Annuncio • May 03
Teledyne Unifies Chartworld and Raymarine Commercial Under A Single Global Commercial Navigation Brand Teledyne Technologies Incorporated announced the unification of ChartWorld and Raymarine Commercial under a single commercial navigation brand, Raymarine Commercial. As part of the unification, ChartWorld’s commercial navigation solutions and services will transition fully into the Raymarine Commercial brand, further strengthening Teledyne’s position as a global leader in maritime navigation solutions and demonstrating the successful integration of acquired businesses into its core operations. The combination brings ChartWorld’s established digital navigation, ECDIS, and managed service capabilities fully into the Raymarine Commercial brand, creating a more cohesive, scalable, and customer-focused organization for the international commercial shipping market. ChartWorld, acquired by Teledyne in 2023, has earned a strong reputation within the commercial shipping sector for its digital navigation expertise, data services, and hardware-as-a-service ECDIS model. The integration into Raymarine Commercial builds on that foundation by combining ChartWorld’s software-led capabilities and worldwide service and support infrastructure with Raymarine’s technological expertise in marine hardware, including IMO-approved marine radar and ECDIS navigation systems. Under the unified Raymarine Commercial brand, customers benefit from a more integrated navigation offering spanning ECDIS, radar, sensors, data services, and remote support – all backed by Teledyne’s global engineering resources and long-term commitment to the maritime market. The integration comes at a pivotal time for the maritime industry, as vessel operators prepare to adopt the new S-100 universal hydrographic data model for electronic navigation and embrace higher levels of vessel connectivity. By bringing technology, service, and expertise together within Raymarine Commercial, Teledyne aims to give customers a dependable navigation partner ready for the next generation of maritime operations. Annuncio • Apr 29
Teledyne FLIR OEM Launches Prism C-UAS Software Teledyne FLIR OEM announced the release of Prism C-UAS, a high-performance counter-unmanned aircraft system (C-UAS) detection and tracking software stack. Prism C-UAS extends detection and tracking range for small, hard-to-detect drones. By combining patented thermal infrared (IR) image signal processing with artificial intelligence (AI)-driven perception, the software enables small-drone detection with fewer than four pixels on target, maximizing time to respond with counter-drone measures. Prism C-UAS enables scalable deployment across a wide range of global C-UAS architectures. Leveraging patented denoise, local contrast enhancement, and upsampling algorithms to enhance target signal-to-noise ratio (SNR), Prism C-UAS increases moving target indicator (MTI) detection range. Once detected, targets are processed by an AI-based object detector and tracked by an efficient multi-object tracker software to reduce false positives and maintain persistent tracks. The system is optimized specifically for small, fast, and maneuvering drone targets. Designed for streamlined integration, Prism C-UAS natively supports data from Teledyne FLIR OEM’s market-leading Boson+ and Neutrino IR camera families, as well as select commercial off-the-shelf visible cameras to enable multispectral sensor configurations. Prism C-UAS lowers integration risk through Teledyne FLIR OEM’s proven technology, robust developer tools, and expert technical support, enabling scalable deployment across a wide range of global C-UAS architectures. To see the new Prism C-UAS software and other exciting products, visit the Teledyne FLIR OEM demonstration suite at the Gaylord National Resort and Convention Center, Monument Suite #5221 at SPIE DCS 2026, April 28 to April 30, 2026. Reported Earnings • Apr 24
First quarter 2026 earnings released: EPS: US$4.85 (vs US$4.03 in 1Q 2025) First quarter 2026 results: EPS: US$4.85 (up from US$4.03 in 1Q 2025). Revenue: US$1.56b (up 7.6% from 1Q 2025). Net income: US$226.8m (up 20% from 1Q 2025). Profit margin: 14% (up from 13% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 4.5% p.a. on average during the next 3 years, compared to a 18% growth forecast for the Global Electronic industry. Annuncio • Apr 21
Teledyne E2v Introduces Caiman Imaging Module For Low Light Applications Teledyne e2v announced the launch of the Caiman imaging module, a small, lightweight, low power solution designed for demanding low light applications. Built around the OnyxMax sensor, Caiman delivers high quantum efficiency, high spatial resolution in the near-infrared spectral band, and low noise performance providing high sensitivity in low-light conditions (less than 1 mlx). The module integrates image processing features, including automatic exposure control, noise filtering, histogram equalization, and binning, to ensure consistently high image quality. With its compact form factor and very low power consumption (below 1W), Caiman is designed for extended operation. It also supports high speeds (greater than 120 fps), which reduces overall system latency for smoother real-time visualization. Its MIPI interface enables easy integration into digital vision systems and compatibility with standard System on Chips (SOCs). These capabilities make Caiman an ideal solution for night vision, surveillance, laser detection, and scientific imaging applications. Its CMOS technology ensures reliable performance in both daytime and nighttime conditions. Caiman will be showcased at SPIE Defense + Security, National Harbor, Maryland, USA, from April 26 to April 30, 2026. Documentation, samples, and software for evaluation or development are available upon request. Annuncio • Apr 16
