Seika Dividend
Dividend criteria checks 4/6
Seika is a dividend paying company with a current yield of 4.5% that is well covered by earnings. Next payment date is on 11th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
4.5%
Dividend yield
24%
Payout ratio
Industry average yield | 3.2% |
Next dividend pay date | 11 Dec 24 |
Ex dividend date | 27 Sep 24 |
Dividend per share | JP¥180.000 |
Earnings per share | JP¥633.33 |
Dividend yield forecast | n/a |
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 8061's dividend payments have been volatile in the past 10 years.
Growing Dividend: 8061's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
Seika Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (8061) | 4.5% |
Market Bottom 25% (JP) | 1.8% |
Market Top 25% (JP) | 3.8% |
Industry Average (Trade Distributors) | 3.2% |
Analyst forecast (8061) (up to 3 years) | n/a |
Notable Dividend: 8061's dividend (4.5%) is higher than the bottom 25% of dividend payers in the JP market (1.79%).
High Dividend: 8061's dividend (4.5%) is in the top 25% of dividend payers in the JP market (3.77%)
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (23.7%), 8061's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (114.3%), 8061's dividend payments are not well covered by cash flows.