SENKO Group Holdings Dividend
Dividend criteria checks 5/6
SENKO Group Holdings is a dividend paying company with a current yield of 3.65% that is well covered by earnings. Next payment date is on 4th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
3.6%
Dividend yield
36%
Payout ratio
Industry average yield | 3.2% |
Next dividend pay date | 04 Dec 24 |
Ex dividend date | 27 Sep 24 |
Dividend per share | JP¥42.000 |
Earnings per share | JP¥106.70 |
Dividend yield forecast in 3Y | 4.9% |
Recent dividend updates
Upcoming Dividend Payment
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 9069's dividends per share have been stable in the past 10 years.
Growing Dividend: 9069's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
SENKO Group Holdings Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (9069) | 3.6% |
Market Bottom 25% (JP) | 1.7% |
Market Top 25% (JP) | 3.5% |
Industry Average (Logistics) | 3.2% |
Analyst forecast in 3 Years (9069) | 4.9% |
Notable Dividend: 9069's dividend (3.65%) is higher than the bottom 25% of dividend payers in the JP market (1.74%).
High Dividend: 9069's dividend (3.65%) is in the top 25% of dividend payers in the JP market (3.52%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (35.8%), 9069's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (623.2%), 9069's dividend payments are not well covered by cash flows.