Salud financiera de hoja de balance de China Wafer Level CSP
Salud financiera controles de criterios 5/6
China Wafer Level CSP has a total shareholder equity of CN¥4.3B and total debt of CN¥33.5M, which brings its debt-to-equity ratio to 0.8%. Its total assets and total liabilities are CN¥4.7B and CN¥418.2M respectively. China Wafer Level CSP's EBIT is CN¥193.1M making its interest coverage ratio -50.5. It has cash and short-term investments of CN¥2.4B.
Información clave
0.8%
Ratio deuda-patrimonio
CN¥33.50m
Deuda
| Ratio de cobertura de intereses | -50.5x |
| Efectivo | CN¥2.42b |
| Patrimonio | CN¥4.26b |
| Total pasivo | CN¥418.19m |
| Activos totales | CN¥4.68b |
Actualizaciones recientes sobre salud financiera
No hay actualizaciones
Recent updates
Análisis de la situación financiera
Pasivos a corto plazo: 603005's short term assets (CN¥2.7B) exceed its short term liabilities (CN¥325.3M).
Pasivo a largo plazo: 603005's short term assets (CN¥2.7B) exceed its long term liabilities (CN¥92.9M).
Historial y análisis de deuda-patrimonio
Nivel de deuda: 603005 has more cash than its total debt.
Reducción de la deuda: 603005's debt to equity ratio has increased from 0% to 0.8% over the past 5 years.
Cobertura de la deuda: 603005's debt is well covered by operating cash flow (987.4%).
Cobertura de intereses: 603005 earns more interest than it pays, so coverage of interest payments is not a concern.