Seika Dividend
Dividend criteria checks 4/6
Seika is a dividend paying company with a current yield of 4.42% that is well covered by earnings. Next payment date is on 11th December, 2024 with an ex-dividend date of 27th September, 2024.
Key information
4.4%
Dividend yield
24%
Payout ratio
| Industry average yield | 3.2% |
| Next dividend pay date | 11 Dec 24 |
| Ex dividend date | 27 Sep 24 |
| Dividend per share | JP¥180.000 |
| Earnings per share | JP¥633.33 |
| Dividend yield forecast | n/a |
Stability and Growth of Payments
Fetching dividends data
Stable Dividend: 8061's dividend payments have been volatile in the past 10 years.
Growing Dividend: 8061's dividend payments have increased over the past 10 years.
Dividend Yield vs Market
| Seika Dividend Yield vs Market |
|---|
| Segment | Dividend Yield |
|---|---|
| Company (8061) | 4.4% |
| Market Bottom 25% (JP) | 1.8% |
| Market Top 25% (JP) | 3.7% |
| Industry Average (Trade Distributors) | 3.2% |
| Analyst forecast (8061) (up to 3 years) | n/a |
Notable Dividend: 8061's dividend (4.42%) is higher than the bottom 25% of dividend payers in the JP market (1.8%).
High Dividend: 8061's dividend (4.42%) is in the top 25% of dividend payers in the JP market (3.75%)
Earnings Payout to Shareholders
Earnings Coverage: With its low payout ratio (23.7%), 8061's dividend payments are well covered by earnings.
Cash Payout to Shareholders
Cash Flow Coverage: With its high cash payout ratio (114.3%), 8061's dividend payments are not well covered by cash flows.