View ValuationQnity Electronics 将来の成長Future 基準チェック /36Qnity Electronics利益と収益がそれぞれ年間17.3%と8%増加すると予測されています。EPS は年間 増加すると予想されています。自己資本利益率は 3 年後に11.6% 17.5%なると予測されています。主要情報17.3%収益成長率17.54%EPS成長率Semiconductor 収益成長33.7%収益成長率8.0%将来の株主資本利益率11.60%アナリストカバレッジGood最終更新日27 Jul 2026今後の成長に関する最新情報更新なしすべての更新を表示Recent updatesお知らせ • Jul 28Qnity Electronics Launches Laird Tflex Cr910 Liquid Gap Filler and Laird Tgrease 3000 Thermal GreaseQnity Electronics, Inc. announced the launch of two new thermal interface materials (TIM): Laird Tflex CR910, a two-part dispensable liquid gap filler, and Tgrease 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Laird Tflex CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance. Laird Tgrease 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.お知らせ • Jul 24Qnity Electronics, Inc. Announces Executive Changes, Effective August 3, 2026Qnity Electronics, Inc. announced that it has appointed Katherine (Kate) Dei Cas as President of its Semiconductor Technologies business segment, effective August 3. Sam Ponzo, who has been serving as the segment’s Interim President, will return to his role as Qnity’s Chief Commercial & Strategy Officer at that time. Kate has more than 25 years of semiconductor industry experience. She joins Qnity from EMD Electronics, a division of Merck KGaA Darmstadt, Germany, where she most recently served as Executive Vice President and as a member of the Executive Team.お知らせ • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026お知らせ • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.お知らせ • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.Valuation Update With 7 Day Price Move • Jun 22Investor sentiment improves as stock rises 28%After last week's 28% share price gain to €154, the stock trades at a forward P/E ratio of 45x. Average forward P/E is 47x in the Semiconductor industry in Germany.お知らせ • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.お知らせ • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.業績と収益の成長予測XTRA:Z5O - アナリストの将来予測と過去の財務データ ( )USD Millions日付収益収益フリー・キャッシュフロー営業活動によるキャッシュ平均アナリスト数12/31/20286,2441,1869501,307612/31/20275,8979908761,242712/31/20265,37377243299773/31/20264,9516508981,201N/A12/31/20254,7546929881,273N/A9/30/20254,6658057881,068N/A6/30/20254,5377938571,105N/A3/31/20254,4707538201,054N/A12/31/20244,3356938611,061N/A12/31/20234,035507651882N/A12/31/20224,7557749511,153N/Aもっと見るアナリストによる今後の成長予測収入対貯蓄率: Z5Oの予測収益成長率 (年間17.3% ) は 貯蓄率 ( 1.9% ) を上回っています。収益対市場: Z5Oの収益 ( 17.3% ) はGerman市場 ( 15.4% ) よりも速いペースで成長すると予測されています。高成長収益: Z5Oの収益は増加すると予測されていますが、大幅には増加しません。収益対市場: Z5Oの収益 ( 8% ) German市場 ( 6.7% ) よりも速いペースで成長すると予測されています。高い収益成長: Z5Oの収益 ( 8% ) 20%よりも低い成長が予測されています。一株当たり利益成長率予想将来の株主資本利益率将来のROE: Z5Oの 自己資本利益率 は、3年後には低くなると予測されています ( 11.6 %)。成長企業の発掘7D1Y7D1Y7D1YSemiconductors 業界の高成長企業。View Past Performance企業分析と財務データの現状データ最終更新日（UTC時間）企業分析2026/07/31 08:27終値2026/07/31 00:00収益2026/03/31年間収益2025/12/31データソース企業分析に使用したデータはS&P Global Market Intelligence LLC のものです。本レポートを作成するための分析モデルでは、以下のデータを使用しています。データは正規化されているため、ソースが利用可能になるまでに時間がかかる場合があります。パッケージデータタイムフレーム米国ソース例会社財務10年損益計算書キャッシュ・フロー計算書貸借対照表SECフォーム10-KSECフォーム10-Qアナリストのコンセンサス予想+プラス3年予想財務アナリストの目標株価アナリストリサーチレポートBlue Matrix市場価格30年株価配当、分割、措置ICEマーケットデータSECフォームS-1所有権10年トップ株主インサイダー取引SECフォーム4SECフォーム13Dマネジメント10年リーダーシップ・チーム取締役会SECフォーム10-KSECフォームDEF 14A主な進展10年会社からのお知らせSECフォーム8-K* 米国証券を対象とした例であり、非米国証券については、同等の規制書式および情報源を使用。特に断りのない限り、すべての財務データは1年ごとの期間に基づいていますが、四半期ごとに更新されます。これは、TTM（Trailing Twelve Month）またはLTM（Last Twelve Month）データとして知られています。詳細はこちら。分析モデルとスノーフレークこのレポートを生成するために使用した分析モデルの詳細は、当社のGitHubページでご覧いただけます。また、レポートの活用方法に関するガイドやYouTubeのチュートリアルも用意しています。シンプリー・ウォールストリート分析モデルを設計・構築した世界トップクラスのチームについてご紹介します。業界およびセクターの指標私たちの業界とセクションの指標は、Simply Wall Stによって6時間ごとに計算されます。アナリスト筋Qnity Electronics, Inc. 7 これらのアナリストのうち、弊社レポートのインプットとして使用した売上高または利益の予想を提出したのは、 。アナリストの投稿は一日中更新されます。9 アナリスト機関John McNultyBMO Capital Markets Equity ResearchBhavesh LodayaBMO Capital Markets Equity ResearchMelissa WeathersDeutsche Bank6 その他のアナリストを表示
お知らせ • Jul 28Qnity Electronics Launches Laird Tflex Cr910 Liquid Gap Filler and Laird Tgrease 3000 Thermal GreaseQnity Electronics, Inc. announced the launch of two new thermal interface materials (TIM): Laird Tflex CR910, a two-part dispensable liquid gap filler, and Tgrease 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Laird Tflex CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance. Laird Tgrease 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.
