Annuncio • Feb 26
United Microelectronics Corporation, Annual General Meeting, May 27, 2026 United Microelectronics Corporation, Annual General Meeting, May 27, 2026. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan Annuncio • Feb 24
United Microelectronics Corporation Announces Change of Representative of Juristic-Person Director, Effective February 24, 2026 United Microelectronics Corporation announced a change of representative of juristic-person director for Hsun Chieh Investment Co. Ltd. The previous position holder, SC Chien, served as Director of UMC. The new position holder, Ming Hsu, is Executive Vice President of UMC. The reason for the change is replacement of the representative. The original term is from May 30, 2024 to May 29, 2027. The effective date of the new appointment is February 24, 2026. United Microelectronics Corporation announced the board resolution to convene a 2026 shareholders meeting for United Semiconductor (Xiamen) Co. Ltd. The shareholders meeting date is March 12, 2026. Annuncio • Feb 13
United Microelectronics Corporation to Report Q4, 2025 Results on Feb 25, 2026 United Microelectronics Corporation announced that they will report Q4, 2025 results on Feb 25, 2026 Annuncio • Jan 15
Silicon Storage Technology and United Microelectronics Corporation Announce Immediate Availability of 28nm SuperFlash®? Gen 4 Automotive Grade 1 Platform Silicon Storage Technology®? (SST®?) and United Microelectronics Corporation announced that they have completed full qualification and release to production of SST's embedded SuperFlash®? Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries' 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency. Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node. Key SuperFlash performance and reliability metrics for UMC's 28HPC + ESF4 AG1 platform include: Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40degC to +150degC (Tj); Read access time < 12.5ns; 100K+ endurance cycles; Data retention of > 10 years @ 125degC; Only 1-bit ECC required; Qualification of 32Mb macro at auto grade 1 conditions: Zero bit failures (no ECC applied); Peak yield reached 100%. Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications. Annuncio • Nov 13
Metalenz and United Microelectronics Corporation Bring Breakthrough Face Authentication Solution Polar ID to Mass Production Metalenz and United Microelectronics Corporation announced Metalenz's its breakthrough face authentication solution, Polar ID, is now ready for mass production through UMC. Polar ID is a compact, polarization-based biometric solution that leverages Metalenz's metasurface technology to bring payment-grade security and advanced sensing capabilities to any device, even the most challenging of form factors. UMC manufactures the meta-optic layer using its 40nm process and achieves sensor integration utilizing its wafer-on-wafer bonding technology. Leveraging UMC's 300mm wafer manufacturing capabilities, as well as the qualification of this supply chain, Metalenz is ready to ramp into volume positioning Polar ID for widespread adoption across consumer electronics, mobile, and IoT platforms. With demand for secure and convenient biometrics rapidly expanding across consumer devices and IoT, Polar ID delivers secure face authentication in the smallest, simple form factor, making advanced sensing accessible beyond premium tiers and in places it wasn't previously possible. UMC's state-of-the art 12-inch facilities and comprehensive portfolio of semiconductor manufacturing process technologies have made the foundry partner of choice for some of the most advanced fabless semiconductor companies in the world. Annuncio • Oct 22
UMC Introduces 55Nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications United Microelectronics Corporation announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs. Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC's new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications: Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices. Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments. Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage. The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities. UMC now offers one of the industry's most comprehensive and mature BCD portfolios, spanning process nodes from 0.35um, 0.25um, 0.18um, and 0.11um down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers' technology roadmaps and enhance their product competitiveness. Annuncio • Jun 04
United Microelectronics Corporation Announces Cash Dividend, Payable on July 16, 2025 United Microelectronics Corporation at its board meeting held on June 04, 2025 resolved to adjust cash dividend ratio. Type and monetary amount of original dividend distribution: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85. Type and monetary amount of dividend distribution after the change: Cash dividend TWD 35,787,597,878, each common share is entitled to receive TWD 2.85016443. Reason for the change: Due to the recall of RSA, the number of outstanding common shares changed accordingly, resulting in the adjustment of cash dividend ratio. Ex-rights (ex-dividend) trading date: June 24, 2025; Ex-rights (ex-dividend) record date: June 30, 2025; Payment date of common stock cash dividend distribution: July 16, 2025. Annuncio • May 01
