Board Change • May 02
Insufficient new directors There is 1 new director who has joined the board in the last 3 years. The company's board is composed of: 1 new director. 3 experienced directors. 8 highly experienced directors. Independent Director Reginald DesRoches was the last director to join the board, commencing their role in 2024. The company’s insufficient board refreshment is considered a risk according to the Simply Wall St Risk Model. Recent Insider Transactions • Apr 29
Independent Director recently sold €3.6m worth of stock On the 24th of April, Mark Blinn sold around 15k shares on-market at roughly €237 per share. This transaction amounted to 100% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of €9.7m more than they bought in the last 12 months. Buy Or Sell Opportunity • Apr 24
Now 42% overvalued after recent price rise Over the last 90 days, the stock has risen 46% to €240. The fair value is estimated to be €169, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 2.5% over the last 3 years. Earnings per share has declined by 17%. For the next 3 years, revenue is forecast to grow by 10% per annum. Earnings are also forecast to grow by 15% per annum over the same time period. Reported Earnings • Apr 23
First quarter 2026 earnings released: EPS: US$1.70 (vs US$1.29 in 1Q 2025) First quarter 2026 results: EPS: US$1.70 (up from US$1.29 in 1Q 2025). Revenue: US$4.83b (up 19% from 1Q 2025). Net income: US$1.55b (up 32% from 1Q 2025). Profit margin: 32% (up from 29% in 1Q 2025). The increase in margin was driven by higher revenue. Revenue is forecast to grow 10% p.a. on average during the next 3 years, compared to a 13% growth forecast for the Semiconductor industry in Europe. Over the last 3 years on average, earnings per share has fallen by 17% per year but the company’s share price has increased by 17% per year, which means it is well ahead of earnings. Declared Dividend • Apr 20
Fourth quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 4th May 2026 Payment date: 19th May 2026 Dividend yield will be 2.6%, which is higher than the industry average of 1.2%. Sustainability & Growth Dividend is not covered by earnings (101% earnings payout ratio) nor is it covered by cash flows (199% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 12% to bring the payout ratio under control. EPS is expected to grow by 50% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Bekanntmachung • Apr 17
Texas Instruments Incorporated Declares A Quarterly Cash Dividend on Common Stock for Second Quarter 2026, Payable May 19, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock for second quarter 2026, payable May 19, 2026, to stockholders of record on May 5, 2026. Buy Or Sell Opportunity • Apr 07
Now 21% overvalued after recent price rise Over the last 90 days, the stock has risen 6.1% to €170. The fair value is estimated to be €141, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 5.7% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.3% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Bekanntmachung • Mar 23
Texas Instruments Incorporated Unveils High-Performance Isolated Power Modules with Isoshield Technology Texas Instruments Incorporated unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas. IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 power modules with optimized packages, these new devices help engineers maximize power density while reducing material costs and design time in any power application. TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation. Power density innovations are nowhere more critical than in today's evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI's IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world's digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance. For decades, TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages, TI's semiconductors empower engineers to maximize performance in any power design or application. In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C applications, including an 800V to 6V DC/DC power distribution board. This design features TI's portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors. Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available. Part number Package size Voltage UCC34141-Q1 5.85mm ? 7.5mm ? 2.6mm Mid voltage (6V-20V) UCC33420 4mm ? 5mm ? 1mm Low voltage (5V). Bekanntmachung • Mar 17
Texas Instruments Unveils Complete 800 VDC Power Architecture For Future Generation AI Data Centers With NVIDIA Texas Instruments unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centers built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage systems in AI data centers. TI has developed a complete 800 VDC power solution for future generation AI data centers with NVIDIA. As part of this collaboration, TI is demonstrating a power architecture requiring only two conversion stages from 800V to processor power. TI's 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data center operations. TI's breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design. Buy Or Sell Opportunity • Mar 11
