View ValuationIntel 将来の成長Future 基準チェック /46Intel利益と収益がそれぞれ年間44.7%と9.9%増加すると予測されています。EPS は年間 増加すると予想されています。自己資本利益率は 3 年後に7% 44.3%なると予測されています。主要情報44.7%収益成長率44.27%EPS成長率Semiconductor 収益成長30.4%収益成長率9.9%将来の株主資本利益率7.03%アナリストカバレッジGood最終更新日18 May 2026今後の成長に関する最新情報お知らせ • Apr 25Intel Corporation Provides Earnings Guidance for the Second-Quarter of 2026Intel Corporation provided earnings guidance for the second-quarter of 2026. For the quarter, the company forecasting revenue of $13.8 billion to $14.8 billion; Earnings (Loss) Per Share Attributable to Intel—Diluted is expected to be $0.08.お知らせ • Jan 23Intel Corporation Provides Earnings Guidance for the First Quarter 2026Intel Corporation provides earnings guidance for the first quarter 2026. For the period, the company forecasting revenue of $11.7 billion to $12.7 billion; expecting EPS attributable to company of negative $0.21.すべての更新を表示Recent updatesお知らせ • May 11MINISFORUM And Intel Unveil New Agent NAS ProductsMINISFORUM and Intel officially hosted a joint launch event in Xiamen under the theme "Igniting Intelligent Agents, Opening a New Chapter for the Edge". MINISFORUM introduced two new Agent NAS based on Intel Core Ultra Series 3 and Intel Core Series 3 Processors: the All-Flash S5 and 7-bay All-Flash S7. The All-Flash S5 is designed to redefine what an Agent NAS can be. It comes with five M.2 2280 PCIe 4.0 x1 SSD slots, delivering an all-flash architecture without the noise, or lower idle power associated with SDD-based systems. The S5 aims to attract audiences asking for an absolutely silent, beautifully designed NAS. Built to unlock the full potential of SSD storage in a compact and sleek chassis, the S5 offers 1x 10GbE RJ45, 1x 2.5GbE RJ45, 2x USB4 40Gbps, 2x USB 3.2 Type-A, 1x HDMI 2.1, and AC power input. MinisOpenClaw is an AI agent developed by MINISFORUM, enabled with one-click installation to deliver AI assistance. It has intelligent features such as AI semantic photo search, allowing users to, "Find photos of me at the beach." Its fanless design and all-SSD structure are central to the product concept, creating a truly silent experience ideal for home theaters, and other noise-sensitive environments. Users can enjoy the benefits of local AI computing across work, entertainment and rest scenarios, with a silent NAS placed beside the bed that delivers a completely noise-free environment when sleeping. Also debuting at the event is a new Agent NAS configuration built on the MINISFORUM MS-03 workstation platform, as a 7-bay all-flash NAS for local AI computing and high-performance storage workloads. It brings powerful storage expansion and high-speed connectivity. It supports up to 7 NVMe SSDs for all-flash, high-performance storage. On the networking side, it offers a highly flexible and enterprise-ready configuration, including dual 10G SFP+ fiber ports, one 10G RJ45 port, one 2.5G RJ45 port, and 2 USB4 40Gbps enabling fast data transfer, low-latency access, across a wide range of audiences, including homelabs and geeks. S7 also features a LED status display, allowing users to check information such as system status, storage activity at a glance.お知らせ • May 06Intel Corporation Announces Executive AppointmentsIntel Corporation announced Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intel’s client computing business with emerging physical AI systems that span robotics, autonomous machines, and other AI devices. Katouzian joins Intel from Qualcomm Technologies where he most recently served as executive vice president and group general manager of mobile, compute, and extended reality (XR). He is widely recognized for his technical vision and consistent track record of execution at scale. Katouzian will join Intel in May. Intel also announced that Pushkar Ranade has been appointed chief technology officer, transitioning from the interim role. As CTO, Ranade will advance the company’s technology strategy, lead special technology projects, and drive the development of critical emerging areas, including quantum computing, neuromorphic computing, photonics, and novel materials. Ranade will continue to serve as chief of staff to the CEO, ensuring strong alignment between Intel’s technology strategy and business priorities. Both Katouzian and Ranade will report directly to CEO Lip-Bu Tan.