Teledyne Technologies Incorporated to Report Q1, 2026 Results on Apr 22, 2026 Teledyne Technologies Incorporated announced that they will report Q1, 2026 results Pre-Market on Apr 22, 2026 Annuncio • Apr 14
Teledyne Technologies Incorporated Showcases Integrated Maritime Technology Portfolio At 2026 Iho Assembly Teledyne Technologies Incorporated announced its participation in the 2026 International Hydrographic Organization (IHO) Assembly, taking place April 19–23, 2026, in Monaco. The company will be represented by several of its maritime brands – including Teledyne CARIS, Raymarine Commercial, FLIR Marine, ChartWorld, SevenCs, and Teledyne Marine – presenting a unified portfolio of technologies that advance marine navigation, hydrography, situational awareness, and operational safety. Teledyne’s maritime brands will showcase a selection of products and innovations designed to support the global transition toward the next-generation universal hydrographic data model, known as S-100. Teledyne companies are at the forefront of S-100 production, validation, and S-100-compatible navigation products that deliver improved situational awareness and promote safer navigation. Teledyne CARIS will lead the presence at this year’s IHO Assembly, highlighting key advancements including AutoChart 2.0. Building on decades of collaboration with hydrographic offices worldwide, Teledyne CARIS will demonstrate streamlined chart-production workflows and end-to-end data management designed to accelerate national modernisation efforts and enhance data consistency across hydrographic office partners. Alongside Teledyne CARIS, Raymarine Commercial will debut its S-100-ready ECDIS, a navigation system engineered to support enhanced data layers, modernised workflows, and next-generation electronic charting for commercial fleets. FLIR Marine will present the M364C thermal camera, combining high-resolution thermal imaging with colour low-light technology to deliver target identification and situational awareness in all weather and lighting conditions. Teledyne Marine will showcase its newly launched deep-water sonar system, the SeaBat D100. Designed for deep-water Vessel of Opportunity operations, the system brings SeaBat data quality, resolution, and reliability into a compact, highly flexible configuration that can operate in water depths down to 3,000 meters. ChartWorld will highlight its expertise in digital chart solutions and ECDIS services, while SevenCs will showcase its chart production and validation technologies, together demonstrating how their combined capabilities integrate across the Teledyne ecosystem to support modern navigation and S-100-ready data workflows. The IHO Assembly brings together representatives from more than 90 member states to shape the future of ocean mapping, hydrography, and global charting standards, reflecting Teledyne’s mission to advance marine knowledge, technology excellence, and navigational safety worldwide. Annuncio • Apr 08
Teledyne Flir OEM Announces Upgraded Prism Skr Software Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, announced an upgrade to Prism SKR, evolving the software from automated targeting into a unified, closed-loop autonomy platform. The milestone update sets a new defense industry standard by unifying mission execution and intelligent supervision into a single platform for guided weapon systems, including smart, loitering munitions, air-launched effects (ALE), counter-UAS platforms, attritables, interceptors, and first-person view (FPV) drones. Teledyne FLIR OEM’s upgraded Prism SKR software manages the entire mission lifecycle, from tasking through execution by delivering perception-based automatic target recognition (ATR) and autonomy with advanced features designed for precision in contested environments. Prism SKR’s pixel-lock targeting also addresses the critical final meters of FPV drone missions, ensuring precision autonomy in the terminal phase where manual control often fails due to signal interference. Key enhancements include 3D interactive aimpoint selection, terrain-aware operations, and pixel-lock targeting, which ensures precise, persistent re-identification (ReID) tracking through signal degradation or loss, scaling from assisted AI during FPV handoff to fully autonomous mission execution. These capabilities support a wide range of mission scenarios, including air-to-ground, ground-to-air, air-to-air, and ground-to-ground operations. Built for rapid OEM deployment, Prism SKR operates at the edge on low-power embedded platforms, including NVIDIA Orin and Teledyne FLIR OEM’s AVP system-on-module (SOM) based on the Qualcomm Dragonwing QCS8550. The Weapon Open Systems Architecture (WOSA) compliant software integrates seamlessly with Boson and Neutrino IR cameras, as well as integrator-selected visible sensors, delivering real-time target tracking and system state. A comprehensive application programming interface (API) and software development kit (SDK) accelerate deployment speed and reduce development risk while enabling performance optimization and customization. Annuncio • Mar 31
