Teradyne（1TER）株式概要テラダイン社は、米国、アジア太平洋地域、欧州、中東、アフリカにおいて、自動テストシステムおよびロボット製品の設計、開発、製造、販売を行っている。 詳細1TER ファンダメンタル分析スノーフレーク・スコア評価1/6将来の成長5/6過去の実績5/6財務の健全性6/6配当金0/6報酬収益は年間22.28%増加すると予測されています 過去1年間で収益は48.1%増加しました リスク分析Italian市場と比較して、過去 3 か月間の株価の変動が非常に大きいすべてのリスクチェックを見る1TER Community Fair Values Create NarrativeSee what others think this stock is worth. Follow their fair value or set your own to get alerts.Your Fair Value€Current Price€293.5527.4% 割安 内在価値ディスカウントGrowth estimate overAnnual revenue growth rate5 Yearstime period%/yrDecreaseIncreasePastFuture-10m8b2016201920222025202620282031Revenue US$7.9bEarnings US$1.8bAdvancedSet Fair ValueView all narrativesTeradyne, Inc. 競合他社TechnoprobeSymbol: BIT:TPROMarket cap: €18.8bASM InternationalSymbol: ENXTAM:ASMMarket cap: €42.4bHon. PrecisionSymbol: TWSE:7769Market cap: NT$1.3tDiscoSymbol: TSE:6146Market cap: JP¥6.7t価格と性能株価の高値、安値、推移の概要Teradyne過去の株価現在の株価US$293.5552週高値US$362.2052週安値US$67.31ベータ1.791ヶ月の変化-8.21%3ヶ月変化8.94%1年変化306.97%3年間の変化n/a5年間の変化n/aIPOからの変化337.81%最新ニュースRecent Insider Transactions • May 14Vice President recently sold €218k worth of stockOn the 7th of May, Ryan Driscoll sold around 680 shares on-market at roughly €321 per share. This transaction amounted to 26% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was the only on-market transaction from insiders over the last 12 months.お知らせ • May 09Teradyne, Inc. announces Quarterly dividend, payable on June 12, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on June 12, 2026, ex-date on May 21, 2026 and record date on May 21, 2026.お知らせ • Apr 29Teradyne, Inc. Provides Earnings Guidance for the Second Quarter of 2026Teradyne, Inc. provided earnings guidance for the Second quarter of 2026. For the quarter, the company provided revenue guidance of $1,150 million to $1,250 million, with GAAP net income of $1.83 to $2.12 per diluted share.Reported Earnings • Apr 29First quarter 2026 earnings released: EPS: US$2.55 (vs US$0.61 in 1Q 2025)First quarter 2026 results: EPS: US$2.55 (up from US$0.61 in 1Q 2025). Revenue: US$1.28b (up 87% from 1Q 2025). Net income: US$398.9m (up 303% from 1Q 2025). Profit margin: 31% (up from 14% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 16% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe.お知らせ • Apr 17Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd.Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. on April 16, 2026. The acquisition strengthens Teradyne’s ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets. By combining TestInsight’s pattern conversion, validation, and virtual test capabilities with Teradyne’s ATE platforms, customers will benefit from a tightly integrated design-to-test workflow that reduces debug cycles, improves coverage, and enables earlier test program readiness. As part of Teradyne’s ongoing commitment to an open ecosystem, TestInsight will continue to support existing customers across all ATE platforms and preserve its long-standing OEM and partner relationships. Teradyne, Inc. (NasdaqGS:TER) completed the acquisition of Test Insight Ltd. on April 16, 2026.お知らせ • Apr 15Teradyne, Inc. to Report Q1, 2026 Results on Apr 28, 2026Teradyne, Inc. announced that they will report Q1, 2026 results at 4:30 PM, US Eastern Standard Time on Apr 28, 2026最新情報をもっと見るRecent updatesRecent Insider Transactions • May 14Vice President recently sold €218k worth of stockOn the 7th of May, Ryan Driscoll sold around 680 shares on-market at roughly €321 per share. This transaction amounted to 26% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was the only on-market transaction from insiders over the last 12 months.お知らせ • May 09Teradyne, Inc. announces Quarterly dividend, payable on June 12, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on June 12, 2026, ex-date on May 21, 2026 and record date on May 21, 2026.お知らせ • Apr 29Teradyne, Inc. Provides Earnings Guidance for the Second Quarter of 2026Teradyne, Inc. provided earnings guidance for the Second quarter of 2026. For the quarter, the company provided revenue guidance of $1,150 million to $1,250 million, with GAAP net income of $1.83 to $2.12 per diluted share.Reported Earnings • Apr 29First quarter 2026 earnings released: EPS: US$2.55 (vs US$0.61 in 1Q 2025)First quarter 2026 results: EPS: US$2.55 (up from US$0.61 in 1Q 2025). Revenue: US$1.28b (up 87% from 1Q 2025). Net income: US$398.9m (up 303% from 1Q 2025). Profit margin: 31% (up from 14% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 16% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe.お知らせ • Apr 17Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd.Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. on April 16, 2026. The acquisition strengthens Teradyne’s ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets. By combining TestInsight’s pattern conversion, validation, and virtual test capabilities with Teradyne’s ATE platforms, customers will benefit from a tightly integrated design-to-test workflow that reduces debug cycles, improves coverage, and enables earlier test program readiness. As part of Teradyne’s ongoing commitment to an open ecosystem, TestInsight will continue to support existing customers across all ATE platforms and preserve its long-standing OEM and partner relationships. Teradyne, Inc. (NasdaqGS:TER) completed the acquisition of Test Insight Ltd. on April 16, 2026.お知らせ • Apr 15Teradyne, Inc. to Report Q1, 2026 Results on Apr 28, 2026Teradyne, Inc. announced that they will report Q1, 2026 results at 4:30 PM, US Eastern Standard Time on Apr 28, 2026お知らせ • Mar 30Teradyne, Inc., Annual General Meeting, May 08, 2026Teradyne, Inc., Annual General Meeting, May 08, 2026. Location: at the ofices of teradyne, inc. at 600 riverpark drive, north reading, massachusets 01864, United Statesお知らせ • Mar 23Teradyne Inc Showcases Test Solutions At Semicon ChinaTeradyne, Inc. participated at SEMICON China 2026, taking place March 25-27 at the Shanghai New International Expo Centre in Shanghai, China. Visitors are invited to experience Teradyne’s latest innovations and connect with experts at the booth in hall N2, booth 2371. Teradyne showcased four test solutions at the booth, each designed to address the evolving challenges of advanced devices powering AI infrastructure. Teradyne UltraFLEXplus is a scalable, future-ready platform for testing AI accelerators, xPUs, datacenter networking equipment and ADAS semiconductors, combining superior digital capabilities and robust power delivery to support the demanding test requirements of next-generation devices. Streamlined workflows and advanced automation speed time to market while delivering on rigorous quality standards. Teradyne ETS-800 ensures clean, stable voltage and high-accuracy measurements for ultra-low resistance devices. Its efficient current delivery for measuring resistance supports mission-critical reliability and scalable production from low to high volume. Teradyne Titan HP sets a new standard in system level test for AI and cloud devices with advanced active thermal control and multi-branch cooling, preventing overheating while optimizing test time. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured their investment today will meet the demanding requirements of tomorrow’s devices as well. Teradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. Featuring a near-DUT test architecture, it delivers superior signal integrity performance at high data rates to enhance yield gain. With over 18,000 high-speed digital channels, the Magnum EPIC delivers high-speed clocks to enable device test speeds up to 12.12 Gbps with the high parallel capacity needed for testing high-volume DRAM devices. On Thursday at 16:40, Teradyne will have a featured speaking session DevOpsForTest at the SEMICON China Design Innovation Forum: AI Intelligent Applications and Automotive ICs. This year marks a significant milestone for Teradyne as the company celebrates 25 years in China. Since establishing the first office in the region in 2001, Teradyne has played a pivotal role in supporting the rapid growth of China’s semiconductor and electronics industries. Through close collaboration with local customers and ongoing investment in engineering and service capabilities, Teradyne remains committed to advancing innovation, fostering talent, and contributing to the development of China’s technology ecosystem. Explore the latest test solutions at the booth at SEMICON China in hall N2, booth 2371.お知らせ • Mar 17+ 2 more updatesTeradyne Inc Introduces Photon 100Teradyne, Inc. announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating optical and electrical instrumentation with Teradyne’s UltraFLEXplus platform, Teradyne Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions. This solution simplifies operations, accelerates time-to-market, and enables rapid scaling for silicon photonics and co-packaged optics manufacturing. Key Features and Benefits: Integrated Optical & Electrical Instrumentation: Combines advanced optical and electrical test capabilities. Scalable for High-Volume Manufacturing: Designed to support the rigorous demands of high-volume SiPh and CPO production environments. Comprehensive Test Coverage: Supports wafer (single and double-sided), optical engine, and CPO test insertions. Customizable Optical Instrumentation: Standard configuration available, with the ability to tailor optical instrumentation if needed. Operational Simplicity: Designed, built and maintained by Teradyne, eliminating the need for customers to integrate and support multi-vendor solutions. Open Ecosystem: Customers can choose their preferred ecosystem partners for high-volume manufacturing, including wafer-level and die-level probe options. With the Photon 100, Teradyne reinforces its leadership position in high-volume SiPh and CPO test, delivering an integrated, scalable, and automated solution for today’s most advanced manufacturing challenges. By combining optical and electrical instrumentation with the UltraFLEXplus platform, Teradyne Photon 100 empowers customers to accelerate innovation, reduce operational complexity, and scale production to meet the growing demands of AI and next-generation data centers. The Photon 100 underscores Teradyne’s commitment to driving the future of silicon photonics and co-packaged optics manufacturing with test solutions.Reported Earnings • Feb 03Full year 2025 earnings released: EPS: US$3.48 (vs US$3.41 in FY 2024)Full year 2025 results: EPS: US$3.48 (up from US$3.41 in FY 2024). Revenue: US$3.19b (up 13% from FY 2024). Net income: US$554.0m (up 2.2% from FY 2024). Profit margin: 17% (down from 19% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe.お知らせ • Feb 03Teradyne, Inc. Provides Earnings Guidance for the First Quarter of 2026Teradyne, Inc. provided earnings guidance for the first quarter of 2026. Guidance for the first quarter of 2026 is revenue of $1,150 million to $1,250 million, with GAAP net income of $1.82 to $2.19 per diluted share.Declared Dividend • Jan 29Third quarter dividend of US$0.12 announcedShareholders will receive a dividend of US$0.12. Ex-date: 12th February 2026 Payment date: 13th March 2026 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%.お知らせ • Jan 27Teradyne, Inc. announces Quarterly dividend, payable on March 13, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on March 13, 2026, ex-date on February 13, 2026 and record date on February 13, 2026.お知らせ • Jan 14Teradyne, Inc. to Report Q4, 2025 Results on Feb 02, 2026Teradyne, Inc. announced that they will report Q4, 2025 results at 5:00 PM, US Eastern Standard Time on Feb 02, 2026Valuation Update With 7 Day Price Move • Jan 06Investor sentiment improves as stock rises 16%After last week's 16% share price gain to €195, the stock trades at a forward P/E ratio of 49x. Average forward P/E is 25x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.64 per share.Valuation Update With 7 Day Price Move • Nov 28Investor sentiment improves as stock rises 17%After last week's 17% share price gain to €157, the stock trades at a forward P/E ratio of 40x. Average forward P/E is 18x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.87 per share.Declared Dividend • Nov 13Dividend of US$0.12 announcedShareholders will receive a dividend of US$0.12. Ex-date: 21st November 2025 Payment date: 17th December 2025 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%.お知らせ • Nov 11Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on December 17, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on December 17, 2025, to shareholders of record as of the close of business on November 24, 2025.Reported Earnings • Oct 29Third quarter 2025 earnings released: EPS: US$0.75 (vs US$0.89 in 3Q 2024)Third quarter 2025 results: EPS: US$0.75 (down from US$0.89 in 3Q 2024). Revenue: US$769.2m (up 4.3% from 3Q 2024). Net income: US$119.6m (down 18% from 3Q 2024). Profit margin: 16% (down from 20% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 9.1% growth forecast for the Semiconductor industry in Europe.