United Microelectronics Corporation to Report Q4, 2025 Results on Jan 28, 2026 United Microelectronics Corporation announced that they will report Q4, 2025 results on Jan 28, 2026 Annuncio • Apr 02
GlobalFoundries, United Microelectronics Reportedly Consider Merger Taiwan's major chipmaker United Microelectronics Corporation (TWSE:2303) and U.S.-based GlobalFoundries Inc. (NasdaqGS:GFS) are looking into the possibility of a merger, two sources familiar with the matter told Reuters on March 31, 2025. A combined company would establish a larger U.S.-based firm with a global manufacturing footprint spanning Asia, the United States and Europe. The potential deal comes as the U.S. seeks to strengthen its semiconductor supply chain amid rising geopolitical tensions in the Taiwan Strait and increasing competition from China in the mature chip market. The merged company would prioritize research and development investments in the U.S. and could possibly emerge as a viable alternative to Taiwan Semiconductor Manufacturing Co (2330.TW), the world's leading chipmaker. UMC said the "company policy is not to comment on market rumours", while GlobalFoundries did not immediately respond to a Reuters' request for comment. Annuncio • Feb 27
United Microelectronics Corporation, Annual General Meeting, May 28, 2025 United Microelectronics Corporation, Annual General Meeting, May 28, 2025. Location: no,16, yen hsin 1st rd., hsinchu science park, hsinchu county Taiwan Annuncio • Feb 19
United Microelectronics Corporation to Report Fiscal Year 2024 Results on Feb 26, 2025 United Microelectronics Corporation announced that they will report fiscal year 2024 results on Feb 26, 2025 Annuncio • Dec 20
Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million. Pentamaster Corporation Berhad (KLSE:PENTA), Chen Chu-Wan, Chen Hsin-Yu, Chen Hsin-Tso, MediaTek Inc. (TWSE:2454) and United Microelectronics Corporation (TWSE:2303) agreed to acquire 36.10% stake in Pentamaster International Limited (SEHK:1665) for approximately HKD 810 million on December 19, 2024. A cash consideration valued at HKD 0.93 per share will be paid by Pentamaster Corporation Berhad, MediaTek Inc. and United Microelectronics Corporation. As part of consideration, HKD 805.8 million is paid towards common equity of Pentamaster International Limited. The transaction will be funded using internal resources. Upon completion, Pentamaster Corporation Berhad will own 71% stake in Pentamaster International Limited. The transaction is subject to approval by regulatory board / committee, approval of offer by target shareholders, subject to court approval and subject to statutory approval. The expected completion of the transaction is June 19, 2025. Altus Capital Limited acted as financial advisor for Pentamaster International Limited. Annuncio • Oct 08
United Microelectronics Corporation to Report Q4, 2024 Results on Jan 21, 2025 United Microelectronics Corporation announced that they will report Q4, 2024 results on Jan 21, 2025 Annuncio • Jun 13
United Microelectronics Corporation Announces Cash Dividend, Payable on July 24, 2024 United Microelectronics Corporation announced cash dividend of TWD 37,587,101,925, each common share is entitled to receive TWD 3.00011747. Ex-rights (ex-dividend) trading date is 2 July 2024. Ex-rights (ex-dividend) record date is July 8, 2024; Payment date of cash dividend distribution is July 24, 2024. Annuncio • May 03
UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era United Microelectronics Corporation announced the industry’s first 3D IC solution for RFSOI technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G. As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company’s 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data – in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production. UMC offers the most comprehensive RF front-end module IC solutions in the industry, catering to a broad range of applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With over 500 product tape-outs completed and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI solutions are available in 8-inch and 12-inch wafers, as well as in a variety of technology nodes from 130nm to 40nm. In addition to RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics Corporation) offers compound semiconductor technologies gallium arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to supplement the needs of RF-FEM applications. Annuncio • Feb 29
United Microelectronics Corporation Approves Cash Dividend for the Year Ended December 31, 2023 United Microelectronics Corporation announced that at its board meeting held on February 27, 2024, approved cash dividend for the year ended December 31, 2023 of TWD 3.00 per share. Total amount of cash distributed to shareholders is TWD 37,587,101,925. Annuncio • Feb 28
United Microelectronics Corporation, Annual General Meeting, May 30, 2024 United Microelectronics Corporation, Annual General Meeting, May 30, 2024, at 09:00 Taipei Standard Time. Location: No. 16, Creation Rd. 1, Hsinchu Science Park Hsinchu City Taiwan Agenda: To consider 2023 business report; to consider audit Committee's report of the 2023 audited financial reports; to consider 2023 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; and to consider other matters. Annuncio • Oct 13
United Microelectronics Corporation to Report Q4, 2023 Results on Jan 31, 2024 United Microelectronics Corporation announced that they will report Q4, 2023 results on Jan 31, 2024 Annuncio • Jun 28
