View Financial HealthMicron Technology 配当と自社株買い配当金 基準チェック /06Micron Technology配当を支払う会社であり、現在の利回りは0.079%です。主要情報0.08%配当利回り0.1%バイバック利回り総株主利回り0.2%将来の配当利回り0.08%配当成長17.3%次回配当支払日n/a配当落ち日n/a一株当たり配当金n/a配当性向2%最近の配当と自社株買いの更新お知らせ • Dec 19Micron Technology, Inc. announces Quarterly dividend, payable on January 14, 2026Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on January 14, 2026, ex-date on December 29, 2025 and record date on December 29, 2025.すべての更新を表示Recent updatesお知らせ • May 14Micron Technology, Inc. Samples 256GB DDR5 Server ModuleMicron Technology, Inc. announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company’s 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production. Micron’s module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron’s 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256GB module can reduce operating power by more than 40% versus two 128GB modules, enabling greater efficiency for modern AI data centers. Micron is collaborating with key ecosystem enablers to validate the 256GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale. The rapid proliferation of large language models (LLMs), agentic AI, real-time inference and high-core-count CPU workloads is driving an urgent need for greater enterprise server memory capacity, higher bandwidth and improved power efficiency. Micron’s 256GB DDR5 RDIMM addresses these growing requirements head-on, enabling server architects, hyperscale operators and platform partners to maximize memory capacity per socket while operating within the thermal and power boundaries of modern data center infrastructure. Micron’s 1 gamma-based 256GB DDR5 RDIMM is currently sampling to key server ecosystem enablers for platform validation.お知らせ • Mar 19+ 1 more updateMicron Technology, Inc. Provides Earning Guidance for the Third Quarter of 2026Micron Technology, Inc. provided earning guidance for the third quarter of 2026. For the quarter, the company expects revenue of $33.5 billion ± $750 million and diluted earnings per share of $18.90 ± $0.40.お知らせ • Mar 03Micron Technology, Inc. Sets New Benchmark with the World's First High-Capacity 256Gb LPDRAM SOCAMM2 for Data Center InfrastructureMicron Technology, Inc. extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry's first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint. Across these workloads, memory capacity, bandwidth efficiency, latency and power efficiency have become primary system level constraints, directly influencing performance, scalability and total cost of ownership. LPDRAM’s unique combination of these attributes position it as a cornerstone solution for both AI and core compute servers in increasingly power and thermally constrained data center environments. Micron is collaborating with NVIDIA to co-design sophisticated memory for the needs of advanced AI infrastructure. Micron’s 256GB SOCAMM2 delivers higher memory capacity, substantially lower power consumption and faster performance for a variety of AI and general-purpose computing workloads. With one-third more capacity than the prior highest capacity 192GB SOCAMM2, 256GB SOCAMM2 provides 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads. SOCAMM2 consumes one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint, improving rack density and reducing the total cost of ownership. In unified memory architectures, 256GB SOCAMM2 improves time to first token by more than 2.3 times for long context, real-time LLM inference when used for KV cache offload compared to currently available solutions. In standalone CPU applications, LPDRAM delivers more than 3 times better performance per watt than mainstream memory modules for high-performance computing workloads. The modular SOCAMM2 design improves serviceability, supports liquid-cooled server architectures and enables future capacity expansion as AI and core compute memory requirements continue to grow. Micron continues to play a leading role in the JEDEC SOCAMM2 specification definition and maintains deep technical collaborations with system designers to drive industry-wide improvements in power efficiency and performance for next-generation data center platforms. Micron is now shipping customer samples of its 256GB SOCAMM2 and offers the industry’s broadest data center LPDRAM portfolio, spanning 8GB to 64GB components and 48GB to 256GB SOCAMM2 modules. One-third of the power consumption calculated based on watts of power used by one 128GB, 128-bit bus width SOCAMM2 module compared to two 64GB, 64-bit bus width DDR5 RDIMMs. One-third footprint calculation compares SOCAMM2 area (14x90mm) versus a standard server RDIMM. Results are based on Micron internal testing of real-time inference with Llama3 70B model (with FP16 quantization) using 500K context length and 16 concurrent users. The projected TTFT latency improvement is based on a latency of 0.12s for 2TB LPDRAM per CPU vs. 0.28s for 1.5TB LPDRAM per CPU. Micron internal testing measuring Pot3D solar physics HPC code performance on identical capacities of LPDDR5X and DDR5.お知らせ • Feb 25Micron Technology, Inc. to Report Q2, 2026 Results on Mar 18, 2026Micron Technology, Inc. announced that they will report Q2, 2026 results on Mar 18, 2026お知らせ • Dec 19Micron Technology, Inc. announces Quarterly dividend, payable on January 14, 2026Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on January 14, 2026, ex-date on December 29, 2025 and record date on December 29, 2025.お知らせ • Dec 18Micron Technology, Inc. Provides Earnings Guidance for the Second Quarter of 2026Micron Technology, Inc. provided earnings guidance for the second quarter of 2026. For the quarter, the company expects revenue of $18.70 billion ± $400 million and Diluted earnings per share of $8.19 ± $0.20.決済の安定と成長配当データの取得安定した配当: MTE1はGerman市場で注目すべき配当金を支払っていないため、支払いが安定しているかどうかを確認する必要はありません。増加する配当: MTE1はGerman市場で注目すべき配当金を支払っていないため、支払額が増加しているかどうかを確認する必要はありません。配当利回り対市場Micron Technology 配当利回り対市場MTE1 配当利回りは市場と比べてどうか？セグメント配当利回り会社 (MTE1)0.08%市場下位25% (DE)1.5%市場トップ25% (DE)4.5%業界平均 (Semiconductor)0.5%アナリスト予想 (MTE1) (最長3年)0.08%注目すべき配当: MTE1の配当金 ( 0.079% ) はGerman市場の配当金支払者の下位 25% ( 1.51% ) と比べると目立ったものではありません。高配当: MTE1の配当金 ( 0.079% ) はGerman市場の配当金支払者の上位 25% ( 4.51% ) と比較すると低いです。株主への利益配当収益カバレッジ: MTE1 German市場において目立った配当金を支払っていません。株主配当金キャッシュフローカバレッジ: MTE1 German市場において目立った配当金を支払っていません。高配当企業の発掘7D1Y7D1Y7D1YDE 市場の強力な配当支払い企業。View Management企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/21 09:48終値2026/05/21 00:00収益2026/02/26年間収益2025/08/28データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Micron Technology, Inc. 39 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。72 アナリスト機関Warren LauAletheia Analyst Network LimitedBrett SimpsonArete Research Services LLPJames FontanelliArete Research Services LLP69 その他のアナリストを表示
お知らせ • Dec 19Micron Technology, Inc. announces Quarterly dividend, payable on January 14, 2026Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on January 14, 2026, ex-date on December 29, 2025 and record date on December 29, 2025.