お知らせ • Apr 25Intel Corporation Provides Earnings Guidance for the Second-Quarter of 2026Intel Corporation provided earnings guidance for the second-quarter of 2026. For the quarter, the company forecasting revenue of $13.8 billion to $14.8 billion; Earnings (Loss) Per Share Attributable to Intel—Diluted is expected to be $0.08.お知らせ • Apr 09+ 1 more updateUltra Accelerator Link Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G PerformanceUltra Accelerator Link Consortium, the industry standards organization developing the open scale-up interconnect for next-generation AI workloads, announced the ratification of the next UALink Specification, which encompasses three major additions – In-Network Compute, Chiplet Definition, and Manageability. The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology efficiency, performance for AI workloads and ease of implementation. The UALink Consortium provides a standardized foundation for accelerator connectivity at scale, helping drive innovation, increase deployment flexibility and support the rapidly growing performance demands of next-generation AI workloads. The new specification update is facilitated through UALink Consortium’s open governance model, which fosters innovation while enabling a robust, multi-vendor supply chain, providing system designers and cloud providers with the necessary flexibility to deploy interoperable solutions without vendor lock-in. New UALink Specifications: UALink Common Specification 2.0 introduces In-Network Compute for UALink technology, facilitating computation and communication between accelerators. Reduces latency, saves bandwidth, and improves scaling efficiency for distributed training and inference for AI solutions for complex and multi-workload environments for UALink systems. UALink 200G Data Link and Physical Layers (DL/PL) Specification 2.0 split the DL/PL Specification from the UALink Common Specification to enable UALink to move quickly as new physical layers and speeds are needed by the industry without requiring changes to the other specifications. UALink Manageability Specification 1.0 introduces UALink as a system with centralized control and management planes. Utilizes standardized protocols, modeling and APIs like gNMI, Yang, SAI and Redfish. UALink Chiplet Specification 1.0 defines the necessary information to integrate UALink technology into chiplet-based SoCs, including interfaces, form factors, flow control and chiplet management standardization. Fully compliant with the UCIe 3.0 Specification for simplified integration into existing chiplet ecosystems. All of the UALink specifications are available for public download.お知らせ • Apr 03+ 1 more updateIntel Corporation Appoints Aparna Bawa as Executive Vice President and Chief Legal & People Officer, Effective May 2026Intel Corporation announced the appointment of Aparna Bawa as Executive Vice President and Chief Legal & People Officer. Bawa will report directly to CEO Lip-Bu Tan and will lead Intel’s global legal, ethics, compliance, people, and culture organizations. Bawa joins Intel from Zoom, where she served as chief operating officer, overseeing critical operational, legal, and people functions during a period of rapid growth and global scale. She is widely recognized for her ability to align culture, governance, and execution in high-growth technology environments. Prior to Zoom, Bawa held senior legal and leadership roles in the technology industry, building deep expertise across corporate governance, global compliance, employment, M&A, and organizational transformation. Bawa will join Intel in May 2026.お知らせ • Apr 01Intel Corporation to Report Q1, 2026 Results on Apr 23, 2026Intel Corporation announced that they will report Q1, 2026 results After-Market on Apr 23, 2026お知らせ • Mar 12Intel Corporation, Annual General Meeting, May 13, 2026Intel Corporation, Annual General Meeting, May 13, 2026.