Now 20% overvalued after recent price rise Over the last 90 days, the stock has risen 12% to €172. The fair value is estimated to be €144, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 5.7% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.3% per annum. Earnings are also forecast to grow by 14% per annum over the same time period. Bekanntmachung • Mar 10
Texas Instruments Introduces Two New Microcontroller Families with Edge Artificial Intelligence Capabilities Texas Instruments introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate Texas Instruments' TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge. Texas Instruments' integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per inference than similar MCUs without an accelerator. New general-purpose and real-time MCUs from Texas Instruments include the TinyEngine NPU to enable more efficient edge AI in any application, from simple to complex systems. With integrated generative AI in Texas Instruments' CCStudio IDE and more than 60 models and application examples in CCStudio Edge AI Studio, developers can quickly and easily add edge AI to any device. Texas Instruments' embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with Texas Instruments data. Texas Instruments is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. The MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications. With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration minimizes the flash memory footprint, lowers latency by up to 90 times per AI inference, and reduces energy utilization by more than 120 times per AI inference. Such levels of efficiency allow resource-constrained devices – including portable, battery-powered products – to process AI workloads. At under USD 1 in 1,000-unit quantities, the MSPM0G5187 MCU reduces system and operating costs by offering an affordable alternative to other MCU or processor architectures. Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. Texas Instruments' new AM13Ex MCUs are the industry's first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip. This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include the ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimization, and an integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance. Both MCU families are supported by Texas Instruments' CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across Texas Instruments' embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on Texas Instruments MCUs through either hardware or software implementations. There are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future. Production quantities of the MSPM0G5187 MCU are available for purchase, with the AM13E23019 MCU available in preproduction quantities. Additional package and memory variants will be released by the end of 2026. Multiple payment and shipping options are available. Bekanntmachung • Mar 05
Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026 Texas Instruments Incorporated, Annual General Meeting, Apr 16, 2026. Location: 12500 ti boulevard, texas, dallas United States Recent Insider Transactions • Feb 13
Insider recently sold €1.9m worth of stock On the 10th of February, Mark Gary sold around 10k shares on-market at roughly €186 per share. This transaction amounted to 18% of their direct individual holding at the time of the trade. This was the largest sale by an insider in the last 3 months. Insiders have been net sellers, collectively disposing of €4.6m more than they bought in the last 12 months. Valuation Update With 7 Day Price Move • Feb 03
Investor sentiment improves as stock rises 16% After last week's 16% share price gain to €192, the stock trades at a forward P/E ratio of 35x. Average forward P/E is 25x in the Semiconductor industry in Europe. Total returns to shareholders of 25% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €148 per share. Bekanntmachung • Jan 29
Texas Instruments Incorporated Provides Earnings Guidance for the First Quarter of 2026 Texas Instruments Incorporated provided earnings guidance for the first quarter of 2026. for the quarter, the company expects revenue in the range of $4.32 billion to $4.68 billion and earnings per share between $1.22 and $1.48. Reported Earnings • Jan 28