お知らせ • Oct 29+ 1 more updateTeradyne, Inc. Provides Earnings Guidance for the Fourth Quarter of 2025Teradyne, Inc. provided earnings guidance for the fourth quarter of 2025. For the period, the company expects revenue of $920 million to $1,000 million, with GAAP net income of $1.12 to $1.39 per diluted share.お知らせ • Oct 16Teradyne, Inc. to Report Q3, 2025 Results on Oct 28, 2025Teradyne, Inc. announced that they will report Q3, 2025 results at 5:00 PM, US Eastern Standard Time on Oct 28, 2025お知らせ • Oct 08Teradyne, Inc. Announces the ETS-800 Dual Sector Automated Test SystemTeradyne, Inc. announced the launch of the ETS-800 D20, the latest addition to the ETS-800 platform of high-performance test systems for power semiconductors. The Teradyne ETS-800 D20 is designed to address the diverse needs of customers by offering a versatile and cost-effective solution for both high volume and high mix/low volume device testing.お知らせ • Oct 03Teradyne, Inc. Unveils Titan HPTeradyne, Inc. announced the launch of its Titan HP system level test (SLT) platform, designed specifically for the artificial intelligence (AI) and cloud infrastructure markets. This innovative solution addresses the increasing demands of today's advanced technologies as process nodes become smaller and new architectures emerge. SLT has become an integral part of the high-volume manufacturing process, as the complex devices used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal output. Teradyne Titan HP, currently in production at a number of large customers, is purpose-built to test these devices in real-world conditions. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured that their investment will meet the demanding requirements of tomorrow's devices as well. Teradyne Titan HP's superior thermal control ensures devices meet rigorous quality standards at or above the expected yield. This includes: A multi-branch cold plate architecture, which cools both the device under test (DUT) and non-DUT components for comprehensive thermal management. Asynchronous cooling control with proportional, integral and derivative (PID)-tuned, per-site thermal control, which provides precise, efficient cooling to prevent overheating. A DUT heater option, which enhances the accuracy of automated temperature control (ATC) for more precise thermal testing.お知らせ • Oct 01Teradyne, Inc. Unveils PHY Performance Testing CapabilitiesTeradyne, Inc. announced the release of Teradyne UltraPHY224G for UltraFLEXplus, a breakthrough in high-speed PHY performance testing that extends its portfolio beyond the UltraPHY 112G instrument already in production and adopted by a number of customers. Both solutions are designed for the UltraFLEXplus, and leverage Teradyne's IG-XL software for ease of adoption. Teradyne UltraPHY 224G for UltraFLEX plus is a breakthrough in high-speedPHY performance testing to address emerging data rates in the data center and silicon photonics (SiPh) markets. Developed by Teradyne with Multilane modules, UltraPHY 224G delivers bench-quality signal generation and measurement for production testing, setting a new benchmark for test density and the signal fidelity required by next-generation semiconductor interfaces. Customers can be confident that their UltraPHY investments support both today's and tomorrow's chiplet-based architectures, advanced packaging, and KGD workflows. UltraPHY 224G, developed by Teradyne with MultILane modules, delivers bench-quality signal generation, and measurement for production testing. Designed to meet strict hardware and software standards, it sets a new benchmark for testdensity and the signal fidelity required by Next-generation semiconductor interfaces. While UltraPHY 112G is optimized for today's high-speed standards, UltraPHY 224G extends the performance envelope to address emerging data rates in The data center and silicon photonics markets. Both instruments are designed to co-exist in the same UltraFLEXplus platform, giving customers maximum flexibility to test the broadest range of current and future high-speed interfaces. UltraPHY 224G provides 8 full-duplex differential lanes plus 8 Rx-only differential lanes per instrument, supporting data rates up to 112 Gb/s NRZ and 224 Gb/s (112 Gbaud PAM4) using a DSO + BERT architecture. Like Teradyne's UltraPHY 112G, the UltraPHY 224G is extremely scalable, with support for multiple instruments per UltraFLEXplus platform and the flexibility to extend to emerging advanced modulation formats as the industry evolves. Key benefits include: Single tester platform for all PHY testing needs - both the UltraPHY 224G and the UltraPHY 112G are designed for Teradyne UltraFLEXplus. Integrated DSO, AWG, and BERT capabilities for comprehensive PHY production testing and characterization. >50GHz signal delivery bandwidth with proven reliability in production environments. Extensible architecture to support current and future electrical interface standards for SiPh and non-SiPh devices. As PHY interfaces continue to evolve, Teradyne UltraPHY is a future-proof solution deployed on a single test platform - Teradyne UltraFLE Xplus.New Risk • Sep 22New major risk - Share price stabilityThe company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of Italian stocks, typically moving 7.3% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company.Valuation Update With 7 Day Price Move • Sep 22Investor sentiment improves as stock rises 15%After last week's 15% share price gain to €111, the stock trades at a forward P/E ratio of 33x. Average forward P/E is 20x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €91.84 per share.Buy Or Sell Opportunity • Sep 19Now 20% overvalued after recent price riseOver the last 90 days, the stock has risen 35% to €100. The fair value is estimated to be €83.58, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period.お知らせ • Sep 03Teradyne, Inc. Announces Change of Group President of the Teradyne Robotics GroupTeradyne, Inc. named Jean-Pierre ‘JP’ Hathout as Group President of the Teradyne Robotics Group, succeeding Ujjwal Kumar. Hathout was appointed President of Universal Robots in May and was previously President of Mobile Industrial Robotics (MiR) for two years. Hathout brings over two decades of international management experience, including 17 years at Bosch, and most recently led MiR to strengthen its product portfolio and global position. He will continue to lead Universal Robots in his new position.