お知らせ • Jul 24Qnity Electronics, Inc. Announces Executive Changes, Effective August 3, 2026Qnity Electronics, Inc. announced that it has appointed Katherine (Kate) Dei Cas as President of its Semiconductor Technologies business segment, effective August 3. Sam Ponzo, who has been serving as the segment’s Interim President, will return to his role as Qnity’s Chief Commercial & Strategy Officer at that time. Kate has more than 25 years of semiconductor industry experience. She joins Qnity from EMD Electronics, a division of Merck KGaA Darmstadt, Germany, where she most recently served as Executive Vice President and as a member of the Executive Team.
お知らせ • Jul 07Qnity Electronics, Inc. to Report Q2, 2026 Results on Aug 04, 2026Qnity Electronics, Inc. announced that they will report Q2, 2026 results Pre-Market on Aug 04, 2026
お知らせ • Jun 25Qnity Electronics, Inc. Declares Quarterly Dividend on Common Stock for Third Quarter 2026, Payable on September 15, 2026Qnity Electronics, Inc. announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026.
お知らせ • Jun 23Qnity Electronics Launches Advanced Packaging Innovation HubQnity Electronics, Inc. announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intelligence (AI), high-performance computing, cloud, networking, and edge computing systems. The semiconductor industry is moving beyond the traditional gains of Moore's Law, and innovation is increasingly shifting from 'shrink' to 'stack' through the design of advanced 3D architectures. Advanced packaging is one of the most important enabling technologies for AI infrastructure and next-generation computing, making it a key focus area for Qnity's long-term growth and innovation strategy. As system architectures evolve beyond conventional packaging approaches, advanced packaging has emerged as a critical driver of performance, power, and efficiency. Across the advanced packaging stack—from High Bandwidth Memory (HBM) and interposers to bonding, assembly, and IC substrates—Qnity provides materials and process technologies that help customers achieve the yield, process control, reliability, and performance required for increasingly complex heterogeneous system designs. Advanced chip manufacturers face growing demands for high-density interconnects, through-silicon vias (TSVs), fine-line redistribution layers (RDLs), advanced metallization, hybrid bonding, and multi-die integration. Qnity's solutions enable precise manufacturing, defect reduction, thermal management, high-density routing, and long-term device reliability. Together, these capabilities help customers overcome manufacturing challenges in advanced packaging.
Valuation Update With 7 Day Price Move • Jun 22Investor sentiment improves as stock rises 28%After last week's 28% share price gain to €154, the stock trades at a forward P/E ratio of 45x. Average forward P/E is 47x in the Semiconductor industry in Germany.
お知らせ • Jun 12Qnity Electronics Introduces Optivision Max Polishing Pads for Advanced Semiconductor ManufacturingQnity Electronics announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. A technician installed an Optivision™ Max pad on a platen in Qnity’s polishing lab at the Asia CMP Manufacturing & Technology Center in Hsinchu (Jhunan), Taiwan. The Optivision™ Max CMP pad platform is designed for advanced semiconductor manufacturing. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps. Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes. The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.
お知らせ • Jun 09Qnity Electronics Introduces Enhanced Advanced Packaging Material Solutions for Organic Interposer ApplicationsQnity Electronics introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures. Qnity’s Intervia 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices. From its advanced packaging polymer portfolio, Qnity offers Cyclotene DF6800M, a dry film dielectric for glass core substrates and glass interposers. This innovation enables fine-feature patterning, effective planarization on patterned surfaces, and consistent multilayer build-up required for advanced packaging. Its photo-imageable, aqueous-developed chemistry and dry film format support efficient, scalable manufacturing of high-density semiconductor structures. The two newly developed advanced packaging materials for interposer application will be featured at booth #2C-47 at JPCA Show 2026, June 10–12, at Tokyo Big Sight. Visitors are invited to meet Qnity experts to learn how the company is enabling next-generation AI and high-performance computing applications.