Full year 2025 earnings released: EPS: US$5.50 (vs US$5.24 in FY 2024) Full year 2025 results: EPS: US$5.50 (up from US$5.24 in FY 2024). Revenue: US$17.7b (up 13% from FY 2024). Net income: US$5.00b (up 4.7% from FY 2024). Profit margin: 28% (down from 31% in FY 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 8.8% p.a. on average during the next 3 years, compared to a 11% growth forecast for the Semiconductor industry in Europe. Over the last 3 years on average, earnings per share has fallen by 22% per year but the company’s share price has increased by 3% per year, which means it is well ahead of earnings. Declared Dividend • Jan 19
Third quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 29th January 2026 Payment date: 10th February 2026 Dividend yield will be 3.0%, which is higher than the industry average of 1.2%. Sustainability & Growth Dividend is not adequately covered by earnings (99% earnings payout ratio) nor is it covered by cash flows (248% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 9.6% to bring the payout ratio under control. EPS is expected to grow by 46% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Bekanntmachung • Jan 16
Texas Instruments Incorporated Declares First Quarter 2026 Dividend, Payable on February 10, 2026 The board of directors of Texas Instruments Incorporated declared a quarterly cash dividend of $1.42 per share of common stock, payable February 10, 2026, to stockholders of record on January 30, 2026. Bekanntmachung • Jan 05
Texas Instruments Introduces New Automotive Semiconductors and Development Resources to Enhance Safety and Autonomous Vehicles Texas Instruments introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI's scalable TDA5 high-performance computing system-on-a-chip (SoC) family offers power- and safety-optimized processing and edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy. High-performance compute SoCs enable safe, scalable AI across vehicle models. To enhance safety and autonomy in next-generation vehicles, automakers are adopting central computing systems that support AI and sensor fusion for real-time decision-making. Designed for high-performance computing, TI's TDA5 SoCs family offers edge AI acceleration from 10 trillion operations per second (TOPS) to 1200 TOPS with power efficiency beyond 24 TOPS/W. This scalability, enabled by their chiplet-ready design with Universal Chiplet Interconnect Express interface technology, allows designers to implement different feature sets and support up to Level 3 autonomous driving using a single portfolio. Building on over two decades of experience in automotive processing, the family expands the performance of TI's existing portfolio to enable automakers to centralize their computing architectures and process advanced AI models. By integrating the latest generation of TI's C7™? neural processing unit (NPU), TDA5 SoCs provide up to 12 times the AI computing of previous generations with similar power consumption, eliminating the need for costly thermal solutions. This performance supports billions of parameters within language models and transformer networks, increasing in-vehicle intelligence while maintaining cross-domain functionality. The family features the latest Arm®? Cortex®?-A720AE cores, allowing automakers to integrate more safety, security and computing applications. TDA5 SoCs reduce system complexity and costs by supporting cross-domain fusion of ADAS, in-vehicle infotainment and gateway systems within a single chip. Their safety-first architecture further simplifies systems by helping automakers meet Automotive Safety Integrity Level D safety standards without external components. The transceiver supports both satellite and edge architectures, offering automakers the flexibility to simplify and accelerate the global deployment of ADAS features across entry-level to premium vehicles. The AWR2188 features enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions. This level of performance powers advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles and identifying objects in high-dynamic-range scenarios. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture. TI's newDP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, reliability and Power over Data Line capabilities. These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs. With TI's end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models. Reported Earnings • Oct 22
Third quarter 2025 earnings released: EPS: US$1.50 (vs US$1.48 in 3Q 2024) Third quarter 2025 results: EPS: US$1.50 (up from US$1.48 in 3Q 2024). Revenue: US$4.74b (up 14% from 3Q 2024). Net income: US$1.36b (flat on 3Q 2024). Profit margin: 29% (down from 33% in 3Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 8.3% p.a. on average during the next 3 years, compared to a 8.9% growth forecast for the Semiconductor industry in Europe. Over the last 3 years on average, earnings per share has fallen by 24% per year but the company’s share price has only fallen by 2% per year, which means it has not declined as severely as earnings. Bekanntmachung • Oct 22