お知らせ • Mar 04Intel Corporation Announces Retirement of Frank D. Yeary as Board Chair on May 13, 2026Intel Corporation announced that its board of directors had elected Dr. Craig H. Barratt as independent chair, effective following the company’s Annual Stockholders’ Meeting on May 13, 2026. Barratt succeeded Frank D. Yeary, who retired from the board and did not stand for reelection at the Annual Meeting. Yeary served as a director since 2009 and as chair since 2023.お知らせ • Feb 05Intel Corporation Appoints Eric Demers as Chief GPU ArchitectIntel Corporation announced that the appointment of Eric Demers, a formidable former Qualcomm executive, as Chief GPU Architect. Demers officially transitioned to Intel last month, reporting directly to Kevork Kechichian, the head of Data Center silicon.お知らせ • Jan 23Intel Corporation Provides Earnings Guidance for the First Quarter 2026Intel Corporation provides earnings guidance for the first quarter 2026. For the period, the company forecasting revenue of $11.7 billion to $12.7 billion; expecting EPS attributable to company of negative $0.21.お知らせ • Jan 08Intel Corporation to Report Q4, 2025 Results on Jan 22, 2026Intel Corporation announced that they will report Q4, 2025 results After-Market on Jan 22, 2026お知らせ • Jan 06Intel Unveils Intel Core Ultra Series 3 ProcessorsIntel unveiled Intel®? Core™? Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States. Powering over 200 PC designs: Series 3 includes a robust family of mobile processors, delivering exceptional performance, graphics and battery life. From PC to Edge: For the first time, Series 3 processors are tested and certified for embedded and industrial use cases at the edge like robotics, smart cities, automation, healthcare and more. Leveraging the same foundational architecture of Intel Core Ultra Series 3, the Intel Core lineup enables more performant and efficient laptop designs at lower price points. For the first time, alongside their PC counterparts, Series 3 edge processors are certified for embedded and industrial use case, including extended temperature ranges, deterministic performance, and 24x7 reliability. Intel Core Ultra Series 3 delivers competitive advantages in critical edge AI workloads with up to 1.9x higher large language model (LLM) performance4, up to 2.3x better performance per watt per dollar on end-to-end video analytics, and up to 4.5x higher throughput on vision language action (VLA) models6. The integrated AI acceleration enables superior total cost of ownership (TCO) through a single system on chip (SoC) solution versus traditional multi-chip CPU and GPU architectures. Pre-orders for the first consumer laptops powered by Intel Core Ultra Series 3 processors will begin Jan. 6, 2026. Systems will be available globally starting Jan. 27, 2026, with additional designs coming throughout the first half of the year. Edge systems powered by Intel Core Ultra series 3 will be available starting Second Quarter 2026.業績と収益の成長予測DB:INL1 - アナリストの将来予測と過去の財務データ ( )USD Millions日付収益収益フリー・キャッシュフロー営業活動によるキャッシュ平均アナリスト数12/31/202871,4367,3733,67922,9452112/31/202765,0865,1682,41119,8343912/31/202658,648-1,720-59014,770393/28/202653,763-3,174-3,1199,980N/A12/27/202552,853-267-4,9499,697N/A9/27/202553,439198-8,4188,574N/A6/28/202553,070-20,504-10,94310,082N/A3/29/202553,044-19,196-12,83310,324N/A12/28/202453,101-18,756-15,6568,288N/A9/28/202454,247-15,961-15,0599,747N/A6/29/202455,121975-12,58411,517N/A3/30/202455,2374,066-12,27412,033N/A12/30/202354,2281,689-14,27911,471N/A9/30/202352,864-1,644-10,40914,550N/A7/1/202354,044-922-16,7499,756N/A4/1/202356,416-2,857-20,1027,757N/A12/31/202263,0548,014-9,41115,433N/A10/1/202269,54013,301-13,64413,133N/A7/2/202273,39419,105-1,91222,007N/A4/2/202277,70424,6209,45429,999N/A12/25/202179,02419,8689,12729,456N/A9/25/202178,47421,10217,18533,943N/A6/26/202177,61518,55516,18532,218N/A3/27/202177,71218,59919,00134,574N/A12/26/202077,86720,89921,41135,864N/A9/26/202078,09821,94720,32435,382N/A6/27/202078,95523,66121,90037,914N/A3/28/202075,73222,73518,18434,344N/A12/28/201971,96521,048N/A33,145N/A9/28/201970,41319,338N/A30,157N/A6/29/201970,38619,746N/A28,281N/A3/30/201970,84320,573N/A28,107N/A12/29/201870,84821,053N/A29,432N/A9/29/201869,24415,171N/A29,773N/A6/30/201866,23013,289N/A27,202N/A3/31/201864,03111,091N/A24,496N/A12/30/201762,7619,601N/A22,110N/A9/30/201762,08213,850N/A23,019N/A7/1/201761,71112,712N/A22,513N/A4/1/201760,48111,234N/A21,651N/A12/31/201659,38710,316N/A21,808N/A10/1/201657,92710,367N/A19,085N/A7/2/201656,61410,098N/A19,062N/A4/2/201656,27611,474N/A18,657N/A12/26/201555,35511,420N/A19,018N/A9/26/201555,16211,468N/A19,361N/A6/27/201555,25111,676N/A19,319N/Aもっと見るアナリストによる今後の成長予測収入対貯蓄率: INL1は今後 3 年間で収益性が向上すると予測されており、これは 貯蓄率 ( 1.9% ) よりも高い成長率であると考えられます。