for advanced packaging, including systems covering the majority of materials engineering steps required to create the TSVs, copper pillars and microbumps that connect stacked dies. Applied is introducing three new systems targeting the most critical advanced packaging process steps. Leveraging Applied’s leadership position in chemical mechanical planarization (CMP), the Opta Quad platform is engineered specifically for advanced packaging, where thicker films, longer polish times and tighter tolerances raise the risk of non-uniformity and yield loss. Opta Quad continuously monitors wafer conditions during polish and dynamically adjusts in real time, improving within-wafer uniformity and total thickness variation control. This is particularly critical for hybrid bonding—an emerging 3D stacking technology in which copper wiring and surrounding dielectrics from two chips are fused together in a single step, requiring near-perfect surface planarity for high-yield results. Nokota VMax 2 is an electrochemical deposition (ECD) system engineered for high-precision copper plating across a broad range of applications for next-generation packaging, from TSV fill for 3D stacking to fine-pitch interconnects such as microbump formation. Nokota VMax 2 introduces Adaptive Pattern Tuning (APT), which dynamically shapes the electric field to correct for layout-driven variation and improve plating uniformity across the wafer. Producer Avila 2 is a plasma-enhanced chemical vapor deposition (PECVD) system that improves the mechanical stability of ultra-thin DRAM dies by depositing stress-balanced dielectric films around TSVs, enabling reliable stacking of 12, 16, and future high-layer-count HBM designs. In addition to HBM, the system supports a range of advanced memory and logic integration schemes. Advanced packaging fabs are encountering defect and metrology challenges once exclusively found in wafer fabs. Feature dimensions have shrunk below the resolution limit of optical inspection tools, and particles that were tolerable with larger bumps now impact yield. A single defect can require scrapping an entire HBM stack, elevating process control to a strategic priority. Applied is extending its eBeam leadership with two new systems specifically designed for advanced packaging—both engineered to handle a wide range of substrate geometries and materials. The latest in Applied’s VeritySEM portfolio for critical dimension (CD) metrology, VeritySEM 7AP enables precise measurement of features on thick, heterogeneous, and highly warped substrates common in HBM and chiplet architectures. VeritySEM AP systems automatically reconfigure to support a range of sizes and materials, while delivering sub-10nm sensitivity—orders of magnitude better than optical tools. SEMVision is the industry’s leading eBeam defect analysis platform. SEMVision G7AP extends Applied’s leadership into advanced packaging, enabling high-resolution defect review and automated classification across silicon, organic, and glass substrates. The system can accelerate yield learning by helping customers quickly distinguish critical defects from nuisance signals. SEMVision G7AP is already in production at memory and logic manufacturers supporting high-volume advanced packaging. A media kit with additional information on the new systems is available.決済の安定と成長配当データの取得安定した配当: AMAT01はTH市場で注目すべき配当金を支払っていないため、支払いが安定しているかどうかを確認する必要はありません。増加する配当: AMAT01はTH市場で注目すべき配当金を支払っていないため、支払額が増加しているかどうかを確認する必要はありません。配当利回り対市場Applied Materials 配当利回り対市場AMAT01 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (AMAT01)0.4%市場下位25% (TH)3.1%市場トップ25% (TH)7.2%業界平均 (Semiconductor)0.7%アナリスト予想 (AMAT01) (最長3年)0.4%注目すべき配当: AMAT01の配当金 ( 0.38% ) はTH市場の配当金支払者の下位 25% ( 3.11% ) と比べると目立ったものではありません。高配当: AMAT01の配当金 ( 0.38% ) はTH市場の配当金支払者の上位 25% ( 7.19% ) と比較すると低いです。株主への利益配当収益カバレッジ: AMAT01 TH市場において目立った配当金を支払っていません。株主配当金キャッシュフローカバレッジ: AMAT01 TH市場において目立った配当金を支払っていません。高配当企業の発掘7D1Y7D1Y7D1YTH 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/07/23 00:15終値2026/07/23 00:00収益2026/04/26年間収益2025/10/26データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Applied Materials, Inc. 34 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。53 アナリスト機関James FontanelliArete Research Services LLPBrett SimpsonArete Research Services LLPJames KelleherArgus Research Company50 その他のアナリストを表示
お知らせ • Jun 29+ 4 more updatesApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value BenchmarkApplied Materials, Inc.(NasdaqGS:AMAT) dropped from Russell 3000 Value Benchmark