Teledyne Technologies Incorporated Promotes Gregoire Outters to President of Teledyne Marine Group, Effective March 30, 2026 Teledyne Technologies Incorporated announced the promotion of Gregoire Outters to President of its Teledyne Marine Group. In this role, Mr. Outters will continue to lead the Maritime businesses in the Digital Imaging segment and will assume responsibility for Teledyne’s Marine businesses in the Instrumentation segment, effective March 30, 2026. The Teledyne Marine Group has a wide variety of leading products and technologies, including subsea vehicles, surface and subsea marine imaging technologies, marine radars, navigation electronics, interconnects, marine instruments, and data collection and distribution solutions. Mr. Outters has more than 23 years of experience in thermal imaging and 13 years in the maritime industry. He joined Cedip Infrared Systems in Paris, France in 2003, where he progressed into senior leadership roles and later served as General Manager following FLIR Systems Inc.’s 2008 acquisition of Cedip. In 2013, Mr. Outters relocated to the United Kingdom to lead the Raymarine business of FLIR and continued to serve in that leadership role following Teledyne’s 2021 acquisition of FLIR. Most recently, he has served as the Senior Executive Vice President and General Manager of the Maritime businesses in Teledyne’s Digital Imaging segment. Annuncio • Mar 20
Teledyne Technologies Incorporated Demonstrates Integrated Satellite Communications Capabilities Teledyne Technologies Incorporated showcased its integrated satellite communications capabilities at SATShow Week 2026, March 24–26 at the Walter E. Washington Convention Center in Washington, DC. Attendees are invited to visit Booth 2729 to explore how Teledyne’s high-reliability SATCOM solutions support missions from ground to deep space. With more than six decades of space heritage and continuous innovation, Teledyne offers one of the industry’s most comprehensive SATCOM portfolios, ranging from onboard processing and RF components to engineered systems and rapid PCB manufacturing. These capabilities support COTS, near-COTS, and full MIL-Spec solutions for commercial, civil, and defense applications. Highlights at Booth 2729 include live demonstrations of the EV10AS940 ADC using Non-Uniform Sampling (NUS) to reduce satellite data throughput while preserving signal integrity, and a 16 core Arm Cortex A72 radiation-tolerant processor running real-time AI image processing. Additional products on display include the TDLNA0840EP, the industry’s lowest-power 4 GHz low-noise amplifier (LNA); the TDOC8012-04CC0 high-voltage optocoupler; the TSA-226001 digitally tunable YIG band-reject filter (2–20 GHz); high-power amplifiers; space-qualified coaxial switches and relays; rugged SATCOM systems with radiation monitoring and geospatial analytics; and rapid RF/microwave PCB prototyping with five-day turnaround. Teledyne’s technical experts will be available throughout SATShow Week to discuss mission requirements, emerging SATCOM architectures, and how Teledyne’s integrated capabilities can be tailored to deliver resilient, scalable satellite communications systems. Annuncio • Mar 17
Teledyne E2v Starts Production Of 16GB DDR4-X1 Flight Models For Space Applications Teledyne e2v has started full production of its 16GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications. The new device is designed to support the growing processing and data storage requirements of AI-enabled satellites, large constellations, broadband Internet-from-Space, Direct-to-Device services, and optical inter-satellite communications. By combining high memory density, radiation resilience, and a compact footprint, the component enables spacecraft to handle increasingly demanding onboard computing workloads. Initial samples of the 16GB DDR4-X1 Flight Models were delivered to customers in October 2025, allowing early system integration and evaluation. The device supports data rates up to 2400 MT/s, provides single-event latch-up immunity above 43 MeV·cm²/mg, and offers radiation tolerance up to 35 krad TID, enabling reliable operation in mission-critical space environments. Maintaining the same 15 × 20 × 1.92 mm footprint as other devices in Teledyne e2v’s DDR4 family, the new memory is pin-to-pin compatible with lower-density versions, allowing satellite integrators to upgrade memory capacity without redesigning their boards. The 16GB DDR4-X1 device is also used in Teledyne e2v’s Qormino QLS1046 space computing modules, which integrates a radiation-tolerant processor with DDR4 memory for advanced onboard processing tasks such as AI inference, sensor fusion, and autonomous spacecraft operations. Teledyne e2v’s DDR4 portfolio also includes 8GB Flight Models and NASA Level 1 16GB versions for GEO and long-duration missions, expected to be available in Third Quarter 2026. This portfolio gives satellite designers the flexibility to select the optimal memory density and quality flow for their mission profiles while ensuring compatibility and long-term continuity. Annuncio • Mar 03