お知らせ • Aug 26Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on September 29, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on September 29, 2025, to shareholders of record as of the close of business on September 5, 2025.Buy Or Sell Opportunity • Aug 25Now 21% overvalued after recent price riseOver the last 90 days, the stock has risen 39% to €99.81. The fair value is estimated to be €82.66, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period.お知らせ • Aug 05Teradyne, Inc. Unveils Magnum 7H - the Next-Generation Memory Tester for High Bandwidth Memory DevicesTeradyne, Inc. announced the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices, integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale. Volume shipments and HBM device production on Teradyne's Magnum 7H have started ramping at the largest HBM manufacturers in the industry. The Magnum 7H is a cutting-edge memory tester that supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It offers comprehensive test coverage, from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Additionally, the Magnum 7H supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with traditional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality. The Teradyne Magnum 7H delivers: Enhanced Device Quality: Superior DPS response time delivers higher device yield. Comprehensive Memory and Logic Testing:Magnum 7H is ideally suited for testing HBM stacks that contain both logic base dies and DRAM dies. It delivers high-speed memory testing with a flexible algorithmic pattern generator (APG) and logic testing with Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures high-speed error capture for both memory and logic testing. High Performance: High-speed testing of current HBM3/3E and next-generation HBM4/4E devices up to 4.5Gbps. High Parallelism: Essential for lowering overall cost-of-test for HBM, the Magnum 7H is configurable for up to 9,216 digital pins and 2,560 power pins, enabling superior touchdown efficiency at probe and resulting in 1.6x increased throughput in mass production environments. The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne's Magnum 7 HBM is a next-generation memory testers engineered to test both and tomorrow's HBM devices with high parallelism, speed, and accuracy, across the entire manufacturing process.Board Change • Aug 01High number of new directorsThere are 5 new directors who have joined the board in the last 3 years. Independent Director Necip Sayiner was the last director to join the board, commencing their role in 2025. The company’s lack of board continuity is considered a risk according to the Simply Wall St Risk Model.Reported Earnings • Jul 30Second quarter 2025 earnings released: EPS: US$0.49 (vs US$1.18 in 2Q 2024)Second quarter 2025 results: EPS: US$0.49 (down from US$1.18 in 2Q 2024). Revenue: US$651.8m (down 11% from 2Q 2024). Net income: US$78.4m (down 58% from 2Q 2024). Profit margin: 12% (down from 26% in 2Q 2024). The decrease in margin was primarily driven by lower revenue. Revenue is forecast to grow 12% p.a. on average during the next 3 years, compared to a 8.4% growth forecast for the Semiconductor industry in Europe.お知らせ • Jul 30Teradyne, Inc. Provides Earnings Guidance for the Third Quarter of 2025Teradyne, Inc. provided earnings guidance for the third quarter of 2025. For the period, the company expects revenue of $710 million to $770 million, with GAAP net income of $0.62 to $0.80 per diluted share.お知らせ • Jul 15Teradyne, Inc. to Report Q2, 2025 Results on Jul 29, 2025Teradyne, Inc. announced that they will report Q2, 2025 results at 5:00 PM, US Eastern Standard Time on Jul 29, 2025お知らせ • Jun 30+ 4 more updatesTeradyne, Inc.(NasdaqGS:TER) dropped from Russell 1000 Growth-Defensive IndexTeradyne, Inc.(NasdaqGS:TER) dropped from Russell 1000 Growth-Defensive Indexお知らせ • Jun 27Teradyne, Inc. Announces Election of Two New Independent DirectorsTeradyne, Inc. announced the election of two new independent directors to its Board of Directors. Drew Henry, Executive Vice President of Strategy & Ecosystem at Arm Holdings, and Dr. Necip Sayiner, former President and CEO of Intersil Corporation, will join the Teradyne Board effective July 1, 2025. Mr. Henry was appointed to the Board's Compensation Committee and Nominating and Corporate Governance Committee, and Dr. Sayiner was appointed to the Board’s Audit Committee. Drew Henry brings more than 30 years of deep industry experience across the semiconductor, computing, and technology sectors, with a focus on strategic growth, platform development, and operational execution. Prior to joining Arm, Mr. Henry served as the CEO of Acetti Software and held senior roles at SanDisk and Nvidia. He holds a Master of Science in Electrical Engineering from the University of Southern California and a BS in Engineering Physics from the University of the Pacific. Dr. Necip Sayiner has over 25 years of leadership experience in the semiconductor industry. He served as President and CEO of Intersil Corporation and later joined Renesas as Executive Vice President and General Manager. Prior to Intersil, he was President and CEO of Silicon Laboratories and held senior executive positions at Agere Systems. Dr. Sayiner holds a Ph.D. in Electrical Engineering from the University of Pennsylvania, an MS in Engineering from Southern Illinois University, and dual BS degrees in Electrical and Electronics Engineering and Physics from Bosphorus University in Turkey.お知らせ • May 09Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on June 13, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on June 13, 2025, to shareholders of record as of the close of business on May 22, 2025.Reported Earnings • May 06First quarter 2025 earnings released: EPS: US$0.61 (vs US$0.42 in 1Q 2024)First quarter 2025 results: EPS: US$0.61 (up from US$0.42 in 1Q 2024). Revenue: US$685.7m (up 14% from 1Q 2024). Net income: US$98.9m (up 54% from 1Q 2024). Profit margin: 14% (up from 11% in 1Q 2024). The increase in margin was driven by higher revenue. Revenue is forecast to grow 11% p.a. on average during the next 3 years, compared to a 9.4% growth forecast for the Semiconductor industry in Europe.株主還元1TERIT SemiconductorIT 市場7D-4.1%2.2%-0.3%1Y307.0%105.8%16.8%株主還元を見る業界別リターン: 1TER過去 1 年間で105.8 % の収益を上げたItalian Semiconductor業界を上回りました。