収益対市場: INL1今後 3 年間で収益性が向上すると予想されており、これは市場平均を上回る成長と考えられます。高成長収益: INL1今後 3 年以内に収益を上げることが予想されます。収益対市場: INL1の収益 ( 9.9% ) German市場 ( 6.7% ) よりも速いペースで成長すると予測されています。高い収益成長: INL1の収益 ( 9.9% ) 20%よりも低い成長が予測されています。一株当たり利益成長率予想将来の株主資本利益率将来のROE: INL1の 自己資本利益率 は、3年後には低くなると予測されています ( 7 %)。成長企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の高成長企業。View Past Performance企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/05/20 02:04終値2026/05/20 00:00収益2026/03/28年間収益2025/12/27データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレーク本レポートを生成するために使用した分析モデルの詳細は当社のGithubページでご覧いただけます。また、レポートの使用方法に関するガイドやYoutubeのチュートリアルも掲載しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Intel Corporation 39 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。77 アナリスト機関Brett SimpsonArete Research Services LLPJames KelleherArgus Research CompanyCody AcreeAscendiant Capital Markets LLC74 その他のアナリストを表示
お知らせ • Apr 25Intel Corporation Provides Earnings Guidance for the Second-Quarter of 2026Intel Corporation provided earnings guidance for the second-quarter of 2026. For the quarter, the company forecasting revenue of $13.8 billion to $14.8 billion; Earnings (Loss) Per Share Attributable to Intel—Diluted is expected to be $0.08.
お知らせ • Jan 23Intel Corporation Provides Earnings Guidance for the First Quarter 2026Intel Corporation provides earnings guidance for the first quarter 2026. For the period, the company forecasting revenue of $11.7 billion to $12.7 billion; expecting EPS attributable to company of negative $0.21.
お知らせ • May 11MINISFORUM And Intel Unveil New Agent NAS ProductsMINISFORUM and Intel officially hosted a joint launch event in Xiamen under the theme "Igniting Intelligent Agents, Opening a New Chapter for the Edge". MINISFORUM introduced two new Agent NAS based on Intel Core Ultra Series 3 and Intel Core Series 3 Processors: the All-Flash S5 and 7-bay All-Flash S7. The All-Flash S5 is designed to redefine what an Agent NAS can be. It comes with five M.2 2280 PCIe 4.0 x1 SSD slots, delivering an all-flash architecture without the noise, or lower idle power associated with SDD-based systems. The S5 aims to attract audiences asking for an absolutely silent, beautifully designed NAS. Built to unlock the full potential of SSD storage in a compact and sleek chassis, the S5 offers 1x 10GbE RJ45, 1x 2.5GbE RJ45, 2x USB4 40Gbps, 2x USB 3.2 Type-A, 1x HDMI 2.1, and AC power input. MinisOpenClaw is an AI agent developed by MINISFORUM, enabled with one-click installation to deliver AI assistance. It has intelligent features such as AI semantic photo search, allowing users to, "Find photos of me at the beach." Its fanless design and all-SSD structure are central to the product concept, creating a truly silent experience ideal for home theaters, and other noise-sensitive environments. Users can enjoy the benefits of local AI computing across work, entertainment and rest scenarios, with a silent NAS placed beside the bed that delivers a completely noise-free environment when sleeping. Also debuting at the event is a new Agent NAS configuration built on the MINISFORUM MS-03 workstation platform, as a 7-bay all-flash NAS for local AI computing and high-performance storage workloads. It brings powerful storage expansion and high-speed connectivity. It supports up to 7 NVMe SSDs for all-flash, high-performance storage. On the networking side, it offers a highly flexible and enterprise-ready configuration, including dual 10G SFP+ fiber ports, one 10G RJ45 port, one 2.5G RJ45 port, and 2 USB4 40Gbps enabling fast data transfer, low-latency access, across a wide range of audiences, including homelabs and geeks. S7 also features a LED status display, allowing users to check information such as system status, storage activity at a glance.
