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Taiwan Semiconductor Manufacturing

TSMC will drive future growth with CoWoS packaging and N2 rollout

Catalysts Are there any products or services that could move sales or earnings meaningfully? The meat moving the needle right now is CoWoS packaging.Read more

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US$450
17.6% undervalued intrinsic discount
Fair Value
Revenue
66.15% p.a.
Profit Margin
45.1%
Future PE
28.91x
Price in 2031
US$770.05