Teledyne Microwave UK Announces New Wideband Limiter Teledyne Microwave UK, part of Teledyne Technologies Incorporated announced the release of its new Wideband Limiter, a passive 0.1–20 GHz RF protection module designed to enhance the survivability of Radar Electronic Support Measures (R-ESM) and wider Electronic Warfare (EW) systems operating in increasingly complex threat environments. Developed to address the growing impact of high-power RF and emerging Directed Energy Weapon (DEW) threats, the Wideband Limiter provides an always-on layer of protection for sensitive receiver electronics. While R-ESM platforms are inherently passive, future threat evolution continues to place greater demands on front-end resilience. The limiter acts as a strategic safeguard by restricting harmful RF energy before it reaches critical hardware. The module delivers wideband passive protection without compromising system sensitivity or coverage. With its compact, SMA-based housing, it integrates cleanly into existing architectures and requires no system redesign. It is also fully compatible with Teledyne’s Phobos MTU (Mast Top Unit) and can accommodate additional RF elements such as filters when required. By absorbing excessive RF energy before it enters the system, the Wideband Limiter helps reduce the risk of damage to high-value electronics. This supports lower repair frequency, avoids long-lead component replacements and minimises downtime following high-power events, key factors for maintaining operational readiness in mission-critical environments. Designed for future threat landscapes, the Wideband Limiter provides scalable protection for a wide range of modern EW and intelligence platforms, ensuring robustness without affecting overall system behaviour or capability. The Wideband Limiter is now available for integration evaluation across defence and electronic warfare applications. Full technical specifications and product information can be found on the Teledyne Microwave UK website or by contacting TMUK_Sales@teledyne.com. Annuncio • Feb 24
Teledyne FLIR OEM Launches Lepton XDS At Mobile World Congress; A Compact Thermal-Visible Camera Module F Featuring Patented MSX Technology Teledyne FLIR OEM announced the launch of the Lepton®? XDS, a compact dual-thermal-and-visible camera module bringing Teledyne FLIR's patented MSX®? (Multi-Spectral Dynamic Imaging) technology to a new class of space- and power-constrained Original Equipment Manufacturer (OEM) products. Designed for rapid integration, the International Traffic in Arms Regulations (ITAR) -free Lepton XDS reduces development risk and accelerates time-to-market for embedded, mobile, and industrial applications. The Lepton XDS pairs a 160 x 120 radiometric Lepton 3.5 micro-thermal camera with a five-megapixel (MP) visible sensor, featuring MSX that enhances thermal imagery in real time by embossing visible-image edges directly onto the thermal scene. This patented software delivers sharper detail, improved context, and a level of actionable thermal intelligence typically associated with more- expensive, higher-resolution camera systems. It is ideal for fire detection and prevention, EV battery monitoring, robotics navigation, unmanned platforms, smart infrastructure, and health and safety systems. The integrated FLIR Prism ISP software ensures real-time image enhancement while providing a comprehensive out-of-the-box suite of advanced image-processing features, including thermal-visible fusion, advanced image processing, and an industry-first radiometric JPEG (RJPEG) output. Built-in measurement and visualization tools include regions of interest (ROI), spot temperature measurements, isotherms, and customizable color palettes, and it is seamlessly compatible with the Teledyne FLIR OEM software ecosystem for analysis, post-processing, and reporting. The Lepton XDS is a size, weight, and power (SWaP)-optimized module, and an industry-standard USB output makes it well-suited for battery-powered and always-on systems. It is also ITAR-free and classified under ECCN 6A003.b.4.b, enabling broadly available for commercial applications worldwide. Annuncio • Feb 19
Teledyne HiRel Semiconductors Unveils Industry's Lowest Power, 4 GHz, Wideband Low-Noise Amplifier (LNA) Teledyne HiRel Semiconductors announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5-volt supply. With a typical gain of 29 dB and a typical noise figure of 1.5 dB across 0.3-4.0 GHz, the TDLNA08 40EP enables significant power savings in space, avionics, and battery-constrained RF systems. The TDLNA0840EP is the lowest-power, 4 GHz low-noise amplifier on the market, delivering significant SWaP reductions compared to conventional solutions that require higher bias currents and voltages. TDLNA0840EP Highlights: Lowest-power 4 GHz, wideband LNA on the market; 0.3-4. 0.3-4.1 GHz frequency coverage; 1.5 V single-supply operation; 25-30 mW typical power consumption; 29 dB typical gain and 1.5 dB typical noise figure; 55 degC to +125 degC operating temperature range; Compact 3 x 3 mm QFN package with internally matched, DC-blocked 50-ohm RF ports. Target Applications; LEO satellite payloads and spaceborne receivers; Phased-array and active antenna elements; Avionics and military communication systems; SWaP-constrained and battery-powered RF front ends. Annuncio • Feb 10