リターン対市場: 1TER過去 1 年間で16.8 % の収益を上げたItalian市場を上回りました。価格変動Is 1TER's price volatile compared to industry and market?1TER volatility1TER Average Weekly Movement10.3%Semiconductor Industry Average Movement9.4%Market Average Movement5.2%10% most volatile stocks in IT Market8.4%10% least volatile stocks in IT Market3.1%安定した株価: 1TERの株価は、 Italian市場と比較して過去 3 か月間で変動しています。時間の経過による変動: 1TERの weekly volatility ( 10% ) は過去 1 年間安定していますが、依然としてItalianの株式の 75% よりも高くなっています。会社概要設立従業員CEO（最高経営責任者ウェブサイト19606,600Greg Smithwww.teradyne.comテラダイン社は、米国、アジア太平洋地域、欧州、中東、アフリカにおいて、自動テストシステムおよびロボット製品の設計、開発、製造、販売を行っている。半導体テスト事業、ロボット事業、その他事業を展開。半導体テスト事業では、自動車、産業、通信、民生、スマートフォン、クラウド、コンピュータ、電子ゲーム、その他のアプリケーションにおける半導体デバイスのウェハレベルテスト、デバイスパッケージテスト、システムレベルテストのための製品とサービスを提供している。また、FLEXテストプラットフォームシステム、マイクロコントローラなどの大容量半導体デバイスに対応するJ750テストシステム、フラッシュメモリやDRAMなどのメモリデバイスをテストするMagnumプラットフォーム、アナログ/ミックスドシグナル市場の半導体メーカーや組立・テストサブコントラクタ向けのETSプラットフォームも提供している。また、シリコンウエハーの製造を事業に組み込んでいる集積デバイスメーカー、シリコンウエハーの製造をアウトソーシングしているファブレス企業、ファウンドリー、半導体組立・テストプロバイダーにもサービスを提供している。ロボティクス部門は、製造、物流、産業向けに、協働ロボットアーム、自律移動ロボット、高度ロボット制御ソフトウェアを提供している。また、半導体テストシステムおよび機器、防衛/航空宇宙テスト機器およびシステム、ストレージおよびシステムレベルテストシステム、ワイヤレステストシステムおよびロボット製品、回路基板テストおよび検査システム、製造基板テスト、シリコン検証用ワイヤレステストソリューション、ワイヤレスモジュール製造用ワイヤレステストソリューション、ワイヤレスエンドデバイス製造用ワイヤレステストソリューションをライトポイントブランドで提供している。テラダイン社は1960年に設立され、マサチューセッツ州ノースリーディングに本社を置いている。もっと見るTeradyne, Inc. 基礎のまとめTeradyne の収益と売上を時価総額と比較するとどうか。1TER 基礎統計学時価総額€43.28b収益（TTM）€734.41m売上高(TTM)€3.26b63.1xPER（株価収益率14.2xP/Sレシオ1TER は割高か？公正価値と評価分析を参照収益と収入最新の決算報告書（TTM）に基づく主な収益性統計1TER 損益計算書（TTM）収益US$3.79b売上原価US$1.56b売上総利益US$2.22bその他の費用US$1.37b収益US$854.06m直近の収益報告Mar 29, 2026次回決算日該当なし一株当たり利益（EPS）5.46グロス・マージン58.70%純利益率22.55%有利子負債／自己資本比率0%1TER の長期的なパフォーマンスは？過去の実績と比較を見る配当金0.2%現在の配当利回り9%配当性向View Valuation企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/20 09:05終値2026/05/20 00:00収益2026/03/29年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Teradyne, Inc. 18 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。35 アナリスト機関Steven LiuAletheia Analyst Network LimitedQuinn FredricksonBairdRobert MasonBaird32 その他のアナリストを表示
Recent Insider Transactions • May 14Vice President recently sold €218k worth of stockOn the 7th of May, Ryan Driscoll sold around 680 shares on-market at roughly €321 per share. This transaction amounted to 26% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was the only on-market transaction from insiders over the last 12 months.
お知らせ • May 09Teradyne, Inc. announces Quarterly dividend, payable on June 12, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on June 12, 2026, ex-date on May 21, 2026 and record date on May 21, 2026.
お知らせ • Apr 29Teradyne, Inc. Provides Earnings Guidance for the Second Quarter of 2026Teradyne, Inc. provided earnings guidance for the Second quarter of 2026. For the quarter, the company provided revenue guidance of $1,150 million to $1,250 million, with GAAP net income of $1.83 to $2.12 per diluted share.
Reported Earnings • Apr 29First quarter 2026 earnings released: EPS: US$2.55 (vs US$0.61 in 1Q 2025)First quarter 2026 results: EPS: US$2.55 (up from US$0.61 in 1Q 2025). Revenue: US$1.28b (up 87% from 1Q 2025). Net income: US$398.9m (up 303% from 1Q 2025). Profit margin: 31% (up from 14% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 16% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe.
お知らせ • Apr 17Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd.Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. on April 16, 2026. The acquisition strengthens Teradyne’s ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets. By combining TestInsight’s pattern conversion, validation, and virtual test capabilities with Teradyne’s ATE platforms, customers will benefit from a tightly integrated design-to-test workflow that reduces debug cycles, improves coverage, and enables earlier test program readiness. As part of Teradyne’s ongoing commitment to an open ecosystem, TestInsight will continue to support existing customers across all ATE platforms and preserve its long-standing OEM and partner relationships. Teradyne, Inc. (NasdaqGS:TER) completed the acquisition of Test Insight Ltd. on April 16, 2026.
お知らせ • Apr 15Teradyne, Inc. to Report Q1, 2026 Results on Apr 28, 2026Teradyne, Inc. announced that they will report Q1, 2026 results at 4:30 PM, US Eastern Standard Time on Apr 28, 2026
Recent Insider Transactions • May 14Vice President recently sold €218k worth of stockOn the 7th of May, Ryan Driscoll sold around 680 shares on-market at roughly €321 per share. This transaction amounted to 26% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. This was the only on-market transaction from insiders over the last 12 months.
お知らせ • May 09Teradyne, Inc. announces Quarterly dividend, payable on June 12, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on June 12, 2026, ex-date on May 21, 2026 and record date on May 21, 2026.
お知らせ • Apr 29Teradyne, Inc. Provides Earnings Guidance for the Second Quarter of 2026Teradyne, Inc. provided earnings guidance for the Second quarter of 2026. For the quarter, the company provided revenue guidance of $1,150 million to $1,250 million, with GAAP net income of $1.83 to $2.12 per diluted share.
Reported Earnings • Apr 29First quarter 2026 earnings released: EPS: US$2.55 (vs US$0.61 in 1Q 2025)First quarter 2026 results: EPS: US$2.55 (up from US$0.61 in 1Q 2025). Revenue: US$1.28b (up 87% from 1Q 2025). Net income: US$398.9m (up 303% from 1Q 2025). Profit margin: 31% (up from 14% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 16% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe.
お知らせ • Apr 17Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd.Teradyne, Inc. (NasdaqGS:TER) acquired Test Insight Ltd. on April 16, 2026. The acquisition strengthens Teradyne’s ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets. By combining TestInsight’s pattern conversion, validation, and virtual test capabilities with Teradyne’s ATE platforms, customers will benefit from a tightly integrated design-to-test workflow that reduces debug cycles, improves coverage, and enables earlier test program readiness. As part of Teradyne’s ongoing commitment to an open ecosystem, TestInsight will continue to support existing customers across all ATE platforms and preserve its long-standing OEM and partner relationships. Teradyne, Inc. (NasdaqGS:TER) completed the acquisition of Test Insight Ltd. on April 16, 2026.