お知らせ • May 06Intel Corporation Announces Executive AppointmentsIntel Corporation announced Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intel’s client computing business with emerging physical AI systems that span robotics, autonomous machines, and other AI devices. Katouzian joins Intel from Qualcomm Technologies where he most recently served as executive vice president and group general manager of mobile, compute, and extended reality (XR). He is widely recognized for his technical vision and consistent track record of execution at scale. Katouzian will join Intel in May. Intel also announced that Pushkar Ranade has been appointed chief technology officer, transitioning from the interim role. As CTO, Ranade will advance the company’s technology strategy, lead special technology projects, and drive the development of critical emerging areas, including quantum computing, neuromorphic computing, photonics, and novel materials. Ranade will continue to serve as chief of staff to the CEO, ensuring strong alignment between Intel’s technology strategy and business priorities. Both Katouzian and Ranade will report directly to CEO Lip-Bu Tan.
お知らせ • Apr 25Intel Corporation Provides Earnings Guidance for the Second-Quarter of 2026Intel Corporation provided earnings guidance for the second-quarter of 2026. For the quarter, the company forecasting revenue of $13.8 billion to $14.8 billion; Earnings (Loss) Per Share Attributable to Intel—Diluted is expected to be $0.08.
お知らせ • Apr 09+ 1 more updateUltra Accelerator Link Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G PerformanceUltra Accelerator Link Consortium, the industry standards organization developing the open scale-up interconnect for next-generation AI workloads, announced the ratification of the next UALink Specification, which encompasses three major additions – In-Network Compute, Chiplet Definition, and Manageability. The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology efficiency, performance for AI workloads and ease of implementation. The UALink Consortium provides a standardized foundation for accelerator connectivity at scale, helping drive innovation, increase deployment flexibility and support the rapidly growing performance demands of next-generation AI workloads. The new specification update is facilitated through UALink Consortium’s open governance model, which fosters innovation while enabling a robust, multi-vendor supply chain, providing system designers and cloud providers with the necessary flexibility to deploy interoperable solutions without vendor lock-in. New UALink Specifications: UALink Common Specification 2.0 introduces In-Network Compute for UALink technology, facilitating computation and communication between accelerators. Reduces latency, saves bandwidth, and improves scaling efficiency for distributed training and inference for AI solutions for complex and multi-workload environments for UALink systems. UALink 200G Data Link and Physical Layers (DL/PL) Specification 2.0 split the DL/PL Specification from the UALink Common Specification to enable UALink to move quickly as new physical layers and speeds are needed by the industry without requiring changes to the other specifications. UALink Manageability Specification 1.0 introduces UALink as a system with centralized control and management planes. Utilizes standardized protocols, modeling and APIs like gNMI, Yang, SAI and Redfish. UALink Chiplet Specification 1.0 defines the necessary information to integrate UALink technology into chiplet-based SoCs, including interfaces, form factors, flow control and chiplet management standardization. Fully compliant with the UCIe 3.0 Specification for simplified integration into existing chiplet ecosystems. All of the UALink specifications are available for public download.