お知らせ • Jun 26Applied Materials, Inc. Introduces New Chipmaking Systems for 3D Architectures in AI ChipsApplied Materials, Inc. introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI. A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints. New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic. New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present. Epitaxy has been used for years in leading-edge logic, where precision growth of a crystalline material in the transistor channel has boosted performance well beyond what geometric scaling alone can deliver. Those same techniques are now becoming critical in DRAM peripheral transistors. Applied pioneered silicon germanium epitaxy in transistor channels more than a decade ago with its Centura Prime Epi system. Applied is now introducing an enhanced Centura Prime Epi system that selectively grows doped silicon germanium and silicon phosphorous in source/drain regions, combining advanced strain engineering with precise doping control. The result is higher drive current and transistor efficiency, enabling faster, more power-efficient DRAM operation—essential for the bandwidth demands of HBM and next-generation DDR. The new system also features a 20% smaller footprint, enabling higher tool density and faster capacity scaling in DRAM fabs. In recent years, advanced packaging has become as strategically important to the computing industry as on-chip transistor scaling. Modern AI server chips pack trillions of transistors by integrating multiple dies into a single package. HBM is a leading example of this approach, stacking DRAM chips on top of one another and connecting them with through-silicon vias (TSVs). Applied is the leader in process equipment for advanced packaging, including systems covering the majority of materials engineering steps required to create the TSVs, copper pillars and microbumps that connect stacked dies. Applied is introducing three new systems targeting the most critical advanced packaging process steps. Leveraging Applied’s leadership position in chemical mechanical planarization (CMP), the Opta Quad platform is engineered specifically for advanced packaging, where thicker films, longer polish times and tighter tolerances raise the risk of non-uniformity and yield loss. Opta Quad continuously monitors wafer conditions during polish and dynamically adjusts in real time, improving within-wafer uniformity and total thickness variation control. This is particularly critical for hybrid bonding—an emerging 3D stacking technology in which copper wiring and surrounding dielectrics from two chips are fused together in a single step, requiring near-perfect surface planarity for high-yield results. Nokota VMax 2 is an electrochemical deposition (ECD) system engineered for high-precision copper plating across a broad range of applications for next-generation packaging, from TSV fill for 3D stacking to fine-pitch interconnects such as microbump formation. Nokota VMax 2 introduces Adaptive Pattern Tuning (APT), which dynamically shapes the electric field to correct for layout-driven variation and improve plating uniformity across the wafer. Producer Avila 2 is a plasma-enhanced chemical vapor deposition (PECVD) system that improves the mechanical stability of ultra-thin DRAM dies by depositing stress-balanced dielectric films around TSVs, enabling reliable stacking of 12, 16, and future high-layer-count HBM designs. In addition to HBM, the system supports a range of advanced memory and logic integration schemes. Advanced packaging fabs are encountering defect and metrology challenges once exclusively found in wafer fabs. Feature dimensions have shrunk below the resolution limit of optical inspection tools, and particles that were tolerable with larger bumps now impact yield. A single defect can require scrapping an entire HBM stack, elevating process control to a strategic priority. Applied is extending its eBeam leadership with two new systems specifically designed for advanced packaging—both engineered to handle a wide range of substrate geometries and materials. The latest in Applied’s VeritySEM portfolio for critical dimension (CD) metrology, VeritySEM 7AP enables precise measurement of features on thick, heterogeneous, and highly warped substrates common in HBM and chiplet architectures. VeritySEM AP systems automatically reconfigure to support a range of sizes and materials, while delivering sub-10nm sensitivity—orders of magnitude better than optical tools. SEMVision is the industry’s leading eBeam defect analysis platform. SEMVision G7AP extends Applied’s leadership into advanced packaging, enabling high-resolution defect review and automated classification across silicon, organic, and glass substrates. The system can accelerate yield learning by helping customers quickly distinguish critical defects from nuisance signals. SEMVision G7AP is already in production at memory and logic manufacturers supporting high-volume advanced packaging. A media kit with additional information on the new systems is available.