Metalenz Launches Its Metasurface Optics on the Open Market in Partnership with UMC Metalenz announced it has partnered with United Microelectronics Corporation ("UMC") to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. The announcement marks the launch of metasurface optics on the open market for the first time and follows multiple design wins for Metalenz with leading OEMs in Asia. The partnership between Metalenz and UMC is expected to yield significant benefits for both companies and their customers. Metalenz's meta-optic technology has the potential to revolutionize the field of optics, enabling the design of smaller, lighter, and more efficient optical systems. With the manufacturing capabilities provided by UMC, Metalenz will be able to accelerate the development of its meta-optic products and bring them to market more quickly as a direct supplier to OEMs. The first designs to go through the newly established supply chain will be for Chinese OEM DiluSense. Annuncio • Jun 08
United Microelectronics Corporation Announces Cash Dividend, Payable on July 19, 2023 United Microelectronics Corporation announced cash dividend of TWD 45,017,096,342, each common share is entitled to receive TWD 3.60046348. Ex-rights (ex-dividend) trading date is June 27, 2023; Ex-rights (ex-dividend) record date is July 03, 2023; Payment date of cash dividend distribution is July 19, 2023. Annuncio • Jan 12
United Microelectronics Corporation Announces Change of Chief Information Security Officer United Microelectronics Corporation appointed TS Wu, Vice President in place of S S Hong, Vice President as the new Chief Information Security Officer, effective from January 11, 2023. Annuncio • Dec 07
United Microelectronics Corporation to Report Q4, 2022 Results on Jan 16, 2023 United Microelectronics Corporation announced that they will report Q4, 2022 results at 1:30 PM, Taipei Standard Time on Jan 16, 2023 Annuncio • Dec 01
An unknown buyer acquired a 0.108957% stake in United Microelectronics Corporation from Silicon Integrated Systems Corp. for approximately TWD 600 million. An unknown buyer acquired a 0.108957% stake in United Microelectronics Corporation from Silicon Integrated Systems Corp. for approximately TWD 600 million on November 29, 2022.
An unknown buyer completed the acquisition of a 0.108957% stake in United Microelectronics Corporation from Silicon Integrated Systems Corp. on November 29, 2022. Annuncio • Apr 08
United Microelectronics Corporation to Report Q1, 2022 Results on Apr 27, 2022 United Microelectronics Corporation announced that they will report Q1, 2022 results on Apr 27, 2022 Annuncio • Feb 25
United Microelectronics Corporation, Annual General Meeting, May 27, 2022 United Microelectronics Corporation, Annual General Meeting, May 27, 2022, at 09:00 Taipei Standard Time. Location: No.2-1, Hsin-Ann Rd., Hsinchu Science Park Auditorium of Hsinchu Science Park Bureau Hsinchu City Taiwan Agenda: To consider 2021 business report; to consider Audit Committee’s report of the 2021 audited financial reports; to consider 2021 distributable compensation for employees and directors; to consider the issuance of the corporate bonds; to consider the Company’s 2021 business report and financial statements; to consider the Company’s 2021 earnings distribution; to propose the cash distribution from capital surplus; to propose the issuance of Restricted Stock Awards; and to amend the Company’s “Acquisition or Disposal of Assets Procedure”. Annuncio • Nov 27
United Microelectronics Corporation and Micron Technology, Inc. Announce Global Settlement United Microelectronics Corporation and Micron Technology, Inc. announced a settlement agreement between the two companies worldwide. The companies will globally withdraw their complaints against the other party, and UMC will make a one-time payment of an undisclosed amount to Micron. UMC and Micron look forward to engaging in mutual business cooperation opportunities. Annuncio • Jul 15
Cadence and Umc Collaborate on 22Ulp/Ull Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs Cadence Design Systems Inc. and United Microelectronics Corporation announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. Annuncio • May 05
The United States District Court Southern District of New York Approves the Settlement of the Class Action Between the Plaintiff Kevin D. Meyer and United Microelectronics Corporation The United States District Court Southern District of New York approved the settlement of the class action between the plaintiff Kevin D. Meyer and UMC. Due to the lawsuit filed previously by US DOJ pursuant to the US laws against United Microelectronics Corporation, it is derived therefrom that the plaintiff, Kevin D. Meyer, individually and on behalf of all other similarly situated, filed a class action with the United States District Court Southern District of New York against the Company and certain of senior officials on the count of violation of Securities Exchange Act of 1934 and Rule 10b-5 promulgated thereunder. The court approved the settlement reached between the plaintiffs and the defendants on May 3, 2021 EST. According to the court approved settlement, UMC shall pay three million US dollars (USD 3,000,000) as the settlement fund to be allocated to the class plaintiffs and reimbursed of the expenses and class counsel fees.