お知らせ • Apr 03+ 1 more updateIntel Corporation Appoints Aparna Bawa as Executive Vice President and Chief Legal & People Officer, Effective May 2026Intel Corporation announced the appointment of Aparna Bawa as Executive Vice President and Chief Legal & People Officer. Bawa will report directly to CEO Lip-Bu Tan and will lead Intel’s global legal, ethics, compliance, people, and culture organizations. Bawa joins Intel from Zoom, where she served as chief operating officer, overseeing critical operational, legal, and people functions during a period of rapid growth and global scale. She is widely recognized for her ability to align culture, governance, and execution in high-growth technology environments. Prior to Zoom, Bawa held senior legal and leadership roles in the technology industry, building deep expertise across corporate governance, global compliance, employment, M&A, and organizational transformation. Bawa will join Intel in May 2026.
お知らせ • Apr 01Intel Corporation to Report Q1, 2026 Results on Apr 23, 2026Intel Corporation announced that they will report Q1, 2026 results After-Market on Apr 23, 2026
お知らせ • Mar 12Intel Corporation, Annual General Meeting, May 13, 2026Intel Corporation, Annual General Meeting, May 13, 2026.
お知らせ • Mar 04Intel Corporation Announces Retirement of Frank D. Yeary as Board Chair on May 13, 2026Intel Corporation announced that its board of directors had elected Dr. Craig H. Barratt as independent chair, effective following the company’s Annual Stockholders’ Meeting on May 13, 2026. Barratt succeeded Frank D. Yeary, who retired from the board and did not stand for reelection at the Annual Meeting. Yeary served as a director since 2009 and as chair since 2023.
お知らせ • Feb 05Intel Corporation Appoints Eric Demers as Chief GPU ArchitectIntel Corporation announced that the appointment of Eric Demers, a formidable former Qualcomm executive, as Chief GPU Architect. Demers officially transitioned to Intel last month, reporting directly to Kevork Kechichian, the head of Data Center silicon.
お知らせ • Jan 23Intel Corporation Provides Earnings Guidance for the First Quarter 2026Intel Corporation provides earnings guidance for the first quarter 2026. For the period, the company forecasting revenue of $11.7 billion to $12.7 billion; expecting EPS attributable to company of negative $0.21.
お知らせ • Jan 08Intel Corporation to Report Q4, 2025 Results on Jan 22, 2026Intel Corporation announced that they will report Q4, 2025 results After-Market on Jan 22, 2026
お知らせ • Jan 06Intel Unveils Intel Core Ultra Series 3 ProcessorsIntel unveiled Intel®? Core™? Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States. Powering over 200 PC designs: Series 3 includes a robust family of mobile processors, delivering exceptional performance, graphics and battery life. From PC to Edge: For the first time, Series 3 processors are tested and certified for embedded and industrial use cases at the edge like robotics, smart cities, automation, healthcare and more. Leveraging the same foundational architecture of Intel Core Ultra Series 3, the Intel Core lineup enables more performant and efficient laptop designs at lower price points. For the first time, alongside their PC counterparts, Series 3 edge processors are certified for embedded and industrial use case, including extended temperature ranges, deterministic performance, and 24x7 reliability. Intel Core Ultra Series 3 delivers competitive advantages in critical edge AI workloads with up to 1.9x higher large language model (LLM) performance4, up to 2.3x better performance per watt per dollar on end-to-end video analytics, and up to 4.5x higher throughput on vision language action (VLA) models6. The integrated AI acceleration enables superior total cost of ownership (TCO) through a single system on chip (SoC) solution versus traditional multi-chip CPU and GPU architectures. Pre-orders for the first consumer laptops powered by Intel Core Ultra Series 3 processors will begin Jan. 6, 2026. Systems will be available globally starting Jan. 27, 2026, with additional designs coming throughout the first half of the year. Edge systems powered by Intel Core Ultra series 3 will be available starting Second Quarter 2026.