EnSilica: Major SpaceTech Contracts Announced 🇺🇸🇬🇧🇪🇺

Multi-chip development contracts with a leading European satellite operator for its next generation satellite network.

The largest long-term potential supply opportunity secured by EnSilica to date.

EnSilica plc (AIM: ENSI, OTC: ENSIF, FSE: F0Z), a leading fabless, micro chipmaker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, announces that it has entered into two landmark development contracts with a leading European satellite operator to develop two chips for its next-generation satellite network (the "Contracts").

 The Contracts span both satellite payload and user terminal silicon and include a combination of Application Specific Integrated Circuit (ASIC) and Application Specific Standard Part (ASSP) solutions.  EnSilica's ability to deliver both ASIC and ASSP solutions across payload and user terminal segments was key for securing the Contracts, demonstrating the capability to be an end-to-end silicon partner for next-generation satellite systems.

Main Highlights:

· Based on just the user terminal elements of the Contracts, this is the largest long-term potential supply opportunity won by EnSilica to date, potentially worth in excess of $50 million from 2030;

· Initial Non-Recurring Engineering ("NRE") revenues from the combined Contracts of $6.8 million commencing in FY 2026 and extending into FY 2028, which is expected to also unlock up to $3 million of additional matched funding from the UK Space Agency;

· Completion of a successful study phase for the satellite payload element of the Contracts has led to funded development activity with future potential supply revenues for that chip yet to be agreed; and

· Winning the Contracts represents a strong position and early involvement, both on the ground and in space, in one of the most important and largest satellite network developments currently happening in the sector. 

The customer is a leading European satellite operator developing a next-generation communications system aimed at enhancing network resilience, flexibility and coverage. The system is intended to support a broad range of applications including commercial, government and defence markets, with initial services targeted towards the end of the decade.

The programme is expected to progress through phased development over the next two and a half years, with initial NRE revenues starting this financial year, followed by long-term semiconductor supply revenues as the network is deployed and scaled.

Ian Lankshear, CEO of EnSilica, commented:  

"The award provides significant industry validation for EnSilica and we are very proud of our technology being selected for this major Space programme following extensive joint study phases. In addition, the scale and structure of the project means that it will generate attractive short term NRE revenues with the potential for substantial long-term supply revenues.

Furthermore, the ASSP elements of the programme demonstrate the strength of our platform strategy, utilising EnSilica's reusable silicon solutions that can be deployed across multiple customers and programmes."