お知らせ • Apr 15Teradyne, Inc. to Report Q1, 2026 Results on Apr 28, 2026Teradyne, Inc. announced that they will report Q1, 2026 results at 4:30 PM, US Eastern Standard Time on Apr 28, 2026
お知らせ • Mar 30Teradyne, Inc., Annual General Meeting, May 08, 2026Teradyne, Inc., Annual General Meeting, May 08, 2026. Location: at the ofices of teradyne, inc. at 600 riverpark drive, north reading, massachusets 01864, United States
お知らせ • Mar 23Teradyne Inc Showcases Test Solutions At Semicon ChinaTeradyne, Inc. participated at SEMICON China 2026, taking place March 25-27 at the Shanghai New International Expo Centre in Shanghai, China. Visitors are invited to experience Teradyne’s latest innovations and connect with experts at the booth in hall N2, booth 2371. Teradyne showcased four test solutions at the booth, each designed to address the evolving challenges of advanced devices powering AI infrastructure. Teradyne UltraFLEXplus is a scalable, future-ready platform for testing AI accelerators, xPUs, datacenter networking equipment and ADAS semiconductors, combining superior digital capabilities and robust power delivery to support the demanding test requirements of next-generation devices. Streamlined workflows and advanced automation speed time to market while delivering on rigorous quality standards. Teradyne ETS-800 ensures clean, stable voltage and high-accuracy measurements for ultra-low resistance devices. Its efficient current delivery for measuring resistance supports mission-critical reliability and scalable production from low to high volume. Teradyne Titan HP sets a new standard in system level test for AI and cloud devices with advanced active thermal control and multi-branch cooling, preventing overheating while optimizing test time. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured their investment today will meet the demanding requirements of tomorrow’s devices as well. Teradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. Featuring a near-DUT test architecture, it delivers superior signal integrity performance at high data rates to enhance yield gain. With over 18,000 high-speed digital channels, the Magnum EPIC delivers high-speed clocks to enable device test speeds up to 12.12 Gbps with the high parallel capacity needed for testing high-volume DRAM devices. On Thursday at 16:40, Teradyne will have a featured speaking session DevOpsForTest at the SEMICON China Design Innovation Forum: AI Intelligent Applications and Automotive ICs. This year marks a significant milestone for Teradyne as the company celebrates 25 years in China. Since establishing the first office in the region in 2001, Teradyne has played a pivotal role in supporting the rapid growth of China’s semiconductor and electronics industries. Through close collaboration with local customers and ongoing investment in engineering and service capabilities, Teradyne remains committed to advancing innovation, fostering talent, and contributing to the development of China’s technology ecosystem. Explore the latest test solutions at the booth at SEMICON China in hall N2, booth 2371.
お知らせ • Mar 17+ 2 more updatesTeradyne Inc Introduces Photon 100Teradyne, Inc. announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating optical and electrical instrumentation with Teradyne’s UltraFLEXplus platform, Teradyne Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions. This solution simplifies operations, accelerates time-to-market, and enables rapid scaling for silicon photonics and co-packaged optics manufacturing. Key Features and Benefits: Integrated Optical & Electrical Instrumentation: Combines advanced optical and electrical test capabilities. Scalable for High-Volume Manufacturing: Designed to support the rigorous demands of high-volume SiPh and CPO production environments. Comprehensive Test Coverage: Supports wafer (single and double-sided), optical engine, and CPO test insertions. Customizable Optical Instrumentation: Standard configuration available, with the ability to tailor optical instrumentation if needed. Operational Simplicity: Designed, built and maintained by Teradyne, eliminating the need for customers to integrate and support multi-vendor solutions. Open Ecosystem: Customers can choose their preferred ecosystem partners for high-volume manufacturing, including wafer-level and die-level probe options. With the Photon 100, Teradyne reinforces its leadership position in high-volume SiPh and CPO test, delivering an integrated, scalable, and automated solution for today’s most advanced manufacturing challenges. By combining optical and electrical instrumentation with the UltraFLEXplus platform, Teradyne Photon 100 empowers customers to accelerate innovation, reduce operational complexity, and scale production to meet the growing demands of AI and next-generation data centers. The Photon 100 underscores Teradyne’s commitment to driving the future of silicon photonics and co-packaged optics manufacturing with test solutions.
Reported Earnings • Feb 03Full year 2025 earnings released: EPS: US$3.48 (vs US$3.41 in FY 2024)Full year 2025 results: EPS: US$3.48 (up from US$3.41 in FY 2024). Revenue: US$3.19b (up 13% from FY 2024). Net income: US$554.0m (up 2.2% from FY 2024). Profit margin: 17% (down from 19% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 12% growth forecast for the Semiconductor industry in Europe.
お知らせ • Feb 03Teradyne, Inc. Provides Earnings Guidance for the First Quarter of 2026Teradyne, Inc. provided earnings guidance for the first quarter of 2026. Guidance for the first quarter of 2026 is revenue of $1,150 million to $1,250 million, with GAAP net income of $1.82 to $2.19 per diluted share.
Declared Dividend • Jan 29Third quarter dividend of US$0.12 announcedShareholders will receive a dividend of US$0.12. Ex-date: 12th February 2026 Payment date: 13th March 2026 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%.
お知らせ • Jan 27Teradyne, Inc. announces Quarterly dividend, payable on March 13, 2026Teradyne, Inc. announced Quarterly dividend of USD 0.1300 per share payable on March 13, 2026, ex-date on February 13, 2026 and record date on February 13, 2026.
お知らせ • Jan 14Teradyne, Inc. to Report Q4, 2025 Results on Feb 02, 2026Teradyne, Inc. announced that they will report Q4, 2025 results at 5:00 PM, US Eastern Standard Time on Feb 02, 2026
Valuation Update With 7 Day Price Move • Jan 06Investor sentiment improves as stock rises 16%After last week's 16% share price gain to €195, the stock trades at a forward P/E ratio of 49x. Average forward P/E is 25x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.64 per share.
Valuation Update With 7 Day Price Move • Nov 28Investor sentiment improves as stock rises 17%After last week's 17% share price gain to €157, the stock trades at a forward P/E ratio of 40x. Average forward P/E is 18x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €94.87 per share.
Declared Dividend • Nov 13Dividend of US$0.12 announcedShareholders will receive a dividend of US$0.12. Ex-date: 21st November 2025 Payment date: 17th December 2025 Dividend yield will be 0.2%, which is lower than the industry average of 1.2%. Payout Ratios Payout ratio: 17%. Cash payout ratio: 16%.