Teledyne Technologies Incorporated Advances in Infrared Imaging Teledyne Technologies Incorporated recognized the agile performance, innovation, and production scale of its business unit, Teledyne FLIR OEM. As the global leader in intelligent thermal imaging systems, Teledyne FLIRO operates as a commercial foundry with unmatched vertical integration. Serving defense primes, industrial customers, and commercial markets with the speed and flexibility of a non-traditional defense contractor, the company delivers tens of thousands of thermal modules every week. As the world's largest volume manufacturer of ITAR-free infrared (IR) sensors and modules, TeledyneFLIR OEM delivers thousands of IR modules daily for defense, professional, automotive, and uncrewed applications. Operating at very high volumes with multi-decade partnerships supporting U.S. government, defense primes, and international customers, the company combines agility with qualified manufacturing scale. This minimizes risk while accelerating time-to-market for applications ranging from small UAS and counter-UAS platforms to border security systems, surveillance applications, aircraft survivability equipment, and industrial automation. Teledyne FLIR OEM's competitive advantage, highlighted by the recent Tura™? automotive-qualified thermal camera module launch and today's announcement of the latest Neutrino ISR model, stems from true vertical integration that spans the entire infrared imaging value chain. Operating a commercial foundry at very high volumes, the company designs and manufactures critical components through its ISO-certified manufacturing facilities--from readout integrated circuits (ROICs) and detectors utilizing advanced InSb and Type-II superlattice (T2SL) focalplane arrays to microbolometers, and sensor packaging for both cooled and uncooled infrared imaging modules. This end-to-end integration extends to linear coolers designed and manufactured in-house, optics design and manufacture, supporting software, electronics, and digital AI products that create fully integrated camera systems with sophisticated software platforms. Teledyne FLIRO-embedded software enables real-time decision support and autonomous operation in resource-constrained environments, ideal for applications ranging from autonomous vehicles to tactical military systems such as counter-drone solutions. By controlling every stage of production, Teledyne FLIR IoT minimizes schedule and delivery risk while maintaining agility and lean manufacturing processes as a U.S.-based non-traditional defense contractor and commercial foundry. This expertise positions the company as the lowest-risk IR supply chain partner for U.S. and European defense contractors, commercial customers, and large industrial primes alike. Annuncio • Jan 21
Teledyne Technologies Incorporated Provides Earnings Guidance for the First Quarter and Full Year of 2026 Teledyne Technologies Incorporated provided earnings guidance for the first quarter and full year of 2026. Based on its current outlook, the company’s management believes that first quarter 2026 GAAP diluted earnings per share will be in the range of $4.45 to $4.59.
For the full year 2026 GAAP diluted earnings per share will be in the range of $19.76 to $20.22. Annuncio • Jan 15
Teledyne Technologies Incorporated (NYSE:TDY) acquired Dd-Scientific Holdings Limited. Teledyne Technologies Incorporated (NYSE:TDY) acquired Dd-Scientific Holdings Limited on January 14, 2026. The transaction also includes the acquisition of DD-Scientific Limited, subsidiary of Dd-Scientific Holdings. Terms of the transaction were not disclosed.
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Dd-Scientific Holdings Limited on January 14, 2026. Annuncio • Jan 14
Teledyne Technologies Incorporated to Report Q4, 2025 Results on Jan 21, 2026 Teledyne Technologies Incorporated announced that they will report Q4, 2025 results Pre-Market on Jan 21, 2026 Annuncio • Jan 05
Teledyne FLIR OEM Debuts Tura Automotive-Qualified Thermal Camera At CES for AVs and ADAS Teledyne FLIR OEM, a Teledyne Technologies Incorporated company announced the launch of Tura™?, the first Automotive Safety Integrity Level (ASIL-B) thermal longwave infrared (LWIR) camera developed in compliance with ISO 26262 functional safety (FuSa) standards. It is purpose-built to meet the stringent perception requirements for vehicle-based night vision, advanced driver-assistance systems (ADAS), and autonomous vehicles (AV) that demand high performance, low supply risk, and cost-effective thermal solutions. Tura™? is the first Automotive Safety Integrity level (ASIL-B) Thermal longwave infrared (LWir) camera developed in compliance withISO 26262 functional safety (FuSa) standards. It ispurpose-built to meet the stringent vision requirements for vehicle-based night Vision, advanced driver-ass assistance systems (ADAS), andonomous vehicles (AV). The automotive-qualified Tura features a new, high-performance passive 640 x 512 resolution far-infrared (FIR) sensor with sensitivity--critical for detecting and classifying pedestrians, animals, and other vulnerable roadway users. It delivers perception far beyond headlights in complete darkness and through challenging conditions such as fog, smoke, sun glare, and headlight glare. Tura enhances lifesaving pedestrian automatic emergency braking (PAEB) and helps provide a smoother, safer ride. It also supports the U.S. Department of Transportation's National Highway Traffic Safety Administration (NHTSA) Federal Motor Vehicle Safety Standard (FMVSS) No. 127, which requires higher-speed night test scenarios where existing AEB systems struggle. Teledyne FLIR OEM thermal cameras are also deployed in fully autonomous vehicles. In addition to delivering forward-looking perception data, multiple thermal camera modules can be integrated to enhance 360-degree