お知らせ • May 14Micron Technology, Inc. Samples 256GB DDR5 Server ModuleMicron Technology, Inc. announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company’s 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production. Micron’s module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron’s 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256GB module can reduce operating power by more than 40% versus two 128GB modules, enabling greater efficiency for modern AI data centers. Micron is collaborating with key ecosystem enablers to validate the 256GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale. The rapid proliferation of large language models (LLMs), agentic AI, real-time inference and high-core-count CPU workloads is driving an urgent need for greater enterprise server memory capacity, higher bandwidth and improved power efficiency. Micron’s 256GB DDR5 RDIMM addresses these growing requirements head-on, enabling server architects, hyperscale operators and platform partners to maximize memory capacity per socket while operating within the thermal and power boundaries of modern data center infrastructure. Micron’s 1 gamma-based 256GB DDR5 RDIMM is currently sampling to key server ecosystem enablers for platform validation.
お知らせ • Mar 19+ 1 more updateMicron Technology, Inc. Provides Earning Guidance for the Third Quarter of 2026Micron Technology, Inc. provided earning guidance for the third quarter of 2026. For the quarter, the company expects revenue of $33.5 billion ± $750 million and diluted earnings per share of $18.90 ± $0.40.
お知らせ • Mar 03Micron Technology, Inc. Sets New Benchmark with the World's First High-Capacity 256Gb LPDRAM SOCAMM2 for Data Center InfrastructureMicron Technology, Inc. extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry's first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint. Across these workloads, memory capacity, bandwidth efficiency, latency and power efficiency have become primary system level constraints, directly influencing performance, scalability and total cost of ownership. LPDRAM’s unique combination of these attributes position it as a cornerstone solution for both AI and core compute servers in increasingly power and thermally constrained data center environments. Micron is collaborating with NVIDIA to co-design sophisticated memory for the needs of advanced AI infrastructure. Micron’s 256GB SOCAMM2 delivers higher memory capacity, substantially lower power consumption and faster performance for a variety of AI and general-purpose computing workloads. With one-third more capacity than the prior highest capacity 192GB SOCAMM2, 256GB SOCAMM2 provides 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads. SOCAMM2 consumes one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint, improving rack density and reducing the total cost of ownership. In unified memory architectures, 256GB SOCAMM2 improves time to first token by more than 2.3 times for long context, real-time LLM inference when used for KV cache offload compared to currently available solutions. In standalone CPU applications, LPDRAM delivers more than 3 times better performance per watt than mainstream memory modules for high-performance computing workloads. The modular SOCAMM2 design improves serviceability, supports liquid-cooled server architectures and enables future capacity expansion as AI and core compute memory requirements continue to grow. Micron continues to play a leading role in the JEDEC SOCAMM2 specification definition and maintains deep technical collaborations with system designers to drive industry-wide improvements in power efficiency and performance for next-generation data center platforms. Micron is now shipping customer samples of its 256GB SOCAMM2 and offers the industry’s broadest data center LPDRAM portfolio, spanning 8GB to 64GB components and 48GB to 256GB SOCAMM2 modules. One-third of the power consumption calculated based on watts of power used by one 128GB, 128-bit bus width SOCAMM2 module compared to two 64GB, 64-bit bus width DDR5 RDIMMs. One-third footprint calculation compares SOCAMM2 area (14x90mm) versus a standard server RDIMM. Results are based on Micron internal testing of real-time inference with Llama3 70B model (with FP16 quantization) using 500K context length and 16 concurrent users. The projected TTFT latency improvement is based on a latency of 0.12s for 2TB LPDRAM per CPU vs. 0.28s for 1.5TB LPDRAM per CPU. Micron internal testing measuring Pot3D solar physics HPC code performance on identical capacities of LPDDR5X and DDR5.
お知らせ • Feb 25Micron Technology, Inc. to Report Q2, 2026 Results on Mar 18, 2026Micron Technology, Inc. announced that they will report Q2, 2026 results on Mar 18, 2026
お知らせ • Dec 19Micron Technology, Inc. announces Quarterly dividend, payable on January 14, 2026Micron Technology, Inc. announced Quarterly dividend of USD 0.1150 per share payable on January 14, 2026, ex-date on December 29, 2025 and record date on December 29, 2025.
お知らせ • Dec 18Micron Technology, Inc. Provides Earnings Guidance for the Second Quarter of 2026Micron Technology, Inc. provided earnings guidance for the second quarter of 2026. For the quarter, the company expects revenue of $18.70 billion ± $400 million and Diluted earnings per share of $8.19 ± $0.20.