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93 Fair Values set on narratives written by author

BE Semiconductor Industries

AN

AnalystConsensusTarget

Consensus Narrative from 21 Analysts

AI Packaging And Hybrid Bonding Will Transform Assembly Market

Key Takeaways Anticipated market growth and advancements in hybrid bonding and advanced packaging for AI applications could drive future revenue and earnings growth. Strategic collaboration with Applied Materials and strong R&D investments may enhance technology confidence and improve gross margins.

€134.45

FV

27.8% undervalued

24.40%

Revenue growth p.a.

0

0

60

2 days ago