situational awareness. This enables reliable detection of heat-emitting objects--such as people, vehicles, and animals--even in low-visibility conditions. The Tura thermal camera module includes key safety and reliability features: ASIL-B Compliance: Developed in accordance with ISO 26262 FuSa standards. All-Weather Operation: Heated IP6K9K enclosure ensures reliable 24/7/365 performance. Shutterless Design: AEC-Q-qualified components maximize uptime, power efficiency, and affordability. AI-Optimized Integration: Simplified deployment with Teledyne FLIR OEM's training data and Prism™? perception software, trained with millions of annotations. Tura is available now and will be showcased in Valeo's Central Plaza Booth (CP145) and the Teledyne FLIR OEM meeting and demonstration suite at the Courtyard Marriott Las Vegas Convention Center during CES, January 6-9, 2026. Annuncio • Jan 02
Teledyne Technologies Incorporated Announces Retirement of Denise R. Singleton as Director, Effective January 1, 2026 On December 30, 2025, Denise R. Singleton informed the Board of Directors (the Board") of Teledyne Technologies Incorporated (Teledyne") of her decision to retire from being a director of Teledyne effective January 1, 2026 due to potential meeting conflicts. With Ms. Singleton's retirement, the Board of Directors has fixed the number of directors at 11 effective January 1, 2026, with the number of Class 1 directors being reduced from four to three. Annuncio • Dec 24
Teledyne Technologies Incorporated Appoints Jihfen Lei as Senior Vice President, Effective January 1, 2026 Teledyne Technologies Incorporated announced the promotion of Dr. JihFen Lei to Senior Vice President of Teledyne Technologies, effective January 1, 2026. In this role, Dr. Lei will continue to lead Teledyne FLIR Defense and will assume responsibility for Teledyne’s Aerospace and Defense Electronics Segment. This group of businesses, collectively referred to as the Teledyne Defense and Aerospace Group, includes a wide variety of advanced products and technologies, from high reliability electronic components, subsystems, energetics, and avionics in the Aerospace and Defense Electronics Segment, to FLIR Defense’s high performance unmanned, surveillance, and detection systems. Under Dr. Lei’s strong leadership, Teledyne FLIR Defense has excelled financially and has successfully delivered advanced solutions, including surveillance products and loitering munitions, that meet the complex needs of global defense customers. In this new leadership role, Dr. Lei will focus on leveraging the full breadth of Teledyne’s Defense and Aerospace technologies to coordinate closely with customers and bring them comprehensive solutions in a rapidly evolving Defense and Aerospace landscape. Prior to her return to Teledyne in 2021, Dr. Lei performed the duties of the Deputy Undersecretary of Defense for Research and Engineering at the Pentagon and served as the Principal Deputy, Director of Defense Research and Engineering for Research and Technology. In these roles, Dr. Lei led the U.S. Department of Defense Science and Technology Enterprise and oversaw the Science and Technology investment, programs, workforce and laboratory infrastructure policy collaborating with international allies. Earlier in her government career, Dr. Lei led the Research & Technology Directorate at the NASA Glenn Research Center and served within the White House Office of Science and Technology Policy and NASA Headquarters. Dr. Lei also led Teledyne Judson Technologies during her prior tenure at Teledyne from 2015 to 2019. Annuncio • Nov 14
Teledyne Space Imaging Announces Availability of Upscreened Sensors for Space: EMs and Evaluation Kits Ready by End of 2025 Teledyne Technologies Incorporated announced that Engineering Models (EMs) of its newly launched industrial CMOS image sensors--upscreened for space applications--will be available along with evaluation kits and integration tools by the end of 2025. These sensors, developed and tested in Teledyne's facilities in Grenoble, France, are tailored for the growing demands of the New Space market. The two variants-- Ruby 1.3M USV and Emerald Gen2 12M USV-- offer resolutions of 1.3MP and 12MP, respectively, and are qualified by test for applications such as Earth observation, star trackers, monitoring cameras, space suits, rovers, and moon landers. Each sensor undergoes rigorous delta space qualification and radiation testing, including assessments for Single Event Latch-up (SEL), Single Event Effect (SEE), and Single Event Functional Interrupt (SEFI). Depending on mission requirements, they are delivered as flight models with two levels of screening: U1 (ESCC9020-like) and U3 (NASA Class 3 tailored for image sensors). To support rapid integration and reduce time-to-market, Teledyne e2v provides a comprehensive suite of tools including: Engineering Models (EMs) and Evaluation kits and Reference designs. These resources, combined with Teledyne's dedicated support team ensure seamless assistance from design concept to system launch. Annuncio • Oct 13
Teledyne Technologies Incorporated to Report Q3, 2025 Results on Oct 22, 2025 Teledyne Technologies Incorporated announced that they will report Q3, 2025 results Pre-Market on Oct 22, 2025 Annuncio • Jul 24