Texas Instruments Incorporated Provides Earnings Guidance for the Fourth Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the fourth quarter of 2025. For the quarter, the company expects revenue in the range of $4.22 billion to $4.58 billion and earnings per share between $1.13 and $1.39. Declared Dividend • Oct 20
Second quarter dividend of US$1.42 announced Shareholders will receive a dividend of US$1.42. Ex-date: 30th October 2025 Payment date: 12th November 2025 Dividend yield will be 3.4%, which is higher than the industry average of 1.2%. Sustainability & Growth Dividend is not adequately covered by earnings (98% earnings payout ratio) nor is it covered by cash flows (329% cash payout ratio). The dividend has increased by an average of 15% per year over the past 10 years and has been stable with no material reductions to payments, indicating a long track record of dividend growth and stability. The company's earnings per share (EPS) would need to grow by 8.6% to bring the payout ratio under control. EPS is expected to grow by 43% over the next 3 years, which is sufficient to bring the dividend into a sustainable range. Bekanntmachung • Oct 17
Texas Instruments Incorporated Announces Board Changes On October 16, 2025, Richard K. Templeton notified the Board of Directors of Texas Instruments Incorporated that he will retire as executive chairman and as a member of the Board on December 31, 2025. The Board has appointed Haviv Ilan, the Company’s president and chief executive officer, as the Company’s new chairman, effective on Mr. Templeton’s retirement. Beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company. Ilan has been a member of the board of directors since 2021 and TI’s president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI’s analog and embedded processing businesses during his 26-year career at the company. Bekanntmachung • Oct 15
Renesas Reportedly Explores Sale of Timing Unit Renesas Electronics Corporation (TSE:6723) is working with bankers at JPMorgan to explore the potential sale of its timing division in a deal that could value the business at close to $2 billion, Reuters' Milana Vinn reported. According to people familiar with the matter, Texas Instruments Incorporated (NasdaqGS:TXN) and Infineon Technologies AG (XTRA:IFX) are among the potential buyers of the unit. Bekanntmachung • Sep 19
Texas Instruments Incorporated Raises Quarterly Cash Dividend, Payable on November 12, 2025 Texas Instruments Incorporated (TI) announced it will raise its quarterly cash dividend 4%, from $1.36 per share to $1.42, or $5.68 annualized. The higher dividend will be payable November 12, 2025, to stockholders of record on October 31, 2025, contingent upon formal declaration by the board of directors at its regular meeting in October. Buy Or Sell Opportunity • Jul 28
Now 22% overvalued after recent price rise Over the last 90 days, the stock has risen 32% to €163. The fair value is estimated to be €133, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 9.1% over the last 3 years. Earnings per share has declined by 24%. For the next 3 years, revenue is forecast to grow by 9.1% per annum. Earnings are also forecast to grow by 13% per annum over the same time period. Reported Earnings • Jul 23
Second quarter 2025 earnings released: EPS: US$1.43 (vs US$1.23 in 2Q 2024) Second quarter 2025 results: EPS: US$1.43 (up from US$1.23 in 2Q 2024). Revenue: US$4.45b (up 16% from 2Q 2024). Net income: US$1.30b (up 16% from 2Q 2024). Profit margin: 29% (in line with 2Q 2024). Revenue is forecast to grow 9.1% p.a. on average during the next 3 years, compared to a 8.4% growth forecast for the Semiconductor industry in Europe. Over the last 3 years on average, earnings per share has fallen by 24% per year but the company’s share price has only fallen by 1% per year, which means it has not declined as severely as earnings. Bekanntmachung • Jul 23
Texas Instruments Incorporated Provides Earnings Guidance for the Third Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the third quarter of 2025. For the quarter company expects revenue in the range of $4.45 billion to $4.80 billion and earnings per share between $1.36 and $1.60. Bekanntmachung • Jul 18
Texas Instruments Incorporated Declares Cash Dividend for the Third Quarter of 2025, Payable on August 12, 2025 Texas Instruments Incorporated's board of directors declared a quarterly cash dividend of $1.36 per share of common stock for the third quarter of 2025, payable August 12, 2025, to stockholders of record on July 31, 2025. Bekanntmachung • Jun 28
Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Texas Instruments Incorporated(NasdaqGS:TXN) dropped from Russell Top 50 Index Valuation Update With 7 Day Price Move • May 12