お知らせ • Nov 11Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on December 17, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on December 17, 2025, to shareholders of record as of the close of business on November 24, 2025.
Reported Earnings • Oct 29Third quarter 2025 earnings released: EPS: US$0.75 (vs US$0.89 in 3Q 2024)Third quarter 2025 results: EPS: US$0.75 (down from US$0.89 in 3Q 2024). Revenue: US$769.2m (up 4.3% from 3Q 2024). Net income: US$119.6m (down 18% from 3Q 2024). Profit margin: 16% (down from 20% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 13% p.a. on average during the next 3 years, compared to a 9.1% growth forecast for the Semiconductor industry in Europe.
お知らせ • Oct 29+ 1 more updateTeradyne, Inc. Provides Earnings Guidance for the Fourth Quarter of 2025Teradyne, Inc. provided earnings guidance for the fourth quarter of 2025. For the period, the company expects revenue of $920 million to $1,000 million, with GAAP net income of $1.12 to $1.39 per diluted share.
お知らせ • Oct 16Teradyne, Inc. to Report Q3, 2025 Results on Oct 28, 2025Teradyne, Inc. announced that they will report Q3, 2025 results at 5:00 PM, US Eastern Standard Time on Oct 28, 2025
お知らせ • Oct 08Teradyne, Inc. Announces the ETS-800 Dual Sector Automated Test SystemTeradyne, Inc. announced the launch of the ETS-800 D20, the latest addition to the ETS-800 platform of high-performance test systems for power semiconductors. The Teradyne ETS-800 D20 is designed to address the diverse needs of customers by offering a versatile and cost-effective solution for both high volume and high mix/low volume device testing.
お知らせ • Oct 03Teradyne, Inc. Unveils Titan HPTeradyne, Inc. announced the launch of its Titan HP system level test (SLT) platform, designed specifically for the artificial intelligence (AI) and cloud infrastructure markets. This innovative solution addresses the increasing demands of today's advanced technologies as process nodes become smaller and new architectures emerge. SLT has become an integral part of the high-volume manufacturing process, as the complex devices used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal output. Teradyne Titan HP, currently in production at a number of large customers, is purpose-built to test these devices in real-world conditions. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured that their investment will meet the demanding requirements of tomorrow's devices as well. Teradyne Titan HP's superior thermal control ensures devices meet rigorous quality standards at or above the expected yield. This includes: A multi-branch cold plate architecture, which cools both the device under test (DUT) and non-DUT components for comprehensive thermal management. Asynchronous cooling control with proportional, integral and derivative (PID)-tuned, per-site thermal control, which provides precise, efficient cooling to prevent overheating. A DUT heater option, which enhances the accuracy of automated temperature control (ATC) for more precise thermal testing.
お知らせ • Oct 01Teradyne, Inc. Unveils PHY Performance Testing CapabilitiesTeradyne, Inc. announced the release of Teradyne UltraPHY224G for UltraFLEXplus, a breakthrough in high-speed PHY performance testing that extends its portfolio beyond the UltraPHY 112G instrument already in production and adopted by a number of customers. Both solutions are designed for the UltraFLEXplus, and leverage Teradyne's IG-XL software for ease of adoption. Teradyne UltraPHY 224G for UltraFLEX plus is a breakthrough in high-speedPHY performance testing to address emerging data rates in the data center and silicon photonics (SiPh) markets. Developed by Teradyne with Multilane modules, UltraPHY 224G delivers bench-quality signal generation and measurement for production testing, setting a new benchmark for test density and the signal fidelity required by next-generation semiconductor interfaces. Customers can be confident that their UltraPHY investments support both today's and tomorrow's chiplet-based architectures, advanced packaging, and KGD workflows. UltraPHY 224G, developed by Teradyne with MultILane modules, delivers bench-quality signal generation, and measurement for production testing. Designed to meet strict hardware and software standards, it sets a new benchmark for testdensity and the signal fidelity required by Next-generation semiconductor interfaces. While UltraPHY 112G is optimized for today's high-speed standards, UltraPHY 224G extends the performance envelope to address emerging data rates in The data center and silicon photonics markets. Both instruments are designed to co-exist in the same UltraFLEXplus platform, giving customers maximum flexibility to test the broadest range of current and future high-speed interfaces. UltraPHY 224G provides 8 full-duplex differential lanes plus 8 Rx-only differential lanes per instrument, supporting data rates up to 112 Gb/s NRZ and 224 Gb/s (112 Gbaud PAM4) using a DSO + BERT architecture. Like Teradyne's UltraPHY 112G, the UltraPHY 224G is extremely scalable, with support for multiple instruments per UltraFLEXplus platform and the flexibility to extend to emerging advanced modulation formats as the industry evolves. Key benefits include: Single tester platform for all PHY testing needs - both the UltraPHY 224G and the UltraPHY 112G are designed for Teradyne UltraFLEXplus. Integrated DSO, AWG, and BERT capabilities for comprehensive PHY production testing and characterization. >50GHz signal delivery bandwidth with proven reliability in production environments. Extensible architecture to support current and future electrical interface standards for SiPh and non-SiPh devices. As PHY interfaces continue to evolve, Teradyne UltraPHY is a future-proof solution deployed on a single test platform - Teradyne UltraFLE Xplus.
New Risk • Sep 22New major risk - Share price stabilityThe company's share price has been highly volatile over the past 3 months. It is more volatile than 90% of Italian stocks, typically moving 7.3% a week. This is considered a major risk. Share price volatility increases the risk of potential losses in the short-term as the stock tends to have larger drops in price more frequently than other stocks. It may also indicate the stock is highly sensitive to market conditions or economic conditions rather than being sensitive to its own business performance, which may also be inconsistent. This is currently the only risk that has been identified for the company.
Valuation Update With 7 Day Price Move • Sep 22Investor sentiment improves as stock rises 15%After last week's 15% share price gain to €111, the stock trades at a forward P/E ratio of 33x. Average forward P/E is 20x in the Semiconductor industry in Europe. Simply Wall St's valuation model estimates the intrinsic value at €91.84 per share.
Buy Or Sell Opportunity • Sep 19Now 20% overvalued after recent price riseOver the last 90 days, the stock has risen 35% to €100. The fair value is estimated to be €83.58, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period.