Teledyne Hirel Semiconductors Announces High-Density 16 Gbyte Ddr4 Module Teledyne HiRel Semiconductors announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C. The TDD416Y12NEPBM01, is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged in a 216-ball BGA measuring just 22mm x 22mm, it is engineered for systems where board space is limited and performance is critical. Its streamlined design integrates memory, termination, and passives into a single unified 22mm2 module — effectively replacing multiple discrete components and simplifying layout complexity. Unlike monolithic ECC memory modules, the TDD416Y12NEPBM01 supports error correction through an optional companion ECC. This architecture offers key technical advantages such as thermal isolation, design flexibility and cost savings. The TDD416Y12NEPBM01 module was developed to meet the growing need for embedded platforms that demand high-speed memory in tight enclosures. Whether routing alongside modern SoCs, CPUs, or FPGAs, the module offers clean signal integrity, and thermal flexibility. It pairs well with processors that support x64 or x72 memory buses, including, Xilinx Versal, Microchip PolarFire, NXP Layerscape, Xilinx Ultrascale+, Intel Atom, as well as Teledyne’s own LS1046-Space and a wide range of ARM-based compute cores. In keeping with industry trends, the DDR4 delivers 42% power savings, 42% jitter reduction, and 39% PK/PK savings when compared to traditional SODIMMs. Annuncio • Jul 17
Teledyne Technologies Incorporated to Report Q2, 2025 Results on Jul 23, 2025 Teledyne Technologies Incorporated announced that they will report Q2, 2025 results Pre-Market on Jul 23, 2025 Annuncio • Jun 24
Teledyne FLIR's Black Hornet 4 Nano-Drone Approves for Defense Innovation Unit's Blue UAS List Teledyne FLIR Defense announced that its Black Hornet® 4 Personal Reconnaissance System has successfully completed the required NDAA and cyber security verification process and been approved for the Blue UAS List with an Authority to Operate. Led by the Defense Innovation Unit (DIU), Blue UAS vets and verifies commercial drone technology for the Department of Defense and U.S. government. The Blue UAS List gives users access to a wide range of drone systems that can meet their diverse needs. In February Teledyne FLIR announced that Black Hornet 4 was selected by DoD operators from among more than 35 uncrewed aerial system (UAS) products, all rigorously tested during DoD's 'Blue UAS Refresh' event. Black Hornet 4 represents the next generation of lightweight nano-drones, able to provide enhanced covert situational awareness to small fighting units. Its 12-megapixel daytime camera and high-resolution thermal imaging deliver crisp video and still images to the operator. At just 70 grams Black Hornet 4 can fly for more than 30 minutes, over three kilometers, and function in 25-knot winds and rain. Flight performance is augmented by advanced obstacle avoidance capabilities and other features. In May, FLIR Defense opened a new 13,000 sq ft facility in Somerset, Kentucky that will function as a major support hub for servicing, testing, and training on Black Hornet systems used by U.S. armed forces. FLIR Defense has delivered more than 33,000 Black Hornet drones to military and security forces in over 45 countries. The U.S. Army began acquiring Black Hornet systems in 2018 for its Soldier Borne Sensor (SBS) program. Since then, it has placed orders under SBS and other contract vehicles totaling more than $300 million. The award-winning Black Hornet is designed and built by Teledyne FLIR Defense in Norway. Annuncio • Apr 23
Teledyne Technologies Incorporated Provides Earnings Guidance for the Second Quarter and Full Year of Fiscal Year 2025 Teledyne Technologies Incorporated provided earnings guidance for the second quarter and full year of fiscal year 2025. Based on its current outlook, the company’s management believes that second quarter 2025 GAAP diluted earnings per share will be in the range of $4.00 to $4.15.
For the full year 2025 GAAP diluted earnings per share will be in the range of $17.35 to $17.83. Annuncio • Apr 14
Teledyne Technologies Incorporated to Report Q1, 2025 Results on Apr 23, 2025 Teledyne Technologies Incorporated announced that they will report Q1, 2025 results Pre-Market on Apr 23, 2025 Annuncio • Mar 24
John Chevedden Files an Exempt Solicitation Statement with Securities and Exchange Commission On March 25, 2025, John Chevedden announced that he has submitted an exempt solicitation statement with Securities and Exchange Commission, recommending the shareholders of Teledyne Technologies Incorporated to vote against the Company nominated board nominee Michael Smith, at the 2025 annual meeting of shareholders. Annuncio • Feb 04
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Optical Systems Business and Advanced Electronic Systems Business of Excelitas Technologies Corp. Teledyne Technologies Incorporated (NYSE:TDY) agreed to acquire Optical Systems Business and Advanced Electronic Systems Business of Excelitas Technologies Corp. for approximately $700 million on November 6, 2024. The transaction is subject to customary closing conditions, including regulatory approvals. The transaction is anticipated to be completed in early 2025. Teledyne management expects the transaction to be accretive to GAAP and non-GAAP earnings per share, excluding transaction costs. Evercore and Harris Williams are acting as financial advisors, and Fried, Frank, Harris, Shriver & Jacobson LLP is acting as legal advisor to Excelitas. McGuireWoods LLP is acting as legal advisor to Teledyne.
