Jiang Su Suyan JingshenLtd Dividend
Dividend criteria checks 4/6
Jiang Su Suyan JingshenLtd is a dividend paying company with a current yield of 3.62% that is well covered by earnings.
Key information
3.6%
Dividend yield
40%
Payout ratio
Industry average yield | 1.8% |
Next dividend pay date | n/a |
Ex dividend date | n/a |
Dividend per share | CN¥0.425 |
Earnings per share | CN¥1.04 |
Dividend yield forecast | n/a |
Recent dividend updates
Recent updates
Jiang Su Suyan JingshenLtd's (SHSE:603299) Profits Appear To Have Quality Issues
Sep 02Return Trends At Jiang Su Suyan JingshenLtd (SHSE:603299) Aren't Appealing
Aug 23It's A Story Of Risk Vs Reward With Jiang Su Suyan Jingshen Co.,Ltd (SHSE:603299)
Jul 01Jiang Su Suyan JingshenLtd's (SHSE:603299) Shareholders Will Receive A Bigger Dividend Than Last Year
Jun 03Slowing Rates Of Return At Jiang Su Suyan JingshenLtd (SHSE:603299) Leave Little Room For Excitement
May 03Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 603299 has been paying a dividend for less than 10 years and during this time payments have been volatile.
Growing Dividend: 603299's dividend payments have increased, but the company has only paid a dividend for 8 years.
Dividend Yield vs Market
Jiang Su Suyan JingshenLtd Dividend Yield vs Market |
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Segment | Dividend Yield |
---|---|
Company (603299) | 3.6% |
Market Bottom 25% (CN) | 0.6% |
Market Top 25% (CN) | 2.2% |
Industry Average (Chemicals) | 1.8% |
Analyst forecast (603299) (up to 3 years) | n/a |
Notable Dividend: 603299's dividend (3.62%) is higher than the bottom 25% of dividend payers in the CN market (0.58%).
High Dividend: 603299's dividend (3.62%) is in the top 25% of dividend payers in the CN market (2.21%)
Earnings Payout to Shareholders
Earnings Coverage: With its reasonably low payout ratio (40.1%), 603299's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its reasonably low cash payout ratio (41.9%), 603299's dividend payments are well covered by cash flows.