Investor sentiment improves as stock rises 17% After last week's 17% share price gain to €168, the stock trades at a forward P/E ratio of 32x. Average forward P/E is 15x in the Semiconductor industry in Europe. Total returns to shareholders of 13% over the past three years. Simply Wall St's valuation model estimates the intrinsic value at €137 per share. Buy Or Sell Opportunity • May 12
Now 23% overvalued Over the last 90 days, the stock has fallen 3.5% to €168. The fair value is estimated to be €137, however this is not to be taken as a sell recommendation but rather should be used as a guide only. Revenue has declined by 9.0% over the last 3 years. Earnings per share has declined by 22%. For the next 3 years, revenue is forecast to grow by 9.4% per annum. Earnings are also forecast to grow by 13% per annum over the same time period. Reported Earnings • Apr 24
First quarter 2025 earnings released: EPS: US$1.30 (vs US$1.21 in 1Q 2024) First quarter 2025 results: EPS: US$1.30 (up from US$1.21 in 1Q 2024). Revenue: US$4.07b (up 11% from 1Q 2024). Net income: US$1.18b (up 7.2% from 1Q 2024). Profit margin: 29% (down from 30% in 1Q 2024). The decrease in margin was driven by higher expenses. Revenue is forecast to grow 9.7% p.a. on average during the next 3 years, compared to a 9.4% growth forecast for the Semiconductor industry in Europe. Over the last 3 years on average, earnings per share has fallen by 22% per year but the company’s share price has only fallen by 5% per year, which means it has not declined as severely as earnings. Bekanntmachung • Apr 24
Texas Instruments Incorporated Provides Earnings Guidance for the Second Quarter of 2025 Texas Instruments Incorporated provided earnings guidance for the second quarter of 2025. The company’s second quarter outlook is for revenue in the range of $4.17 billion to $4.53 billion and earnings per share between $1.21 and $1.47. Bekanntmachung • Apr 18
Texas Instruments Board Declares Second Quarter 2025 Dividend, Payable on May 13, 2025 The board of directors of Texas Instruments Incorporated declared a Second Quarter 2025 cash dividend of $1.36 per share of common stock, payable May 13, 2025, to stockholders of record on April 30, 2025. Bekanntmachung • Apr 15
Texas Instruments Introduces New Portfolio of Automotive Lidar, Time and Radar Chips Texas Instruments introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities. Real-time decision-making with 30% longer distance measurements. A crucial technology for the future of safe autonomous vehicles, lidar provides a detailed 3D map of the driver's surroundings. This integration also supports an average 30% reduction in system costs while reducing solution size by four times, empowering design engineers to discretely mount compact, affordable lidar modules in more areas and across more vehicle models As lidar technology reaches higher output currents, vast variations in pulse duration over temperature make it challenging to meet eye safety standards. TI's LMH13000 laser driver provides up to 5A of adjustable output current with only 2% variation across its -40C to 125C ambient temperature range, compared to discrete solutions that can have up to 30% variation. The device's short pulse-width generation and current control enable the system to meet Class 1 U.S. Food and Drug Administration eye safety standards. Electronics in ADAS and in-vehicle infotainment systems must work reliably while facing temperature fluctuations, fluctuations and electromagnetic interference. With TI's BAW technology benefits, the new CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators increase reliability by 100 times compared to traditional quartz-based clocks, with a failure-in-time rate of 0.3. Enhanced clocking precision and resilience in harsh conditions enable safer operation, cleaner data communication, and higher-speed data processing across next-generation vehicle subsystems. Additionally, the company unveiled a new front and corner radar sensor, the AWR2944P, building on TI's widely adopted AWR2944 platform. The new radar sensor's enhancements improve vehicle safety by extending detection range, improving angular accuracy, and enabling more sophisticated processing algorithms. Key enhancements include: An improved signal-to-noise ratio. A larger memory capacity. An integrated radar hardware accelerator that allows the microcontroller and digital signal processor to execute machine learning for edge artificial intelligence applications. TI's new automotive lidar, clock and Radar solutions build on the company's commitment to helping engineers design adaptable ADAS for a safer, more automated driving experience. Package, availability and pricing. Pre production quantities of the LMH13000, CDC6C-Q1, CDC6C-Q 1, LMK3H0102 -Q1, LMK3H0105-Q1 and LMK 3C0105-Q1. 