There is no material effect on finances and business. Annuncio • Mar 25
United Microelectronics Corporation announced that it has received TWD 379.04 million in funding from CMC Magnetics Corporation On March 24, 2021, United Microelectronics Corporation (TSEC:2303) closed the transaction. Annuncio • Mar 10
United Microelectronics Corporation announced that it has received TWD 403.26 million in funding from CMC Magnetics Corporation On March 8, 2021, United Microelectronics Corporation (TSEC:2303) closed the transaction. Annuncio • Feb 26
United Microelectronics Corporation announced a financing transaction United Microelectronics Corporation (TSEC:2303) announced a private placement of not more than 1,380,266,832 common shares on February 24, 2021. The price will be determined by the board of directors of the company after authorization from the annual general meeting of the company. The price per share shall be no less than 80 percent of the reference price. The reference price shall be the higher of the following two calculations: (i) The average closing price of the common shares from either 1, 3, or 5 business days before the pricing date, minus dividends adjustment, plus price discount adjustment due to capital reduction. (ii) The average closing price of the common shares for a period of thirty business days before the pricing date, minus dividends adjustment, plus price discount adjustment due to capital reduction. The shares will have a hold period of 3 years. Annuncio • Feb 25
United Microelectronics Corporation, Annual General Meeting, Jun 08, 2021 United Microelectronics Corporation, Annual General Meeting, Jun 08, 2021, at 09:00 Taipei Standard Time. Location: No. 2, Prosperity 1st Rd., Hsinchu Science Hsinchu City Taiwan Agenda: To consider and approve the proposal of a private placement plan to fulfill operational needs. Annuncio • Jan 28
United Microelectronics Corporation announced that it has received TWD 312.33272 million in funding from CMC Magnetics Corporation On January 27, 2021, United Microelectronics Corporation (TSEC:2303) closed the transaction. Annuncio • Jan 14
United Microelectronics Corporation to Report Q1, 2021 Results on Apr 28, 2021 United Microelectronics Corporation announced that they will report Q1, 2021 results on Apr 28, 2021 Annuncio • Jan 06
United Microelectronics Corporation announced that it has received TWD 359.667 million in funding from CMC Magnetics Corporation On January 5, 2021, United Microelectronics Corporation (TSEC:2303) closed the transaction. Annuncio • Dec 11
United Microelectronics Corporation announced that it has received TWD 300.43262 million in funding from CMC Magnetics Corporation On December 9, 2020, United Microelectronics Corporation (TSEC:2303) closed the transaction. Annuncio • Nov 22
Toshiba Reportedly Considering Selling 2 Domestic Chip Plants Toshiba Corporation (TSE:6502) is considering selling two domestic semiconductor plants as part of its structural reform measures for its chip business, it was learned on November 19, 2020. Companies, such as United Microelectronics Corporation (TSEC:2303), are showing interest in buying the factories, informed sources said. If the plants are sold, Toshiba would likely consider outsourcing chip production to the facilities, according to the sources. No decision has been made on the two plants' sales, Toshiba said, indicating that there could be options other than selling them. As part of the chip business reform, Toshiba in September(2020) announced a decision to pull the plug on its system large scale integration business, which has been struggling to generate profits. Annuncio • Nov 10
United Microelectronics Corporation Announces Demise of Chung Laung Liu, Director United Microelectronics Corporation announced demise of Chung Laung Liu, director of the company. Annuncio • Oct 15
United Microelectronics Corporation to Report Q4, 2020 Results on Jan 27, 2021 United Microelectronics Corporation announced that they will report Q4, 2020 results at 9:20 AM, GMT Standard Time on Jan 27, 2021