View Financial HealthSUSS MicroTec 配当と自社株買い配当金 基準チェック /06SUSS MicroTec配当を支払う会社であり、現在の利回りは0.32%です。主要情報0.3%配当利回りn/aバイバック利回り総株主利回りn/a将来の配当利回り0.7%配当成長11.1%次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向16%最近の配当と自社株買いの更新Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.すべての更新を表示Recent updatesDeclared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.お知らせ • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.お知らせ • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.お知らせ • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.お知らせ • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.お知らせ • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.お知らせ • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025お知らせ • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025Valuation Update With 7 Day Price Move • Feb 27Investor sentiment improves as stock rises 30%After last week's 30% share price gain to €40.90, the stock trades at a forward P/E ratio of 20x. Average trailing P/E is 23x in the Semiconductor industry in Europe. Total returns to shareholders of 85% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €36.58 per share.お知らせ • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.決済の安定と成長配当データの取得安定した配当: SMHNDはUK市場で注目すべき配当金を支払っていないため、支払いが安定しているかどうかを確認する必要はありません。増加する配当: SMHNDはUK市場で注目すべき配当金を支払っていないため、支払額が増加しているかどうかを確認する必要はありません。配当利回り対市場SUSS MicroTec 配当利回り対市場SMHND 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (SMHND)0.3%市場下位25% (GB)2.1%市場トップ25% (GB)5.6%業界平均 (Semiconductor)0.5%アナリスト予想 (SMHND) (最長3年)0.7%注目すべき配当: SMHNDの配当金 ( 0.32% ) はUK市場の配当金支払者の下位 25% ( 2.14% ) と比べると目立ったものではありません。高配当: SMHNDの配当金 ( 0.32% ) はUK市場の配当金支払者の上位 25% ( 5.57% ) と比較すると低いです。株主への利益配当収益カバレッジ: SMHND UK市場において目立った配当金を支払っていません。株主配当金キャッシュフローカバレッジ: SMHNDは配当金を支払っていますが、同社にはフリーキャッシュフローがありません。高配当企業の発掘7D1Y7D1Y7D1YGB 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/06/30 15:28終値2026/05/20 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社の Github ページ でご覧いただけます。また、レポートの使い方に関する ガイド や YouTube の チュートリアル もご用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋SUSS MicroTec SE 8 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。17 アナリスト機関Guenther HollfelderBaader Helvea Equity ResearchNicole WinklerBerenbergTammy QiuBerenberg14 その他のアナリストを表示
Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.
お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.
お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.
お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.
Declared Dividend • May 20Dividend of €0.04 announcedShareholders will receive a dividend of €0.04. Ex-date: 4th June 2026 Payment date: 8th June 2026 Dividend yield will be 0.05%, which is lower than the industry average of 1.2%.
お知らせ • Apr 22SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026SUSS MicroTec SE, Annual General Meeting, Jun 03, 2026, at 10:00 W. Europe Standard Time.
お知らせ • Apr 01+ 1 more updateSUSS MicroTec SE to Report Q3, 2026 Results on Nov 05, 2026SUSS MicroTec SE announced that they will report Q3, 2026 results on Nov 05, 2026
お知らせ • Mar 31SUSS MicroTec SE announces Annual dividend, payable on June 08, 2026SUSS MicroTec SE announced Annual dividend of EUR 0.0400 per share payable on June 08, 2026, ex-date on June 04, 2026 and record date on June 05, 2026.
お知らせ • Jan 05+ 1 more updateSUSS MicroTec SE to Report Fiscal Year 2025 Results on Mar 30, 2026SUSS MicroTec SE announced that they will report fiscal year 2025 results on Mar 30, 2026
お知らせ • Jun 05Annual General Meeting Approves Dividend for the 2024 Financial YearSUSS MicroTec SE resolved to distribute a dividend of €0.30 per share for the 2024 financial year, a 50% increase compared to the previous year, which corresponds to a total dividend payout of €5.7 million.
お知らせ • May 27Suss MicroTec SE Introduces the XBC300 Gen2 D2W PlatformSUSS MicroTec SE introduced the XBC300 Gen2 D2W platform - a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements. The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips due to footprint savings of up to 40% and a post-bond accuracy of < +-200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions. D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications. The XBC300 Gen2 D 2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.
お知らせ • Apr 19SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025SÜSS MicroTec SE, Annual General Meeting, Jun 03, 2025, at 10:00 W. Europe Standard Time.
お知らせ • Mar 28SÜSS MicroTec SE announces Annual dividend, payable on June 06, 2025SÜSS MicroTec SE announced Annual dividend of EUR 0.3000 per share payable on June 06, 2025, ex-date on June 04, 2025 and record date on June 05, 2025.
お知らせ • Jan 19+ 2 more updatesSÜSS MicroTec SE to Report First Half, 2025 Results on Aug 07, 2025SÜSS MicroTec SE announced that they will report first half, 2025 results on Aug 07, 2025
お知らせ • Jan 03SÜSS MicroTec SE to Report Fiscal Year 2024 Results on Mar 27, 2025SÜSS MicroTec SE announced that they will report fiscal year 2024 results on Mar 27, 2025
Valuation Update With 7 Day Price Move • Feb 27Investor sentiment improves as stock rises 30%After last week's 30% share price gain to €40.90, the stock trades at a forward P/E ratio of 20x. Average trailing P/E is 23x in the Semiconductor industry in Europe. Total returns to shareholders of 85% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €36.58 per share.
お知らせ • Jan 06SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024SÜSS MicroTec SE, Annual General Meeting, Jun 11, 2024.