Announcement • Jul 13
Tomocube Launches Ht-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging Tomocube announced the launch of HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging. HT-T1D is optimized for glass-substrate inspection and metrology workflows. When conventional in-line panel inspection tools, such as automated optical inspection (AOI) systems, flag a potential defect, HT-T1D takes the corresponding coordinates and reconstructs the interior of the glass substrate in three dimensions, resolving the location, morphology, and depth-wise characteristics of defects that surface inspection alone cannot reveal. Glass core substrates and glass interposers are drawing growing attention as key enabling materials for AI accelerators, high-bandwidth memory (HBM), and other advanced packaging applications. As these substrates move toward mass production, manufacturers face mounting challenges in identifying the root causes of micro-defects introduced during complex process steps such as laser drilling, etching, metallization, and singulation. A single critical defect can scrap an entire unit. As a result, the ability to quickly turn inspection data into process improvements has become critical to production-line stability. HT-T1D applies Tomocube's visible-light holotomography to visualize the three-dimensional refractive-index distribution inside glass with a refractive-index sensitivity of 10?4. Because the measurement is non-destructive, the same location can be measured repeatedly across successive process stages, allowing users to track when and how a defect forms, propagates, or enlarges. The system is expected to shorten defect-analysis cycles that have traditionally depended on destructive failure analysis, reducing analysis time from days or weeks to minutes in applicable workflows and supporting earlier intervention ahead of high-cost downstream steps. Alongside the hardware, Tomocube also introduced TomoAnalysis MI (TAMI), a dedicated 3D analysis software platform for metrology and inspection. TAMI quantitatively analyzes 3D refractive-index volume data and generates structured reports for engineering review. It also processes data from HT-T1M, Tomocube's planned in-line module for deployment through system integration partners, in the same format — providing a unified workflow from R&D investigation through production-line review. With the launch of HT-T1D, Tomocube will engage glass-substrate manufacturers, advanced-packaging companies, and system integration partners to support 3D defect analysis, process review, and yield-learning workflows for glass-substrate manufacturing. The company will also continue to expand its glass-substrate inspection and metrology portfolio, including future in-line deployment through system integration partners, as it addresses the growing demand for defect-analysis and yield-learning solutions in advanced semiconductor packaging. Announcement • Feb 14
Tomocube, Inc., Annual General Meeting, Mar 30, 2026 Tomocube, Inc., Annual General Meeting, Mar 30, 2026, at 10:00 Tokyo Standard Time. Location: conference room, 1, expo-ro, yuseong-gu, daejeon South Korea 