A061970 Share Price Performance
Recent A061970 News & Updates
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LB Semicon Inc. Key Details
Last Reported Earnings
Mar 31, 2025
Next Reporting Earnings
n/a
- Earnings per share (EPS)
- -421.48
- Gross Margin
- 4.64%
- Net Profit Margin
- -5.13%
- Debt/Equity Ratio
- 117.5%
LB Semicon Inc. Competitors
About A061970
- Founded
- 2000
- Employees
- 1526
- CEO
- WebsiteView website
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
South Korean Market Performance
- 7 Days: 1.5%
- 3 Months: 24.6%
- 1 Year: 13.5%
- Year to Date: 32.5%
The market is up 1.5% over the last week, with the Information Technology sector leading the way, up 5.3%. In the last year, the market has climbed 14%. Earnings are forecast to grow by 21% annually. Market details ›
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