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Optical Systems Business and Advanced Electronic Systems Business of Excelitas Technologies Corp. on February 3, 2025. Annuncio • Jan 23
Teledyne Technologies Incorporated, Annual General Meeting, Apr 23, 2025 Teledyne Technologies Incorporated, Annual General Meeting, Apr 23, 2025. Annuncio • Jan 15
Teledyne Technologies Incorporated to Report Q4, 2024 Results on Jan 22, 2025 Teledyne Technologies Incorporated announced that they will report Q4, 2024 results Pre-Market on Jan 22, 2025 Annuncio • Dec 31
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Micropac Industries, Inc. (OTCPK:MPAD) from Zeff Capital L.P., fund managed by Zeff Holding Company, LLC, Robert Hempel and others. Teledyne Technologies Incorporated (NYSE:TDY) entered into a Letter of intent to acquire Micropac Industries, Inc. (OTCPK:MPAD) from Zeff Capital L.P., fund managed by Zeff Holding Company, LLC, Robert Hempel and others for $52.3 million on September 3, 2024. Teledyne Technologies Incorporated (NYSE:TDY) entered into an agreement to acquire Micropac Industries, Inc. (OTCPK:MPAD) from Zeff Capital L.P., fund managed by Zeff Holding Company, LLC, Robert Hempel and others on November 1, 2024. As per of consideration Micropac shareholders will receive $20 for each shares of Micropac. Micropac will pay $1.6 million to Teledyne in case of termination. The transaction is approved by each company board and Micropac Shareholders. The transaction is subject to regulatory approvals. The transaction is expect to close in the fourth quarter of 2024.
Mesirow Financial, Inc. acted as financial and fairness opinion provider to Micropac Industries. Scott E. Westwood of McGuireWoods LLP acted as legal advisor to Teledyne Technologies. Tom D. Harris, Daniel P. Malone, Jr., Susan A. Wetzel, Scott Thompson, Raquel O. Alvarenga and Don Shiman of Haynes and Boone, LLP acted as legal advisors to Micropac Industries.
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Micropac Industries, Inc. (OTCPK:MPAD) from Zeff Capital L.P., fund managed by Zeff Holding Company, LLC, Robert Hempel and others on December 30, 2024. Upon completion of the Merger, the Company was renamed as Teledyne Micropac, Inc. Annuncio • Nov 04
Teledyne Technologies Incorporated (NYSE:TDY) entered into an agreement to acquire Micropac Industries, Inc. (OTCPK:MPAD) for $53 million Teledyne Technologies Incorporated (NYSE:TDY) entered into an agreement to acquire Micropac Industries, Inc. (OTCPK:MPAD) for $53 million on November 1, 2024. As per of consideration Micropac shareholders will receive $20 for each shares of Micropac. Micropac will pay $1.6 million to Teledyne in case of termination. The transaction is approved by each company board and Micropac Shareholders. The transaction is subject to regulatory approvals. The transaction is expect to close in the fourth quarter of 2024.
Mesirow Financial, Inc. acted as financial and fairness opinion provider to Micropac Industries. Scott E. Westwood of McGuireWoods LLP acted as legal advisor to Teledyne Technologies. Tom D. Harris, Daniel P. Malone and Joshua C. Reisman of Haynes and Boone, LLP acted as legal advisor to Micropac Industries. Annuncio • Oct 14
Teledyne Technologies Incorporated to Report Q3, 2024 Results on Oct 23, 2024 Teledyne Technologies Incorporated announced that they will report Q3, 2024 results Pre-Market on Oct 23, 2024 Board Change • Sep 10
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 2 experienced directors. 8 highly experienced directors. Independent Director Vince Morales was the last director to join the board, commencing their role in 2021. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Annuncio • Jun 06
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Adimec Advanced Image Systems B.V. Teledyne Technologies Incorporated (NYSE:TDY) entered into an agreement to acquire Adimec Advanced Image Systems B.V. on February 13, 2024. The closing of the transaction, which is subject to customary conditions and approvals, is anticipated to occur in the first half of 2024. Adimec will be part of the Digital Imaging segment.
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of Adimec Advanced Image Systems B.V. on June 4, 2024. Annuncio • Jan 04
Teledyne Technologies Incorporated (NYSE:TDY) acquired ChartWorld International Ltd. Teledyne Technologies Incorporated (NYSE:TDY) acquired ChartWorld International Ltd. on January 3, 2023.
Teledyne Technologies Incorporated (NYSE:TDY) completed the acquisition of ChartWorld International Ltd. on January 3, 2023.