お知らせ • Sep 03Teradyne, Inc. Announces Change of Group President of the Teradyne Robotics GroupTeradyne, Inc. named Jean-Pierre ‘JP’ Hathout as Group President of the Teradyne Robotics Group, succeeding Ujjwal Kumar. Hathout was appointed President of Universal Robots in May and was previously President of Mobile Industrial Robotics (MiR) for two years. Hathout brings over two decades of international management experience, including 17 years at Bosch, and most recently led MiR to strengthen its product portfolio and global position. He will continue to lead Universal Robots in his new position.
お知らせ • Aug 26Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on September 29, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on September 29, 2025, to shareholders of record as of the close of business on September 5, 2025.
Buy Or Sell Opportunity • Aug 25Now 21% overvalued after recent price riseOver the last 90 days, the stock has risen 39% to €99.81. The fair value is estimated to be €82.66, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 6.2% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 12% per annum. Earnings are also forecast to grow by 22% per annum over the same time period.
お知らせ • Aug 05Teradyne, Inc. Unveils Magnum 7H - the Next-Generation Memory Tester for High Bandwidth Memory DevicesTeradyne, Inc. announced the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices, integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale. Volume shipments and HBM device production on Teradyne's Magnum 7H have started ramping at the largest HBM manufacturers in the industry. The Magnum 7H is a cutting-edge memory tester that supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It offers comprehensive test coverage, from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Additionally, the Magnum 7H supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with traditional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality. The Teradyne Magnum 7H delivers: Enhanced Device Quality: Superior DPS response time delivers higher device yield. Comprehensive Memory and Logic Testing:Magnum 7H is ideally suited for testing HBM stacks that contain both logic base dies and DRAM dies. It delivers high-speed memory testing with a flexible algorithmic pattern generator (APG) and logic testing with Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures high-speed error capture for both memory and logic testing. High Performance: High-speed testing of current HBM3/3E and next-generation HBM4/4E devices up to 4.5Gbps. High Parallelism: Essential for lowering overall cost-of-test for HBM, the Magnum 7H is configurable for up to 9,216 digital pins and 2,560 power pins, enabling superior touchdown efficiency at probe and resulting in 1.6x increased throughput in mass production environments. The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne's Magnum 7 HBM is a next-generation memory testers engineered to test both and tomorrow's HBM devices with high parallelism, speed, and accuracy, across the entire manufacturing process.
Board Change • Aug 01High number of new directorsThere are 5 new directors who have joined the board in the last 3 years. Independent Director Necip Sayiner was the last director to join the board, commencing their role in 2025. The company’s lack of board continuity is considered a risk according to the Simply Wall St Risk Model.
Reported Earnings • Jul 30Second quarter 2025 earnings released: EPS: US$0.49 (vs US$1.18 in 2Q 2024)Second quarter 2025 results: EPS: US$0.49 (down from US$1.18 in 2Q 2024). Revenue: US$651.8m (down 11% from 2Q 2024). Net income: US$78.4m (down 58% from 2Q 2024). Profit margin: 12% (down from 26% in 2Q 2024). The decrease in margin was primarily driven by lower revenue. Revenue is forecast to grow 12% p.a. on average during the next 3 years, compared to a 8.4% growth forecast for the Semiconductor industry in Europe.
お知らせ • Jul 30Teradyne, Inc. Provides Earnings Guidance for the Third Quarter of 2025Teradyne, Inc. provided earnings guidance for the third quarter of 2025. For the period, the company expects revenue of $710 million to $770 million, with GAAP net income of $0.62 to $0.80 per diluted share.
お知らせ • Jul 15Teradyne, Inc. to Report Q2, 2025 Results on Jul 29, 2025Teradyne, Inc. announced that they will report Q2, 2025 results at 5:00 PM, US Eastern Standard Time on Jul 29, 2025
お知らせ • Jun 30+ 4 more updatesTeradyne, Inc.(NasdaqGS:TER) dropped from Russell 1000 Growth-Defensive IndexTeradyne, Inc.(NasdaqGS:TER) dropped from Russell 1000 Growth-Defensive Index
お知らせ • Jun 27Teradyne, Inc. Announces Election of Two New Independent DirectorsTeradyne, Inc. announced the election of two new independent directors to its Board of Directors. Drew Henry, Executive Vice President of Strategy & Ecosystem at Arm Holdings, and Dr. Necip Sayiner, former President and CEO of Intersil Corporation, will join the Teradyne Board effective July 1, 2025. Mr. Henry was appointed to the Board's Compensation Committee and Nominating and Corporate Governance Committee, and Dr. Sayiner was appointed to the Board’s Audit Committee. Drew Henry brings more than 30 years of deep industry experience across the semiconductor, computing, and technology sectors, with a focus on strategic growth, platform development, and operational execution. Prior to joining Arm, Mr. Henry served as the CEO of Acetti Software and held senior roles at SanDisk and Nvidia. He holds a Master of Science in Electrical Engineering from the University of Southern California and a BS in Engineering Physics from the University of the Pacific. Dr. Necip Sayiner has over 25 years of leadership experience in the semiconductor industry. He served as President and CEO of Intersil Corporation and later joined Renesas as Executive Vice President and General Manager. Prior to Intersil, he was President and CEO of Silicon Laboratories and held senior executive positions at Agere Systems. Dr. Sayiner holds a Ph.D. in Electrical Engineering from the University of Pennsylvania, an MS in Engineering from Southern Illinois University, and dual BS degrees in Electrical and Electronics Engineering and Physics from Bosphorus University in Turkey.
お知らせ • May 09Teradyne, Inc. Declares Quarterly Cash Dividend, Payable on June 13, 2025Teradyne, Inc. announced a quarterly cash dividend of $0.12 per share, payable on June 13, 2025, to shareholders of record as of the close of business on May 22, 2025.
Reported Earnings • May 06First quarter 2025 earnings released: EPS: US$0.61 (vs US$0.42 in 1Q 2024)First quarter 2025 results: EPS: US$0.61 (up from US$0.42 in 1Q 2024). Revenue: US$685.7m (up 14% from 1Q 2024). Net income: US$98.9m (up 54% from 1Q 2024). Profit margin: 14% (up from 11% in 1Q 2024). The increase in margin was driven by higher revenue. Revenue is forecast to grow 11% p.a. on average during the next 3 years, compared to a 9.4% growth forecast for the Semiconductor industry in Europe.
